Thick Film Chip Resistor Arrays RALEC RTA03-4D49R9FTP RoHS Compliant Lead Free Halogen Free for Circuit
RTA Series Thick Film Chip Resistor Arrays
The RTA series thick film chip resistor arrays are lead-free, halogen-free, and RoHS compliant, designed for general electronic applications. They offer a reliable solution for various circuit designs.
Product Attributes
- Brand: RALEC
- Series: RTA
- Compliance: Lead-free, Halogen-free, RoHS
- Application: General Electronic Use
Technical Specifications
| Type | Rated Power (W) | Max. Operating Voltage (V) | Max. Overload Voltage (V) | T.C.R. (ppm/) | Resistance Range () | Terminals | Resistors | Jumper (0) Rated Current (A) | Jumper (0) Resistance (m MAX.) |
|---|---|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1 | 25 | 50 | 300 (1R | 1R | 4 | 2 | 1A | 25 |
| RTA02-4D (0402) | 1 | 25 | 50 | 300 (1R | 1R | 8 | 4 | 1A | 25 |
| RTA02-8D (0402) | 1 | 25 | 50 | 250 (10R10M) | 10R10M | 16 | 8 | 1A | 50 |
| RTA03-2D (0603) | 1 | 50 | 100 | 200 (10R10M) | 10R10M | 4 | 2 | 1A | 50 |
| RTA03-4D (0603) | 1 | 50 | 100 | 200 (22R470K), 200 (1R10M) | 1R10M | 8 | 4 | 1A | 25 |
| RTA02-2C (0402) | 1 | 25 | 50 | 650 (3R10), 200 (10R | 3R10, 10R1M | 4 | 2 | 1A | 50 |
| RTA02-4C (0402) | 1 | 25 | 50 | 400 (1R | 1R | 8 | 4 | 1A | 50 |
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1.000.10 | 1.000.10 | 0.300.05 | 0.150.10 | 0.250.10 | (0.67) | 0.330.10 |
| RTA02-4D (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.200.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-8D (0402) | 4.000.20 | 1.600.10 | 0.400.10 | 0.300.15 | 0.300.10 | (0.50) | 0.250.10 |
| RTA03-2D (0603) | 1.600.15 | 1.600.15 | 0.450.10 | 0.300.15 | 0.300.15 | (0.80) | 0.600.10 |
| RTA03-4D (0603) | 3.200.20 | 1.600.15 | 0.500.10 | 0.300.15 | 0.300.15 | (0.80) | 0.500.10 |
| RTA02-2C (0402) | 1.000.10 | 1.000.10 | 0.300.10 | 0.180.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-4C (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.150.10 | 0.250.10 | (0.50) | 0.300.10 |
Structure Diagram
Refer to the provided document for detailed structure diagrams of D (Convex) Type and C (Concave) Type.
Reliability Test Items
Electrical Performance Tests
| Item | Conditions | Specifications |
|---|---|---|
| Temperature Coefficient of Resistance (TCR) | According to JIS-C5201-1 4.8 | Refer to Specification Table |
| Short Time Overload | Apply 2.5x rated voltage for 5s, rest 30 min. | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Insulation Resistance | Apply 100 VDC for 1 min. | 109 |
| Dielectric Withstand Voltage | Apply 300 VAC for 1 min. | No short circuit or burning. |
| Intermittent Overload | 1s ON, 25s OFF, 10,000 cycles. | R=5.0% |
Mechanical Performance Tests
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Solvent | Immerse in Isopropanol for 5 min. | R=0.5% |
| Solderability | Pre-treatment: 4 hrs at 105, 100% RH. Test: Dip in 2355 solder for 20.5s. | Soldered area > 95%. |
| Resistance to Soldering Heat | Test 1: Dip in 260+5/-0 solder for 10 sec. Test 2: Dip in 260+5/-0 solder for 30 sec. | Test 1: R%=1.0%. Test 2: Soldered area > 95%, no underlayer visible at electrode edge. |
| Joint Strength of Solder (Bending Test) | Apply load at center of test board, D=5mm. | R%=1.0% |
Environmental Tests
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Dry Heat | 10004 hrs at 1555. | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Thermal Shock | 300 cycles: -55 (15 min) to +125 (15 min). | R=1.0% |
| Moisture Load Test | 1000 hrs at 402, 90~95% RH, rated voltage (90 min ON, 30 min OFF). | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
| Load Life | 1000 hrs at 702, rated voltage (90 min ON, 30 min OFF). | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
Plating Thickness
- Nickel (Ni) Layer: 2m
- Pure Tin (Sn) Layer: 3m (Matte Tin)
Application Notes
- Recommended Soldering Conditions: Lead Free IR-Reflow Soldering Profile (J-STD-020 compliant), Iron Soldering: 35010 within 3 seconds.
- Recommended Land Pattern Design: Refer to document for specific patterns per type.
- Environmental Considerations: Not recommended for use in high temperature/humidity, corrosive atmospheres (sea breeze, Cl2, H2S, NH3, SO2, NO2), unverified liquids, or with unverified sealing/coating materials. Cleaning after soldering is recommended.
- Transient Overload: Be mindful of transient overloads that may cause functional loss.
- Handling and Processing: Avoid mechanical stress on edges and protective layers. Be cautious of PCB bending. Operate within rated power limits. Evaluate and confirm in actual application for safety.
Storage and Handling Conditions
- Storage: 2 years under 255, 6015% RH.
- Avoid adverse environments: corrosive gases, direct sunlight, condensation.
- Handle with care to prevent damage to electrodes or body. Ensure correct box orientation.
Marking
Outer boxes for export to mainland China will be marked with Electronic Information Product Pollution Control Marks and Packaging Recycling Marks.
Disclaimer
RALEC and its distributors/agents (collectively "RALEC") are not liable for any errors, inaccuracies, or incompleteness in product information. RALEC may change product information without notice. RALEC makes no commitment or warranty regarding product suitability for special purposes or continued production. RALEC disclaims all liability for product application or use, including but not limited to lost profits, direct, indirect, special, punitive, consequential, or incidental damages. Implied warranties, including fitness for a particular purpose, non-infringement, and merchantability, are disclaimed. This product is defined for general electronic use and is not suitable for automotive electronics, medical life-support/life-sustaining equipment, or any application where failure could result in injury or death. Technical advice provided by RALEC is free and given without obligation or liability. Buyer assumes all risks for using such advice and for combining RALEC products with other materials or implementing them in any process. RALEC reserves the right to modify this content without notice; product changes will be announced via ECN.
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