MYX MCNR252010C 220M Electronic SMD Inductor Series Designed for Circuit Reliability and Performance

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Product Description

Product Overview

The MCNR252010C series is a range of SMD inductors designed for various electronic applications. These components offer reliable performance with options for different inductance values and tolerances. They are suitable for use in circuits where precise inductance and current handling are required. The series is manufactured by DongGuan Ming Yixuan Electronic Technology Co., LTD.

Product Attributes

Brand: Ming Yixuan ()
Origin: China
Product Line: MCNR252010C Series
Type: SMD Inductor

Technical Specifications

Shape & Dimension (Unit: mm)		A	B	C	D	E	F	a	b	c
Dimensions		2.50.3	2.00.3	1.0 Max.	2.00.2	0.75 Typ.	1.0 Typ.	0.8 Typ.	0.9 Typ.	2.2 Typ.

No.	Part Number	Inductance (uH)	DC Resistance () Max.	DC Resistance () Typ.	Isat (A) Max.	Isat (A) Typ.	Irms (A) Max.	Irms (A) Typ.	Marking
1	MCNR252010C-R24N	0.2430%	0.034	0.026	3.60	4.40	2.75	3.00	N/A
2	MCNR252010C-R33N	0.3330%	0.040	0.033	3.60	4.30	2.45	2.70	N/A
3	MCNR252010C-R47N	0.4730%	0.044	0.035	2.80	3.20	2.40	2.60	N/A
4	MCNR252010C-R68N	0.6830%	0.062	0.051	2.75	3.10	2.10	2.35	N/A
5	MCNR252010C-1R0N	1.030%	0.080	0.066	2.05	2.50	1.85	2.05	N/A
6	MCNR252010C-1R5N	1.530%	0.108	0.085	1.70	2.05	1.55	1.70	N/A
7	MCNR252010C-2R2M	2.220%	0.150	0.132	1.50	1.75	1.35	1.50	N/A
8	MCNR252010C-3R3M	3.320%	0.228	0.173	1.10	1.35	1.05	1.20	N/A
9	MCNR252010C-4R7M	4.720%	0.330	0.248	1.00	1.15	0.90	1.00	N/A
10	MCNR252010C-5R6M	5.620%	0.480	0.310	0.90	1.05	0.80	0.90	N/A
11	MCNR252010C-6R8M	6.820%	0.480	0.438	0.80	0.95	0.72	0.80	N/A
12	MCNR252010C-8R2M	8.220%	0.572	0.440	0.73	0.85	0.69	0.78	N/A
13	MCNR252010C-100M	1020%	0.600	0.500	0.65	0.75	0.65	0.75	N/A
14	MCNR252010C-120M	1220%	0.850	0.700	0.58	0.62	0.58	0.62	N/A
15	MCNR252010C-150M	1520%	1.050	0.710	0.50	0.55	0.45	0.50	N/A
16	MCNR252010C-220M	2220%	1.344	1.233	0.40	0.45	0.32	0.38	N/A

General Specification
Operating Temperature	-40 ~ +125 (Including self-generated heat)
Storage Temperature	-40 ~ +85 R.H.: 70% Max.

Soldering Conditions - Re-flow Soldering (Lead Free)
Preheat	150
Peak Temperature	260 (Max)
Reflow Times	No more than 2 times
Solder Paste Thickness	0.08mm (Best), 0.1mm (Max)

Soldering Conditions - Hand Soldering
Soldering Iron	20 watt with tip diameter of 1.0mm
Soldering Time	Limit to 3 sec.

Package Specification - Tape Dimensions (Unit: mm)		W	A0	B0	K0	D	E	F	P	P0	P2	T
Dimensions		8.0 0.3	2.35 0.2	2.65 0.1	1.4 0.1	1.5 +0.1/-0.1	1.75 0.1	3.5 0.1	4.0 0.1	4.0 0.2	2.0 0.1	0.25 0.1

Package Specification - Reel Dimensions (Unit: mm)		A	B	C	D
Dimensions		178	58	13	8.5

Packaging Quantity	Reel (pcs)	Box (pcs)	Carton (pcs)
Quantity	2000	8000	48,000

Packaging - Cover Tape
F force	10130g
Peeling speed	300mm/min10%
Peeling angle	165180

No.	Item	Requirements	Test Methods and Remarks
1	High temperature Storage test	1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10%	Temperature: 1255 Time : 962 hours Place the samples for one hour at room temperature and test them within two hours
2	Low temperature Storage test	1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10%	Temperature: -405 Time : 962 hours Place the samples for one hour at room temperature and test them within two hours.
3	Humidity test	1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10%	Temperature: 402 , Humidity: 933%RH Time : 962 hours Place the samples for one hour at room temperature and test them within two hours
4	Solderability test	Terminals must have 95% minimum solder coverage	1.Dip pads in flux then dip in solder pot at 2455C for 5 second. 2.Solder: lead free 3.Flux: rosin flux
5	Heat endurance of flow soldering	1. No significant defects in appearance. 2. L/L10% 3. DCR/DCR10%	1.Refer to the above reflow curve and go through the reflow for twice. 2.The peak temperature : 260+0/-5
6	Vibration test	1.No significant defects in appearance. 2.No short and no open.	Apply frequency 10~55~10Hz and amplitude 1.5mm, 1 min/cycle in X Y and Z direction for 2 hours each. (total 6 hours)
7	Terminal strength push test	1. Applied force:10N Duration: 10sec 2.Solder paste thickness:0.12mm 3.Meet the above requirements without any loose terminals	Solder the test samples to the PCB through 245 reflow, apply a standard force on the side of the test samples for 10 seconds.