Thick Film Array Chip Resistors RALEC RTA02-2D102JTH Lead Free RoHS Compliant Electronic Components

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Product Description

RTA Series Thick Film Array Chip Resistors

The RTA series thick film array chip resistors are lead-free, halogen-free, and RoHS compliant. They are designed for general electronic applications.

Product Attributes

Brand: RALEC
Certifications: RoHS compliant

Technical Specifications

Type	Rated Power	Max. Rated Voltage	Max. Overload Voltage	T.C.R (ppm/)	Resistance Range	Number of Terminals	Number of Resistors	Rated Current (JUMPER 0)	Max. Resistance (JUMPER 0)
RTA02-2D (0402)	1W	25V	50V	300	1R10R10M (0.5%, 1%, 5%)	4	2	1A	25m MAX.
RTA02-4D (0402)	1W	25V	50V	300	1R10R10M (0.5%, 1%, 5%)	8	4	1A	25m MAX.
RTA02-8D (0402)	1W	25V	50V	250	10R10M (0.5%, 1%, 5%)	16	8	1A	50m MAX.
RTA03-2D (0603)	1W	50V	100V	200	10R10M (0.5%, 1%, 5%)	4	2	1A	50m MAX.
RTA03-4D (0603)	1W	50V	100V	200	22R470K (1%) 1R10M (0.5%, 1%, 5%)	8	4	1A	25m MAX.
RTA02-2C (0402)	1W	25V	50V	650	3R10 (0.5%, 5%) 10R	4	2	1A	50m MAX.
RTA02-4C (0402)	1W	25V	50V	400	1R10R1M (0.5%, 1%, 5%)	8	4	1A	50m MAX.

Dimensions (mm)

Type	L	W	H	L1	L2	P	Q
RTA02-2D (0402)	1.000.10	1.000.10	0.300.05	0.150.10	0.250.10	(0.67)	0.330.10
RTA02-4D (0402)	2.000.10	1.000.10	0.400.10	0.200.10	0.250.10	(0.50)	0.300.10
RTA02-8D (0402)	4.000.20	1.600.10	0.400.10	0.300.15	0.300.10	(0.50)	0.250.10
RTA03-2D (0603)	1.600.15	1.600.15	0.450.10	0.300.15	0.300.15	(0.80)	0.600.10
RTA03-4D (0603)	3.200.20	1.600.15	0.500.10	0.300.15	0.300.15	(0.80)	0.500.10
RTA02-2C (0402)	1.000.10	1.000.10	0.300.10	0.180.10	0.250.10	(0.50)	0.300.10
RTA02-4C (0402)	2.000.10	1.000.10	0.400.10	0.150.10	0.250.10	(0.50)	0.300.10

Structure Diagram

See attached diagrams for D(Convex) Type and C(Concave) Type structures.

Reliability Test Items

Electrical Performance Test

Item	Conditions	Specifications
Temperature Coefficient of Resistance	TCR = (R2-R1) / R1(T2-T1) 10 R1: Room temp. resistance, R2: -55 or +125 resistance, T1: Room temp., T2: -55 or +125	According to JIS-C5201-1 4.8
Short Time Overload	Apply 2.5x rated voltage for 5 sec, rest 30 min.	0.5%, 1%: R=1.0%; 5%: R=2.0% (Ref. Spec. Table)
Insulation Resistance	Apply 100 VDC for 1 min between electrodes and protective layer/substrate.	10 (According to JIS-C5201-1 4.6)
Dielectric Withstand Voltage	Apply 300 VAC for 1 min between electrodes.	No short circuit or burn. (According to JIS-C5201-1 4.7)
Intermittent Overload	2.5x rated voltage, 1 sec ON, 25 sec OFF, 10,000 cycles.	R=5.0% (Ref. Spec. Table) (According to JIS-C5201-1 4.13)

Mechanical Performance Test

Item	Conditions	Specifications
Resistance to Solvent	Immerse in Isopropyl alcohol (20~25) for 50.5 min, rest 48 hrs.	R=0.5% (Ref. Spec. Table) (According to JIS-C5201-1 4.29)
Solderability	Pre-treatment: 105, 100% RH, 1.2210 pa for 4 hrs. Test: Immerse in 2355 solder for 20.5 sec.	Solder coverage >95% (According to JIS-C5201-1 4.17)
Resistance to Soldering Heat	Test 1: Immerse in 260+5/-0 solder for 10 sec+1/-0, rest 60 min. Test 2: Immerse in 260+5/-0 solder for 30 sec+1/-0, then clean.	Test 1: R%=1.0%. Test 2: Solder coverage >95%, no underlayer visible at electrode edge. (Ref. Spec. Table) (According to JIS-C5201-1 4.18)
Joint Strength of Solder	Bending test: Apply 5mm downward force at center of test board.	R%=1.0% (Ref. Spec. Table) (According to JIS-C5201-1 4.33)

Environmental Test

Item	Conditions	Specifications
Resistance to Dry Heat	1555 oven for 10004 hr.	0.5%, 1%: R=1.0%; 5%: R=2.0% (Ref. Spec. Table) (According to JIS-C5201-1 4.25)
Thermal Shock	-55 (15 min) to +125 (15 min), 300 cycles.	R=1.0% (Ref. Spec. Table) (According to MIL-STD 202 Method 107)
Moisture Loading Life	402, 90~95% RH, rated voltage applied, 90 min ON, 30 min OFF, 1,000 hr.	0.5%, 1%: R=2.0%; 5%: R=3.0% (Ref. Spec. Table) (According to JIS-C5201-1 4.24)
Load Life	702 oven, rated voltage applied, 90 min ON, 30 min OFF, 1,000 hrs.	0.5%, 1%: R=2.0%; 5%: R=3.0% (Ref. Spec. Table) (According to JIS-C5201-1 4.25)

Plating Thickness

Nickel Layer (Ni): 2m
Pure Tin Layer (Sn): 3m (Matte tin)

Technical Application Notes

Recommended Soldering Conditions: Lead Free IR-Reflow Soldering Profile (J-STD-020 compliant), max. temp. 260+5/-0 for 10 sec. Soldering Iron: 35010 within 3 sec.
Recommended Land Pattern Design for Reflow Soldering: Refer to diagrams for specific types.
Environmental Usage Precautions: For general electronic use. Not suitable for special environments without confirmation.
Transient Overload Precautions: Avoid transient overloads exceeding product specifications.
Handling and Operation Precautions: Avoid mechanical stress, bending of PCB, operate within rated power, consider pulse loads. Evaluate in actual application for safety.

Storage and Handling Conditions

Storage: 255, 6015% RH for 2 years. Avoid corrosive environments, direct sunlight, condensation.
Handling: Ensure correct box orientation, avoid dropping or crushing to prevent damage.

Marking

External packaging will be marked with Electronic Information Product Pollution Control Mark and Packaging Recycling Mark for export to mainland China.