MYX MCNR252012C 6R8M SMD Inductor Suitable for Circuits Operating from Negative 40 to 125 Degrees

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

The MCNR252012C series is a range of SMD inductors designed for various electronic applications. These inductors offer reliable performance with precise inductance values and controlled DC resistance. They are suitable for use in circuits requiring stable magnetic components, operating within a wide temperature range of -40 to +125.

Product Attributes

Brand: Ming Yixuan Electronic Technology Co., LTD. ()
Series: MCNR252012C
Origin: Dongguan, China
Edge Type Options: A (12-edge), B (8-edge), C (4-edge)

Technical Specifications

Dimensions

Unit: mm

Dimension	A	B	C (Max.)	D	E (Typ.)	F (Typ.)	a (Typ.)	b (Typ.)	c (Typ.)
Size	2.50.3	2.00.3	1.2	2.00.2	0.75	1.0	0.8	0.9	2.2

Electrical Characteristics

No.	Part Number	Inductance (uH)	DC Resistance () Typ.	DC Resistance () Max.	Isat (A) Typ.	Isat (A) Max.	Irms (A) Typ.	Irms (A) Max.
1	MCNR252012C-R24N	0.2430%	0.019	0.023	4.80	4.10	4.50	4.10
2	MCNR252012C-R33N	0.3330%	0.026	0.031	4.70	4.00	3.70	3.35
3	MCNR252012C-R47N	0.4730%	0.031	0.036	4.50	3.80	3.30	3.00
4	MCNR252012C-R68N	0.6830%	0.038	0.047	3.30	3.00	2.50	2.30
5	MCNR252012C-1R0N	1.030%	0.050	0.060	2.50	2.25	2.60	2.30
6	MCNR252012C-1R2N	1.230%	0.065	0.078	2.50	2.20	2.20	2.00
7	MCNR252012C-1R5N	1.530%	0.075	0.090	2.35	2.00	2.00	1.80
8	MCNR252012C-1R8N	1.830%	0.093	0.108	2.20	1.95	1.90	1.75
9	MCNR252012C-2R2M	2.220%	0.093	0.108	1.90	1.75	1.90	1.75
10	MCNR252012C-2R7M	2.720%	0.130	0.156	1.60	1.30	1.50	1.40
11	MCNR252012C-3R3M	3.320%	0.130	0.156	1.35	1.20	1.50	1.40
12	MCNR252012C-4R7M	4.720%	0.190	0.228	1.20	1.10	1.20	1.10
13	MCNR252012C-5R6M	5.620%	0.255	0.330	1.10	1.00	1.15	1.00
14	MCNR252012C-6R8M	6.820%	0.300	0.360	1.10	0.90	1.05	0.95
15	MCNR252012C-100M	1020%	0.435	0.522	0.85	0.70	0.86	0.78
16	MCNR252012C-150M	1520%	0.700	1.000	0.70	0.60	0.60	0.50
17	MCNR252012C-220M	2220%	1.000	1.290	0.55	0.45	0.55	0.48
18	MCNR252012C-470M	4720%	1.776	2.250	0.37	0.30	0.28	0.20

Test Remarks:

All test data is referenced to 25 ambient.
Isat: DC current at which inductance drops approximate 30% from its value without current.
Irms: DC current that causes the temperature rise (T 40) from 25 ambient.

General Specifications

Operating Temperature: -40 ~ +125 (Including self-generated heat)
Storage Temperature: -40 ~ +85, R.H.: 70% Max.
Recommended Usage: Within 12 months from the date of delivery.
Part Temperature Limit: Should not exceed 125 under worst-case operating conditions (ambient + temperature rise). Verification in the end application is required.

Soldering Conditions

Re-flow Soldering (Lead Free)

Preheat: 150
Peak Temperature: 260 (Max)
Reflow Times: No more than 2 times
Solder Paste Thickness: Recommended 0.08mm, Max 0.1mm

Hand Soldering

Soldering Iron: 20 watt with 1.0mm tip diameter
Soldering Time: Limit to 3 seconds

Package Specification

Tape Dimensions (Unit: mm)

W	A0	B0	K0	D	E	F	P	P0	P2	T
8.0	2.35 0.1	2.65 0.1	1.4 0.1	1.5 0.1	1.75 0.1	3.5 0.1	4.0 0.1	4.0 0.2	2.0 0.1	0.25 0.1

Reel Dimensions (Unit: mm)

Item	Dimension A	Dimension B	Dimension C	Dimension D
Value	178	58	13	8.5

Packaging Quantity

Reel (pcs)	Box (pcs)	Carton (pcs)
2000	8000	48,000

Packaging - Cover Tape

F force: 10130g
Peeling speed: 300mm/min10%
Peeling angle: 165180

Reliability Tests

No.	Item	Requirements	Test Methods and Remarks
1	High temperature Storage test	1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10%	Temperature: 1255, Time: 962 hours. Place samples for one hour at room temperature and test within two hours.
2	Low temperature Storage test	1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10%	Temperature: -405, Time: 962 hours. Place samples for one hour at room temperature and test within two hours.
3	Humidity test	1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10%	Temperature: 402, Humidity: 933%RH, Time: 962 hours. Place samples for one hour at room temperature and test within two hours.
4	Solderability test	Terminals must have 95% minimum solder coverage.	Dip pads in flux then dip in solder pot at 2455C for 5 seconds. Solder: lead free, Flux: rosin flux.
5	Heat endurance of flow soldering	1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10%	Refer to reflow curve, undergo reflow twice. Peak temperature: 260+0/-5.
6	Vibration test	1. No significant defects in appearance. 2. No short and no open.	Apply frequency 10~55~10Hz and amplitude 1.5mm, 1 min/cycle in X, Y, and Z directions for 2 hours each (total 6 hours).
7	Terminal strength push test	Meet the above requirements without any loose terminals.	Applied force: 10N, Duration: 10 seconds. Solder test samples to PCB through 245 reflow, apply standard force on the side of test samples for 10 seconds.