RoHS Compliant Chip Inductor PSA 0805F-4R7K-DLRH01 Wire Wound Ferrite Core 4.7 Microhenry Inductance
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Product Description
Chip Inductors (RoHS+H.F.)
This specification applies to wire wound chip inductors. These components are designed for various applications requiring inductance, with RoHS and High Frequency (H.F.) compliance.
Product Attributes
- Brand: PROSPERITY DIELECTRICS CO., LTD.
- Customer Part Number: CUST. PART NO. CUST. DOC. REV.
- Part Number: 0805F-4R7K-DLRH01
- Origin: Taiwan
- Certifications: RoHS, REACH compliant
- Material: Ferrite Core, Enameled Copper Wire, Ag/Ni/Sn Termination, UV Glue
- Operating Temperature Range: -40~+125
- Storage Temperature Range: -40~+125
Technical Specifications
| Part Number | Inductance (H) | Inductance Tolerance | Test Frequency (V/MHz) | Q TYP. | Test Frequency (MHz) | SRF (MHz) TYP. | DC Resistance () | Idc (mA) TYP. | Irms (mA) TYP. |
| 0805F-4R7K-DLRH01 | 4.7 | K (10%) | 0.5/7.9 | 14 | 7.9 | 51 | 0.43 | 520 | 840 |
Mechanical Dimensions
| Dimension | Unit: mm | Tol. |
| M1 | 2.20 | 0.2 |
| M2 | 1.45 | 0.2 |
| M3 | 1.30 | 0.1 |
| M4 | 0.44 | REF. |
| Color Coding | 3.00 | |
| Terminal Electrode | ||
Reliability Performance
| Item | Performance | Test Condition | |
| Life Test | Appearance: No damage. Impedance: within 15% of initial value Inductance: within 10% of initial value Q: Shall not exceed the specification value. RDC: within 15% of initial value and shall not exceed the specification value | Preconditioning: Run through IR reflow for 2 times. (IPC/JEDECJ-STD-020DClassification Reflow Profiles) Temperature: 1252 Applied current: rated current Duration: 100012hrs Measured at room temperature after placing for 242 hrs. | |
| Load Humidity | Preconditioning: Run through IR reflow for 2 times. (IPC/JEDECJ-STD-020DClassification Reflow Profiles) Humidity: 852% R.H. Temperature: 852 Duration: 1000hrs Min. with 100% rated current Measured at room temperature after placing for 242 hrs. | ||
| Moisture Resistance | Preconditioning: Run through IR reflow for 2 times. (IPC/JEDECJ-STD-020DClassification Reflow Profiles) 1. Baked at50 for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 652 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25 in 2.5hrs. 3. Raise temperature to 652 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25 in 2.5hrs,keep at 25 for 2 hrs then keep at -10 for 3 hrs 4. Keep at 25 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. | ||
| Thermal shock | Preconditioning: Run through IR reflow for 2 times. (IPC/JEDECJ-STD-020DClassification Reflow Profiles) Condition for 1 cycle Step1: -402 305min Step2: 252 0.5min Step3: 1252 305min Number of cycles: 500 Measured at room fempraturc after placing for 242 hrs. | ||
| Vibration | Preconditioning: Run through IR reflow for 2 times. (IPC/JEDECJ-STD-020DClassification Reflow Profiles) Oscillation Frequency: 102K10Hz for 20 minutes Equipment: Vibration checker Total Amplitude: 1.52mm 10% Testing Time: 12 hours (20 minutes, 12 cycles each of 3 orientations) | ||
| Bending | Appearance: No damage. Impedance: within 15% of initial value Inductance: within 10% of initial value Q: Shall not exceed the specification value. RDC: within 15% of initial value and shall not exceed the specification value | Shall be mounted on a FR4 substrate of the following dimensions: >=0805 inch(2012mm):40x100x1.2mm Bending depth: >=0805 inch(2012mm):1.2mm | |
| Shock | Type Peak value (gs) Normal duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 50 11 Half-sine 11.3 Lead 50 11 Half-sine 11.3 | ||
| Solder ability | More than 95% of the terminal electrode should be covered with solder | Preheat: 150,60sec. Solder: Sn96.5% Ag3% Cu0.5% Temperature: 2455 Flux for lead free: Rosin. 9.5% Dip time: 41sec Depth: completely cover the termination | |
| Resistance to Soldering Heat | Appearance: No damage. Impedance: within 15% of initial value Inductance: within 10% of initial value Q: Shall not exceed the specification value. RDC: within 15% of initial value and shall not exceed the specification value | Depth: completely cover the termination Temperature (C) Time(s) Temperature ramp/immersion and emersion rate Number of heat cycles 260 5 (solder temp) 10 1 25mm/s 6 mm/s 1 | |
| Terminal Strength | Preconditioning: Run through IR reflow for 2 times. (IPC/JEDEC J-STD-020DClassification Reflow Profiles) With the component mounted on a PCB with the device to be tested, apply a force (>0805: 1kg, |
Packing
| Item | Dimension | Unit | Value |
| Reel Dimension | A | mm | 9.00.5 |
| B | mm | 602 | |
| C | mm | 13.50.5 | |
| D | mm | 1782 | |
| Tape Dimension | P | mm | 4.000.10 |
| Po | mm | 4.000.10 | |
| P2 | mm | 2.000.05 | |
| Bo | mm | 2.500.10 | |
| Ao | mm | 1.600.10 | |
| Ko | mm | 1.550.10 | |
| W | mm | 8.000.10 | |
| t | mm | 0.220.05 | |
| Tearing Off Force | grams | 15 to 80 | |
| Packaging Quantity | Chip/Reel | 2000 | |
| Conditions for Tearing Off Force | Room Temp. | 5~35 | |
| Room Humidity | % | 45~85 | |
| Room atm | hPa | 860~1060 | |
| Tearing Speed | mm/min | 300 |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina