Halogen free wire wound chip inductor MYX MWI1008UC3R3JST-HF ideal for diverse electronic applications

Product Overview

The MWI1008UC series is a line of wire-wound chip inductors designed for various electronic applications. These components offer a range of inductance values and are manufactured by DongGuan Ming Yixuan Electronic Technology Co., LTD. They are characterized by their compact size, suitable for surface mounting, and are available with different terminal materials and packaging options to meet diverse manufacturing needs. The series is designed for operation within a wide temperature range and adheres to environmental standards.

Product Attributes

• Brand: Ming Yixuan
• Origin: Dongguan, China
• Product Type: Wire Wound Chip Inductor
• Series: MWI1008UC
• Environmental Compliance: Halogen Free (HF), Lead Free (LF), Red Phosphor Free (FP)
• Certifications: Not explicitly stated, but adheres to environmental standards.

Technical Specifications

Shape & Dimension (Unit: mm)

L: 2.92 Max.
W: 2.70 Max.
T: 2.23 Max.
E: 1.02 Typ.
F: 2.54 Typ.
D: 1.27 Typ.

Part Numbering System

MWI 1008 UC [Inductance] [Tolerance] [Terminal] [Packaging] - [E.P.]

• 1. Product Symbol: MWI
• 2. Dimensions: 1008
• 3. Material/Chip Type: UC
• 4. Inductance: Specified in nH or R (e.g., 4.7, 10, 100, 1R0)
• 5. Tolerance: G (2%), J (5%), K (10%), M (20%)
• 6. Terminal: G (Gold), S (Tin)
• 7. Packaging: T (Tape & Reel), B (Bulk)
• 8. E.P. (Environmental Protection): LF (Lead Free), HF (Halogen Free), FP (Red Phosphor Free)

Electrical Characteristics

: Represents product tolerance.

Test Remarks

1. All test data is referenced to 25 ambient.
2. Irms: DC current that causes the temperature rise (T 40) from 25 ambient.

General Specifications

1. Operating Temperature: -40 ~ +125 (Including self-generated heat).
2. Storage Temperature: -10 ~ +40 R.H.: 60% Max.
3. Moisture Sensitivity Level (MSL): 1
4. Recommended Usage: Products should be used within 12 months from the date of delivery.
5. Part Temperature Limit: The part temperature (ambient + temp rise) should not exceed 125 C under worst-case operating conditions. Verification in the end application is required.

Soldering Conditions

Re-flow Soldering (Lead Free)

• Preheat circuit and products to 150.
• 260 tip temperature (Max).
• Reflow times: no more than 2 times.
• Solder paste thickness: optimal 0.08mm, maximum 0.1mm.

Hand Soldering

• Use a 20 watt soldering iron with a tip diameter of 1.0mm.
• Limit soldering time to 3 seconds.

Packaging (unit: mm)

Tape 1008

Packaging Quantity: 2000 Pcs/Reel

Package Specifications

Inside Box And Outside Carton

• Per Reel: 2000 PCS
• Inner Box: 4 reels per box, total 8000 PCS
• Outer Carton (Small): 6 inner boxes, total 48000 PCS
• Outer Carton (Medium): 8 inner boxes, total 64000 PCS
• Outer Carton (Large): 10 inner boxes, total 80000 PCS

Inner Box Dimensions: 20.3*19.3*5.5cm

Outer Carton Dimensions:
Small: 40.6*23*19.7cm
Medium: 41*22*26cm
Large: 41*22*33cm