Lead Free Thick Film Array Chip Resistors RALEC RTA03-4D511JTP RoHS Compliant for Electronic Circuits

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

RTA Series Thick Film Array Chip Resistors

The RTA series resistors are lead-free, halogen-free, and RoHS compliant thick film array chip resistors designed for general electronic applications. They offer reliable performance and are available in various configurations to meet diverse circuit needs.

Product Attributes

Brand: RALEC
Compliance: RoHS, Lead-free, Halogen-free

Technical Specifications

Type	Rated Power	Max. Rated Voltage	Max. Overload Voltage	T.C.R (ppm/)	Resistance Range	Number of Terminals	Number of Resistors	JUMPER (0) Rated Current	JUMPER (0) Resistance
RTA02-2D (0402)	1 W	25V	50V	±300	1≤R<10	4	2	1A	25mΩ MAX.
RTA02-4D (0402)	1 W	25V	50V	±300	1≤R<10	8	4	1A	25mΩ MAX.
RTA02-8D (0402)	1 W	25V	50V	±250	10≤R≤10MΩ	16	8	1A	--
RTA03-2D (0603)	1 W	50V	100V	±200	10≤R≤10MΩ	4	2	1A	--
RTA03-4D (0603)	1 W	50V	100V	±200	1≤R≤10MΩ	8	4	1A	25mΩ MAX.
RTA02-2C (0402)	1 W	25V	50V	±650	3≤R≤1MΩ	4	2	1A	--
RTA02-4C (0402)	1 W	25V	50V	±400	1≤R≤1MΩ	8	4	1A	--

Dimensions (mm)

Type	L	W	H	L1	L2	P	Q
RTA02-2D (0402)	1.00±0.10	1.00±0.10	0.30±0.05	0.15±0.10	0.25±0.10	(0.67)	0.33±0.10
RTA02-4D (0402)	2.00±0.10	1.00±0.10	0.40±0.10	0.20±0.10	0.25±0.10	(0.50)	0.30±0.10
RTA02-8D (0402)	4.00±0.20	1.60±0.10	0.40±0.10	0.30±0.15	0.30±0.10	(0.50)	0.25±0.10
RTA03-2D (0603)	1.60±0.15	1.60±0.15	0.45±0.10	0.30±0.15	0.30±0.15	(0.80)	0.60±0.10
RTA03-4D (0603)	3.20±0.20	1.60±0.15	0.50±0.10	0.30±0.15	0.30±0.15	(0.80)	0.50±0.10
RTA02-2C (0402)	1.00±0.10	1.00±0.10	0.30±0.10	0.18±0.10	0.25±0.10	(0.50)	0.30±0.10
RTA02-4C (0402)	2.00±0.10	1.00±0.10	0.40±0.10	0.15±0.10	0.25±0.10	(0.50)	0.30±0.10

Reliability Test Items

Category	Item	Conditions	Specifications
Electrical Performance Test	Temperature Coefficient of Resistance	Based on JIS-C5201-1 4.8	NA
	Short Time Overload	Based on JIS-C5201-1 4.13	0.5%, 1%: ΔR=±1.0%; 5%: ΔR=±2.0%
	Insulation Resistance Test	Based on JIS-C5201-1 4.6	≥10⁹Ω
	Dielectric Withstand Voltage	Based on JIS-C5201-1 4.7	No short circuit or burnout
	Intermittent Overload	Based on JIS-C5201-1 4.13	ΔR=±5.0%
Mechanical Performance Test	Resistance to Solvent	Based on JIS-C5201-1 4.29	ΔR=±0.5%
	Solderability	According to JIS-C5201-1 4.17	Soldered area should be greater than 95%
	Resistance to Soldering Heat	According to JIS-C5201-1 4.18	Test Item 1: ΔR%=±1.0%; Test Item 2: Soldered area >95%, no underlying material visible at electrode edge.
Joint Strength of Solder	Bending Test, Based on JIS-C5201-1 4.33	ΔR%=±1.0%
Environmental Test	Resistance to Dry Heat	Based on JIS-C5201-1 4.25	0.5%, 1%: ΔR=±1.0%; 5%: ΔR=±2.0%
	Thermal Shock	Based on MIL-STD 202 Method 107	ΔR=±1.0%
	Loading Life in Moisture	Based on JIS-C5201-1 4.24	0.5%, 1%: ΔR=±2.0%; 5%: ΔR=±3.0%
Load Life	Based on JIS-C5201-1 4.25	0.5%, 1%: ΔR=±2.0%; 5%: ΔR=±3.0%

Plating Thickness

Nickel Layer (Ni): ≥2μm
Pure Tin Layer (Sn): ≥3μm
Plating tin is matte tin.

Technical Application Notes

Recommended Soldering Conditions: Lead Free IR-Reflow Soldering Profile (J-STD-020 compliant), Iron Soldering: 350±10 within 3 seconds.
Recommended Land Pattern Design for Reflow Soldering is provided.
Environmental Precautions: Not recommended for use in high temperature/humidity, corrosive environments (sea breeze, Cl2, H2S, NH3, SO2, NO2), unverified liquids, or with unverified sealing/coating materials. Cleaning after soldering is recommended.
Transient Overload: Be cautious of transient overloads that may cause functional loss.
Handling and Operation: Avoid mechanical stress on resistor edges and protective layers. Ensure proper handling during PCB separation/fixing. Operate within rated power limits. Consider pulse load impacts and implement fail-safe design.

Storage and Handling Conditions

Storage: Store in 25±5, 60±15% RH environment for up to two years. Avoid direct sunlight, condensation, and corrosive atmospheres.
Handling: Ensure correct box orientation, avoid dropping or squeezing to prevent damage to electrodes or body.