SMD Inductor MCNR252012C 3R3M Series with Precise Inductance and Current Handling Capabilities

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Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

The MCNR252012C series is a range of SMD inductors designed for various electronic applications. These inductors offer reliable performance with a focus on specific electrical characteristics and physical dimensions. They are manufactured by DongGuan Ming Yixuan Electronic Technology Co., LTD. and are suitable for use in applications requiring precise inductance values and current handling capabilities.

Product Attributes

Brand: Ming Yixuan
Origin: China
Product Series: MCNR252012C
Edge Type Options: A (12-edge), B (8-edge), C (4-edge)

Technical Specifications

Part Number	Inductance (uH)	Tolerance	DC Resistance () Typ.	DC Resistance () Max.	Isat (A) Typ.	Isat (A) Max.	Irms (A) Typ.	Irms (A) Max.
MCNR252012C-R24N	0.24	30%	0.019	0.023	4.80	4.10	4.50	4.10
MCNR252012C-R33N	0.33	30%	0.026	0.031	4.70	4.00	3.70	3.35
MCNR252012C-R47N	0.47	30%	0.031	0.036	4.50	3.80	3.30	3.00
MCNR252012C-R68N	0.68	30%	0.038	0.047	3.30	3.00	2.50	2.30
MCNR252012C-1R0N	1.0	30%	0.050	0.060	2.50	2.25	2.60	2.30
MCNR252012C-1R2N	1.2	30%	0.065	0.078	2.50	2.20	2.20	2.00
MCNR252012C-1R5N	1.5	30%	0.075	0.090	2.35	2.00	2.00	1.80
MCNR252012C-1R8N	1.8	30%	0.093	0.108	2.20	1.95	1.90	1.75
MCNR252012C-2R2M	2.2	20%	0.093	0.108	1.90	1.75	1.90	1.75
MCNR252012C-2R7M	2.7	20%	0.130	0.156	1.60	1.30	1.50	1.40
MCNR252012C-3R3M	3.3	20%	0.130	0.156	1.35	1.20	1.50	1.40
MCNR252012C-4R7M	4.7	20%	0.190	0.228	1.20	1.10	1.20	1.10
MCNR252012C-5R6M	5.6	20%	0.255	0.330	1.10	1.00	1.15	1.00
MCNR252012C-6R8M	6.8	20%	0.300	0.360	1.10	0.90	1.05	0.95
MCNR252012C-100M	10	20%	0.435	0.522	0.85	0.70	0.86	0.78
MCNR252012C-150M	15	20%	0.700	1.000	0.70	0.60	0.60	0.50
MCNR252012C-220M	22	20%	1.000	1.290	0.55	0.45	0.55	0.48
MCNR252012C-470M	47	20%	1.776	2.250	0.37	0.30	0.28	0.20

Dimensions (Unit: mm)

A	B	C	D	E	F	a	b	c
2.50.3	2.00.3	1.2 Max.	2.00.2	0.75 Typ.	1.0 Typ.	0.8 Typ.	0.9 Typ.	2.2 Typ.

General Specifications

Operating Temperature: -40 to +125 (Including self-generated heat)
Storage Temperature: -40 to +85
Storage Humidity: Max. 70% RH
Recommended usage within 12 months from date of delivery.
Part temperature (ambient + temp rise) should not exceed 125 C under worst-case operating conditions. Verification in end application is required.

Soldering Conditions

Re-flow Soldering (Lead Free): Preheat to 150, peak temperature 260 (Max tip temperature), Reflow times: no more than 2 times. Solder paste thickness: 0.08mm (best), 0.1mm (max).
Hand Soldering: Use a 20 watt soldering iron with a 1.0mm tip diameter. Limit soldering time to 3 seconds.

Packaging Specifications

Tape Dimensions (Unit: mm)

W	A0	B0	K0	D	E	F	P	P0	P2	T
8.0	2.35 0.1	2.65 0.1	1.4 0.1	1.5 0.1	1.75 0.1	3.5 0.1	4.0 0.1	4.0 0.2	2.0 0.1	0.25 0.1

Reel Dimensions (Unit: mm)

Item	Dimension
A	178
B	58
C	13
D	8.5
a	Blank portions
b	Chip cavity
c	Leader

Packaging Quantity

Reel (pcs)	Box (pcs)	Carton (pcs)
2000	8000	48,000

Packaging - Cover Tape

F force: 10130g
Peeling speed: 300mm/min10%
Peeling angle: 165180

Reliability Tests

No.	Item	Requirements	Test Methods and Remarks
1	High temperature Storage test	1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10%	Temperature: 1255, Time: 962 hours. Place samples for one hour at room temperature and test within two hours.
2	Low temperature Storage test	1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10%	Temperature: -405, Time: 962 hours. Place samples for one hour at room temperature and test within two hours.
3	Humidity test	1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10%	Temperature: 402, Humidity: 933%RH, Time: 962 hours. Place samples for one hour at room temperature and test within two hours.
4	Solderability test	Terminals must have 95% minimum solder coverage	Dip pads in flux then dip in solder pot at 2455C for 5 seconds. Solder: lead free. Flux: rosin flux.
5	Heat endurance of flow soldering	1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10%	Refer to reflow curve, peak temperature: 260+0/-5. Tested twice.
6	Vibration test	1. No significant defects in appearance. 2. No short and no open.	Apply frequency 10~55~10Hz and amplitude 1.5mm, 1 min/cycle in X, Y, and Z directions for 2 hours each (total 6 hours).
7	Terminal strength push test	Meet the above requirements without any loose terminals.	Applied force: 10N, Duration: 10 sec. Solder samples to PCB through 245 reflow, apply force on the side of test samples.