energy storage wire wound chip inductor MYX MWI0603IF1R5KST-HF designed for small electronic components

Product Overview

The MWI0603IF series is a range of wire-wound chip inductors designed for various electronic applications. These compact inductors offer reliable performance with precise inductance values, tight tolerances, and high-quality construction. They are suitable for applications requiring efficient energy storage and filtering in a small form factor.

Product Attributes

• Brand: DongGuan Ming Yixuan Electronic Technology Co., LTD
• Product Line: MWI0603IF Series
• Type: Wire Wound Chip Inductor
• Material: Chip Type (Specific material not detailed)
• Terminal Material: Tin (S-)
• Environmental Compliance: Lead Free (LF), Halogen Free (HF), Red Phosphor Free (FP)
• Origin: Dongguan, Guangdong, China

Technical Specifications

1. Shape & Dimension (Unit: mm)

2. Part Numbering System

MWI 0603 IF 2R2 K S T - HF

• 1. PRODUCT SYMBOL: MWI
• 2. DIMENSIONS: 0603
• 3. MATERIAL: IF (Chip Type)
• 4. INDUCTANCE: e.g., 2R2 (2.2 uH)
• 5. TOLERANCE: J (5%), K (10%), M (20%)
• 6. TERMINAL: S (Tin Terminal)
• 7. PACKAGING: T (Tape & Reel), B (Bulk)
• 8. E.P. (Environmental Protection): LF (Lead Free), HF (Halogen Free), FP (Red Phosphor Free)

3. Electrical Characteristics

: Represents product tolerance

Test Remarks:

• All test data is referenced to 25C ambient.
• Irms: DC current that causes the temperature rise (T 40C) from 25C ambient.

4. General Specification

• Operating Temperature: -40C ~ +85C (Including self-generated heat)
• Storage Temperature: -10C ~ +40C, R.H.: 60% Max.
• Moisture Sensitivity Level (MSL): 1
• Recommended Usage: Products should be used within 12 months from the date of delivery.
• Part Temperature Limit: The part temperature (ambient + temp rise) should not exceed 85C under worst-case operating conditions. Verification in the end application is required, considering circuit design, component placement, PWB trace size and thickness, airflow, and other cooling provisions.

5. Soldering Conditions

Figure 1. Re-flow Soldering (Lead Free)

• Preheat circuit and products to 150C.
• Tip temperature: 260C (Max).
• Reflow times: No more than 2 times.
• Solder paste thickness: Best 0.08mm, Max 0.1mm.

Figure 2. Hand Soldering

• Use a 20 watt soldering iron with a tip diameter of 1.0mm.
• Limit soldering time to 3 seconds.

6. Package Specification (Tape & Reel)

Packaging Quantity: 4000 Pcs/Reel

7. Package Specifications (Box and Carton)

• Per Reel: 4000 PCS
• Inner Box: 4 Reels per box (16000 PCS)
• Outer Carton:
  • Small Box: 6 Inner Boxes (96000 PCS)
  • Medium Box: 8 Inner Boxes (128000 PCS)
  • Large Box: 10 Inner Boxes (160000 PCS)
• Inner Box Dimensions: 20.3*19.3*5.5cm
• Outer Carton Dimensions:
  • Small: 40.6*23*19.7cm
  • Medium: 41*22*26cm
  • Large: 41*22*33cm