Electronic Component MCNR252010C-1R5N SMD Inductor with Specified DC Resistance and Current Ratings
Product Overview
The MCNR252010C series is a range of SMD inductors manufactured by DongGuan Ming Yixuan Electronic Technology Co., LTD. These inductors are designed for various electronic applications, offering a range of inductance values with specified DC resistance, saturation current (Isat), and RMS current (Irms). They are suitable for operation in temperatures from -40 to +125 and are available in standard packaging for industrial use.
Product Attributes
- Brand: Ming Yixuan
- Product Type: SMD Inductor
- Series: MCNR252010C
- Origin: DongGuan, China
- Manufacturer: DongGuan Ming Yixuan Electronic Technology Co., LTD.
Technical Specifications
Dimensions
Unit: mm
| Dimension | Value |
|---|---|
| A | 2.5 0.3 |
| B | 2.0 0.3 |
| C | 1.0 Max. |
| D | 2.0 0.2 |
| E | 0.75 Typ. |
| F | 1.0 Typ. |
| a | 0.8 Typ. |
| b | 0.9 Typ. |
| c | 2.2 Typ. |
Part Numbering System
MCNR 252010 C - [Inductance Value] [Tolerance]
- Product Symbol: MCNR
- Dimensions: 252010
- Edge type: C = 4
- Inductance Value: e.g., R24 (0.24uH), 1R0 (1.0uH), 100 (10uH)
- Tolerance: K (10%), M (20%), N (30%)
Electrical Characteristics
| No. | Part Number | Inductance (uH) | DC Resistance () Max. | DC Resistance () Typ. | Isat(A) Max. | Isat(A) Typ. | Irms(A) Max. | Irms(A) Typ. |
|---|---|---|---|---|---|---|---|---|
| 1 | MCNR252010C-R24N | 0.24 30% | 0.034 | 0.026 | 3.60 | 4.40 | 2.75 | 3.00 |
| 2 | MCNR252010C-R33N | 0.33 30% | 0.040 | 0.033 | 3.60 | 4.30 | 2.45 | 2.70 |
| 3 | MCNR252010C-R47N | 0.47 30% | 0.044 | 0.035 | 2.80 | 3.20 | 2.40 | 2.60 |
| 4 | MCNR252010C-R68N | 0.68 30% | 0.062 | 0.051 | 2.75 | 3.10 | 2.10 | 2.35 |
| 5 | MCNR252010C-1R0N | 1.0 30% | 0.080 | 0.066 | 2.05 | 2.50 | 1.85 | 2.05 |
| 6 | MCNR252010C-1R5N | 1.5 30% | 0.108 | 0.085 | 1.70 | 2.05 | 1.55 | 1.70 |
| 7 | MCNR252010C-2R2M | 2.2 20% | 0.150 | 0.132 | 1.50 | 1.75 | 1.35 | 1.50 |
| 8 | MCNR252010C-3R3M | 3.3 20% | 0.228 | 0.173 | 1.10 | 1.35 | 1.05 | 1.20 |
| 9 | MCNR252010C-4R7M | 4.7 20% | 0.330 | 0.248 | 1.00 | 1.15 | 0.90 | 1.00 |
| 10 | MCNR252010C-5R6M | 5.6 20% | 0.480 | 0.310 | 0.90 | 1.05 | 0.80 | 0.90 |
| 11 | MCNR252010C-6R8M | 6.8 20% | 0.480 | 0.438 | 0.80 | 0.95 | 0.72 | 0.80 |
| 12 | MCNR252010C-8R2M | 8.2 20% | 0.572 | 0.440 | 0.73 | 0.85 | 0.69 | 0.78 |
| 13 | MCNR252010C-100M | 10 20% | 0.600 | 0.500 | 0.65 | 0.75 | 0.65 | 0.75 |
| 14 | MCNR252010C-120M | 12 20% | 0.850 | 0.700 | 0.58 | 0.62 | 0.58 | 0.62 |
| 15 | MCNR252010C-150M | 15 20% | 1.050 | 0.710 | 0.50 | 0.55 | 0.45 | 0.50 |
| 16 | MCNR252010C-220M | 22 20% | 1.344 | 1.233 | 0.40 | 0.45 | 0.32 | 0.38 |
Test Conditions: All test data is referenced to 25 ambient.
Isat: DC current at which inductance drops approximately 30% from its value without current.
Irms: DC current that causes the temperature rise (T 40) from 25 ambient.
General Specifications
- Operating Temperature: -40 ~ +125 (Including self-generated heat)
- Storage Temperature: -40 ~ +85
- Storage Humidity: 70% Max. R.H.
- Recommended Usage: Within 12 months from the date of delivery.
- Part Temperature Limit: Should not exceed 125 C under worst-case operating conditions (ambient + temp rise). Verification in end application is recommended.
Soldering Conditions
Re-flow Soldering (Lead Free):
- Preheat circuit and products to 150.
- Peak temperature: 260 tip temperature (Max).
- Reflow times: no more than 2 times.
- Solder paste thickness: 0.08mm (best), 0.1mm (max).
Hand Soldering:
- Use a 20 watt soldering iron with tip diameter of 1.0mm.
- Limit soldering time to 3 sec.
Package Specification
Tape Dimensions (Unit: mm):
| W | A0 | B0 | K0 | D | E | F | P | P0 | P2 | T |
|---|---|---|---|---|---|---|---|---|---|---|
| 8.0 0.3 | 2.35 0.2 | 2.65 0.1 | 1.4 0.1 | 1.5 +0.1/-0.1 | 1.75 0.1 | 3.5 0.1 | 4.0 0.1 | 4.0 0.1 | 2.0 0.2 | 0.25 0.1 |
Reel Dimensions (Unit: mm):
| Item | Dimension |
|---|---|
| A | 178 |
| B | 58 |
| C | 13 |
| D | 8.5 |
Packaging Quantity:
- Reel: 2000 pcs
- Box: 8000 pcs
- Carton: 48,000 pcs
Packaging - Cover Tape:
- F force: 10130g
- Peeling speed: 300mm/min 10%
- Peeling angle: 165180
Reliability Tests
| No. | Item | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | High temperature Storage test | 1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10% | Temperature: 1255 Time: 962 hours Test within 2 hours after 1 hour at room temperature. |
| 2 | Low temperature Storage test | 1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10% | Temperature: -405 Time: 962 hours Test within 2 hours after 1 hour at room temperature. |
| 3 | Humidity test | 1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10% | Temperature: 402, Humidity: 933%RH Time: 962 hours Test within 2 hours after 1 hour at room temperature. |
| 4 | Solderability test | Terminals must have 95% minimum solder coverage | Dip pads in flux then dip in solder pot at 2455C for 5 seconds. Solder: lead free Flux: rosin flux |
| 5 | Heat endurance of flow soldering | 1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10% | Refer to reflow curve, through reflow twice. Peak temperature: 260+0/-5 |
| 6 | Vibration test | 1. No significant defects in appearance. 2. No short and no open. | Frequency 10~55~10Hz, amplitude 1.5mm, 1 min/cycle in X, Y, Z directions for 2 hours each (total 6 hours). |
| 7 | Terminal strength push test | 1. Applied force: 10N Duration: 10sec 2. Meet the above requirements without any loose terminals. | Solder samples to PCB through 245 reflow, apply force on the side of test samples for 10 seconds. |
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