1210 Package Wire Wound Chip Inductor MYX MWI1210IF680KST-HF Lead Free Halogen Free Component

Product Overview

The MWI1210IF series is a range of wire-wound chip inductors manufactured by DongGuan Ming Yixuan Electronic Technology Co., LTD. These components are designed for various electronic applications, offering reliable performance with a focus on environmental compliance (Lead Free and Halogen Free options). They are available in a standard 1210 package size and come in tape and reel packaging for automated assembly.

Product Attributes

• Brand: Ming Yixuan
• Origin: Dongguan, China
• Product Type: Wire Wound Chip Inductor
• Series: MWI1210IF
• Environmental Compliance: LF (Lead Free), HF (Halogen Free)
• Terminal Material: S (Tin Terminal)
• Packaging: T (Tape & Reel), B (Bulk)

Technical Specifications

1. Shape & Dimension (Unit: mm)

2. Schematic

(Schematic diagram not provided in text)

3. Part Numbering System

MWI 1210 IF R56 K S T - HF

• 1. PRODUCT SYMBOL: MWI
• 2. DIMENSIONS: 1210
• 3. MATERIAL: IF
• 4. INDUCTANCE: R56 (0.56H)
• 5. TOLERANCE: K (10%) (J: 5%; K: 10%; M: 20%)
• 6. TERMINAL: S (Tin Terminal)
• 7. PACKAGING: T (Tape & Reel) (T: Tape & Reel; B: Bulk)
• 8. E.P. (Environmental Protection): HF (Halogen Free) (LF: Lead Free; HF: Halogen Free; FP: Red Phosphor Free)

4. Electrical Characteristics

: Indicates product tolerance

Test Remarks:

• All test data is referenced to 25 ambient.
• Irms: DC current that causes the temperature rise (T 40 ) from 25 ambient.

5. General Specification

• Operating Temperature: -40 ~ +85 (Including self-generated heat)
• Storage Temperature: -10 ~ +40 R.H.: 60% Max.
• Moisture Sensitivity Level (MSL): 1
• Recommended products should be used within 12 months from the date of delivery.
• The part temperature (ambient + temp rise) should not exceed 85 C under worst-case operating conditions. Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

6. Soldering Conditions

Figure 1. Re-flow Soldering (Lead Free)

• Preheat circuit and products to 150.
• 260 tip temperature (Max).
• Reflow times: no more than 2 times.
• Solder paste thickness: the best 0.08mm is, but max is 0.1mm.

Figure 2. Hand Soldering

• Use a 20 watt soldering iron with tip diameter of 1.0mm.
• Limit soldering time to 3 sec.

7. Packaging (Unit: mm)

Packaging Quantity: 2000Pcs/Reel

8. Package Specifications

Inside Box And Outside Carton

• Reel Quantity: 2000PCS per reel
• Inner Box Packaging Quantity: 4 reels per box, total 8000 PCS
• Outer Carton Packaging Quantity: Small box 6 boxes, total 48000 PCS; Medium box 8 boxes, total 64000 PCS; Large box 10 boxes, total 80000 PCS
• Inner Box Dimensions: 20.3*19.3*5.5cm
• Outer Carton Dimensions: Small box, 40.6*23*19.7cm; Medium box, 41*22*26cm; Large box, 41*22*33cm