High Reliability SMD Inductor MCNR252012C-R47N Featuring 0.47 Microhenry Inductance and Compact Size

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Price: Negotiable

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Delivery Time: Negotiable

Product Description

Product Overview

The MCNR252012C series is a range of SMD inductors designed for various electronic applications. These inductors offer reliable performance with a focus on precise inductance values and robust construction, suitable for demanding operating environments.

Product Attributes

Brand: DongGuan Ming Yixuan Electronic Technology Co., LTD.
Series: MCNR252012C
Origin: China

Technical Specifications

Part Number	Inductance (uH)	Inductance Tolerance	DC Resistance () Typ.	DC Resistance () Max.	Isat (A) Typ.	Isat (A) Max.	Irms (A) Typ.	Irms (A) Max.
MCNR252012C-R24N	0.24	30%	0.019	0.023	4.80	4.10	4.50	4.10
MCNR252012C-R33N	0.33	30%	0.026	0.031	4.70	4.00	3.70	3.35
MCNR252012C-R47N	0.47	30%	0.031	0.036	4.50	3.80	3.30	3.00
MCNR252012C-R68N	0.68	30%	0.038	0.047	3.30	3.00	2.50	2.30
MCNR252012C-1R0N	1.0	30%	0.050	0.060	2.50	2.25	2.60	2.30
MCNR252012C-1R2N	1.2	30%	0.065	0.078	2.50	2.20	2.20	2.00
MCNR252012C-1R5N	1.5	30%	0.075	0.090	2.35	2.00	2.00	1.80
MCNR252012C-1R8N	1.8	30%	0.093	0.108	2.20	1.95	1.90	1.75
MCNR252012C-2R2M	2.2	20%	0.093	0.108	1.90	1.75	1.90	1.75
MCNR252012C-2R7M	2.7	20%	0.130	0.156	1.60	1.30	1.50	1.40
MCNR252012C-3R3M	3.3	20%	0.130	0.156	1.35	1.20	1.50	1.40
MCNR252012C-4R7M	4.7	20%	0.190	0.228	1.20	1.10	1.20	1.10
MCNR252012C-5R6M	5.6	20%	0.255	0.330	1.10	1.00	1.15	1.00
MCNR252012C-6R8M	6.8	20%	0.300	0.360	1.10	0.90	1.05	0.95
MCNR252012C-100M	10	20%	0.435	0.522	0.85	0.70	0.86	0.78
MCNR252012C-150M	15	20%	0.700	1.000	0.70	0.60	0.60	0.50
MCNR252012C-220M	22	20%	1.000	1.290	0.55	0.45	0.55	0.48
MCNR252012C-470M	47	20%	1.776	2.250	0.37	0.30	0.28	0.20

Dimensions

Shape & Dimension (UNIT:mm):

A	B	C	D	E	F	a	b	c
2.50.3	2.00.3	1.2 Max.	2.00.2	0.75 Typ.	1.0 Typ.	0.8 Typ.	0.9 Typ.	2.2 Typ.

General Specifications

Operating Temperature: -40 to +125 (Including self-generated heat)
Storage Temperature: -40 to +85
Storage Humidity: Max. 70% RH
Recommended Usage Period: Within 12 months from the date of delivery

Soldering Conditions

Re-flow Soldering (Lead Free):

Preheat circuit and products to 150
Peak temperature: 260 (Max)
Reflow times: No more than 2 times
Solder paste thickness: Best 0.08mm, Max 0.1mm

Hand Soldering:

Soldering iron: 20 watt with tip diameter of 1.0mm
Soldering time: Limit to 3 seconds

Packaging Specifications

Tape Dimensions (Unit:mm):

W	A0	B0	K0	D	E	F	P	P0	P2	T
8.0	2.35 0.1	2.65 0.1	1.4 0.1	1.5 0.1	1.75 0.1	3.5 0.1	4.0 0.1	4.0 0.2	2.0 0.1	0.25 0.1

Reel Dimensions (Unit:mm):

Item	Dimension
A	178
B	58
C	13
D	8.5

Packaging Quantity:

Reel: 2000 pcs
Box: 8000 pcs
Carton: 48,000 pcs

Packaging - Cover Tape:

F force: 10130g
Peeling speed: 300mm/min 10%
Peeling angle: 165180

Reliability Tests

No.	Item	Requirements	Test Methods and Remarks
1	High temperature Storage test	1. No significant defects in appearance. 2. L/L 10% 3. DCR/DCR 10%	Temperature: 1255 Time: 962 hours Place samples for one hour at room temperature and test within two hours.
2	Low temperature Storage test	1. No significant defects in appearance. 2. L/L 10% 3. DCR/DCR 10%	Temperature: -405 Time: 962 hours Place samples for one hour at room temperature and test within two hours.
3	Humidity test	1. No significant defects in appearance. 2. L/L 10% 3. DCR/DCR 10%	Temperature: 402, Humidity: 933%RH Time: 962 hours Place samples for one hour at room temperature and test within two hours.
4	Solderability test	Terminals must have 95% minimum solder coverage	1. Dip pads in flux then dip in solder pot at 2455C for 5 seconds. 2. Solder: lead free 3. Flux: rosin flux
5	Heat endurance of flow soldering	1. No significant defects in appearance. 2. L/L 10% 3. DCR/DCR 10%	1. Refer to the reflow curve and go through reflow twice. 2. Peak temperature: 260+0/-5
6	Vibration test	1. No significant defects in appearance. 2. No short and no open.	Apply frequency 10~55~10Hz and amplitude 1.5mm, 1 min/cycle in X, Y, and Z direction for 2 hours each (total 6 hours).
7	Terminal strength push test	Meet the above requirements without any loose terminals.	1. Applied force: 10N, Duration: 10sec 2. Solder paste thickness: 0.12mm Solder test samples to PCB through 245 reflow, apply standard force on the side of test samples for 10 seconds.