Wire Wound Chip Inductor MWI0805QD1R0MST-HF Designed for Operating Temperatures from Minus 40 to 85

Product Overview

The MWI0805QD series wire wound chip inductors are designed for various electronic applications. These inductors offer reliable performance with a focus on specific electrical characteristics such as inductance, Q factor, SRF, DC resistance, saturation current (Isat), and RMS current (Irms). They are suitable for use in environments with operating temperatures ranging from -40 to +85 and are available in different packaging options for convenience.

Product Attributes

• Brand: Ming Yixuan ()
• Origin: Dongguan, China
• Product Line: MWI0805QD Series
• Type: Wire Wound Chip Inductor
• Environmental Compliance: Lead Free (LF), Halogen Free (HF), Red Phosphor Free (FP)
• Moisture Sensitivity Level (MSL): 1
• Recommended Usage Period: Within 12 months from the date of delivery

Technical Specifications

1. Shape & Dimension (Unit: mm)

2. Part Numbering System

MWI 0805 QD [Inductance] [Tolerance] [Terminal] [Packaging] [E.P.]

• 1. PRODUCT SYMBOL: MWI
• 2. DIMENSIONS: 0805
• 3. MATERIAL: QD (Chip Type)
• 4. INDUCTANCE: e.g., 1R0 (1.0uH), 1R5 (1.5uH), 2R2 (2.2uH), 100 (10uH)
• 5. TOLERANCE: K (10%), M (20%)
• 6. TERMINAL: S (Tin Terminal)
• 7. PACKAGING: T (Tape & Reel), B (Bulk)
• 8. E.P. (Environmental Protection): LF (Lead Free), HF (Halogen Free), FP (Red Phosphor Free)

3. Electrical Characteristics

Product Tolerance: K 10%; M 20%

Test Remarks:

• (1). All test data is referenced to 25 ambient.
• (2). Isat: DC current at which inductance drops approximate 30% from its value without current.
• (3). Irms: DC current that causes the temperature rise (T 40 ) from 25 ambient.

4. General Specification

• Operating Temperature: -40 ~ +85 (Including self-generated heat)
• Storage Temperature: -10 ~ +40, R.H.: 60% Max.
• Recommended Usage Period: Within 12 months from the date of delivery
• Part Temperature Limit: The part temperature (ambient + temp rise) should not exceed 85 C under worst-case operating conditions. Verification in the end application is required.

5. Soldering Conditions

• Re-flow Soldering (Lead Free): Preheat to 150, Max tip temperature 260. Reflow times: no more than 2 times. Solder paste thickness: 0.08mm recommended, 0.1mm max.
• Hand Soldering: Use a 20-watt soldering iron with a 1.0mm tip diameter. Limit soldering time to 3 seconds.

6. Appearance Defect Judging Standard

• Copper Wire Exposed: Area of copper wire exposed in magnetic shield area less than 0.06 square millimeter is OK.

7. Package Specification (Tape & Reel)

Packaging Quantity: 2000 Pcs/Reel

8. Package Specifications (Inside Box and Outside Carton)

• Per Reel: 2000 Pcs
• Per Inner Box: 4 Reels (8000 Pcs)
• Outer Carton Quantities:
• Small Box: 6 Inner Boxes (48,000 Pcs)
• Medium Box: 8 Inner Boxes (64,000 Pcs)
• Large Box: 10 Inner Boxes (80,000 Pcs)
• Inner Box Dimensions: 20.3 x 19.3 x 5.5 cm
• Outer Carton Dimensions:
• Small Box: 40.6 x 23 x 19.7 cm
• Medium Box: 41 x 22 x 26 cm
• Large Box: 41 x 22 x 33 cm