High reliability smd inductor mcNR252012C-R68N with 2.5 by 2.0 by 1.2 millimeter compact form factor

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

The MCNR252012C series is a range of SMD inductors designed for various electronic applications. These inductors offer a compact form factor with dimensions of 2.5x2.0x1.2mm, making them suitable for space-constrained designs. They are manufactured by DongGuan Ming Yixuan Electronic Technology Co., LTD. and are available in a range of inductance values with specified tolerances.

Product Attributes

Brand: Ming Yixuan
Origin: China
Product Type: SMD Inductor
Series: MCNR252012C

Technical Specifications

Dimensions:

Dimension	Size (mm)
A	2.5 0.3
B	2.0 0.3
C	1.2 Max.
D	2.0 0.2
E	0.75 Typ.
F	1.0 Typ.
a	0.8 Typ.
b	0.9 Typ.
c	2.2 Typ.

Part Numbering System: MCNR 252012 C - [Inductance Value] [Tolerance]

Product Symbol: MCNR
Dimensions: 252012
Edge type: A=12 edge; B=8 edge; C=4 edge
Inductance Value: e.g., R24 (0.24uH), 1R0 (1.0uH), 100 (10uH)
Tolerance: K=10%; M=20%; N=30%

Electrical Characteristics:

Part Number	Inductance (uH)	DC Resistance () Typ.	DC Resistance () Max.	Isat (A) Typ.	Isat (A) Max.	Irms (A) Typ.	Irms (A) Max.
MCNR252012C-R24N	0.24 30%	0.019	0.023	4.80	4.10	4.50	4.10
MCNR252012C-R33N	0.33 30%	0.026	0.031	4.70	4.00	3.70	3.35
MCNR252012C-R47N	0.47 30%	0.031	0.036	4.50	3.80	3.30	3.00
MCNR252012C-R68N	0.68 30%	0.038	0.047	3.30	3.00	2.50	2.30
MCNR252012C-1R0N	1.0 30%	0.050	0.060	2.50	2.25	2.60	2.30
MCNR252012C-1R2N	1.2 30%	0.065	0.078	2.50	2.20	2.20	2.00
MCNR252012C-1R5N	1.5 30%	0.075	0.090	2.35	2.00	2.00	1.80
MCNR252012C-1R8N	1.8 30%	0.093	0.108	2.20	1.95	1.90	1.75
MCNR252012C-2R2M	2.2 20%	0.093	0.108	1.90	1.75	1.90	1.75
MCNR252012C-2R7M	2.7 20%	0.130	0.156	1.60	1.30	1.50	1.40
MCNR252012C-3R3M	3.3 20%	0.130	0.156	1.35	1.20	1.50	1.40
MCNR252012C-4R7M	4.7 20%	0.190	0.228	1.20	1.10	1.20	1.10
MCNR252012C-5R6M	5.6 20%	0.255	0.330	1.10	1.00	1.15	1.00
MCNR252012C-6R8M	6.8 20%	0.300	0.360	1.10	0.90	1.05	0.95
MCNR252012C-100M	10 20%	0.435	0.522	0.85	0.70	0.86	0.78
MCNR252012C-150M	15 20%	0.700	1.000	0.70	0.60	0.60	0.50
MCNR252012C-220M	22 20%	1.000	1.290	0.55	0.45	0.55	0.48
MCNR252012C-470M	47 20%	1.776	2.250	0.37	0.30	0.28	0.20

Test Conditions: 100KHz / 1.0V

Test Remarks:

All test data is referenced to 25 ambient.
Isat: DC current at which inductance drops approximately 30% from its value without current.
Irms: DC current that causes the temperature rise (T 40) from 25 ambient.

General Specifications:

Operating Temperature: -40 to +125 (Including self-generated heat)
Storage Temperature: -40 to +85, R.H.: 70% Max.
Recommended Usage: Within 12 months from the date of delivery.
Part Temperature Limit: Should not exceed 125 C under worst-case operating conditions (ambient + temperature rise). Verification in end application is required.

Soldering Conditions:

Re-flow Soldering (Lead Free): Preheat to 150, Peak temperature 260 (Max). Reflow times: no more than 2 times. Solder paste thickness: 0.08mm (best), 0.1mm (max).
Hand Soldering: Use a 20-watt soldering iron with a tip diameter of 1.0mm. Limit soldering time to 3 seconds.

Package Specification:

Tape Dimensions (mm)	W	A0	B0	K0	D	E	F	P	P0	P2	T
Value	8.0	2.35 0.1	2.65 0.1	1.4 0.1	1.5 0.1	1.75 0.1	3.5 0.1	4.0 0.1	4.0 0.2	2.0 0.1	0.25 0.1

Reel Dimensions (mm)	A	B	C	D
Value	178	58	13	8.5

Packaging Quantity:

Reel: 2000 pcs
Box: 8000 pcs
Carton: 48,000 pcs

Packaging - Cover Tape:

F force: 10130g
Peeling speed: 300mm/min 10%
Peeling angle: 165180

Reliability Tests:

No.	Item	Requirements	Test Methods and Remarks
1	High temperature Storage test	1. No significant defects in appearance. 2. L/L 10% 3. DCR/DCR 10%	Temperature: 125 5. Time: 96 2 hours. Samples tested within two hours after one hour at room temperature.
2	Low temperature Storage test	1. No significant defects in appearance. 2. L/L 10% 3. DCR/DCR 10%	Temperature: -40 5. Time: 96 2 hours. Samples tested within two hours after one hour at room temperature.
3	Humidity test	1. No significant defects in appearance. 2. L/L 10% 3. DCR/DCR 10%	Temperature: 40 2, Humidity: 93 3%RH. Time: 96 2 hours. Samples tested within two hours after one hour at room temperature.
4	Solderability test	Terminals must have 95% minimum solder coverage.	Dip pads in flux then dip in solder pot at 245 5 for 5 seconds. Solder: lead free. Flux: rosin flux.
5	Heat endurance of flow soldering	1. No significant defects in appearance. 2. L/L 10% 3. DCR/DCR 10%	Refer to reflow curve, through reflow twice. Peak temperature: 260+0/-5.
6	Vibration test	1. No significant defects in appearance. 2. No short and no open.	Apply frequency 10~55~10Hz and amplitude 1.5mm, 1 min/cycle in X, Y, and Z directions for 2 hours each (total 6 hours).
7	Terminal strength push test	Meet the above requirements without any loose terminals.	Applied force: 10N. Duration: 10 sec. Solder paste thickness: 0.12mm. Solder test samples to PCB through 245 reflow, apply standard force on the side for 10 seconds.