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Thick Film Array Chip Resistors Lead Free Halogen Free RALEC RTA02-2D5R1JTH RoHS Compliant for Electronic

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Product Description

RTA Series Thick Film Array Chip Resistors

The RTA series resistors are lead-free, halogen-free, and RoHS compliant thick film array chip resistors designed for general electronic applications. They offer reliable performance and are suitable for a wide range of general electronic purposes.

Product Attributes

  • Brand: RALEC
  • Compliance: RoHS, Lead-free, Halogen-free
  • Product Type: Thick Film Array Chip Resistors

Technical Specifications

Type Rated Power Max. Rated Voltage Max. Overload Voltage T.C.R (ppm/) Resistance Range () Terminals Resistors JUMPER (0) Rated Current JUMPER (0) Resistance Max.
RTA02-2D (0402) 1W 25V 50V 300 1R 4 2 1A 25m MAX.
RTA02-4D (0402) 1W 25V 50V 300 1R 8 4 1A 25m MAX.
RTA02-8D (0402) 1W 25V 50V 250 10R10M (D:0.5%), 1R10M (F:1%), 10R10M (J:5%) 16 8 1A 50m MAX.
RTA03-2D (0603) 1W 50V 100V 200 10R10M (D:0.5%), 1R10M (F:1%), 10R10M (J:5%) 4 2 1A 50m MAX.
RTA03-4D (0603) 1W 50V 100V 200 22R470K (F:1%), 1R10M (D:0.5%), 1R10M (F:1%), 1R10M (J:5%) 8 4 1A 25m MAX.
RTA02-2C (0402) 1W 25V 50V 650 3R10 (D:0.5%), 3R 4 2 1A 50m MAX.
RTA02-4C (0402) 1W 25V 50V 400 1R 8 4 1A 50m MAX.

Operating Temperature Range: -55 ~ 155

Power Derating Curve: Power can be adjusted according to the curve when ambient temperature exceeds 70 to 155.

Rated Voltage or Rated Current Calculation:

  • For resistance values (1): E=(RP), where E is rated voltage (V), R is nominal resistance (), P is rated power (W). If calculated value exceeds max rated voltage, use max rated voltage.
  • For jumper values (0): I=(P/R), where I is rated current (A), P is rated power (W), R is nominal resistance (). If calculated value exceeds max rated current, use max rated current.

Dimensions (mm):

Type L W H L1 L2 P Q
RTA02-2D (0402) 1.000.10 1.000.10 0.300.05 0.150.10 0.250.10 (0.67) 0.330.10
RTA02-4D (0402) 2.000.10 1.000.10 0.400.10 0.200.10 0.250.10 (0.50) 0.300.10
RTA02-8D (0402) 4.000.20 1.600.10 0.400.10 0.300.15 0.300.10 (0.50) 0.250.10
RTA03-2D (0603) 1.600.15 1.600.15 0.450.10 0.300.15 0.300.15 (0.80) 0.600.10
RTA03-4D (0603) 3.200.20 1.600.15 0.500.10 0.300.15 0.300.15 (0.80) 0.500.10
RTA02-2C (0402) 1.000.10 1.000.10 0.300.10 0.180.10 0.250.10 (0.50) 0.300.10
RTA02-4C (0402) 2.000.10 1.000.10 0.400.10 0.150.10 0.250.10 (0.50) 0.300.10

Structure Diagram: See original document for detailed diagrams of D(Convex) and C(Concave) types.

Reliability Test Items:

Category Item Conditions Specifications
Electrical Performance Test Temperature Coefficient of Resistance (TCR) Measured at room temp, -55 or +125. Ref: JIS-C5201-1 4.8 Refer to Specification Table
Short Time Overload Apply 2.5x rated voltage for 5 sec, rest 30 min. Ref: JIS-C5201-1 4.13 0.5%, 1%: R=1.0%; 5%: R=2.0%
Insulation Resistance Apply 100 VDC for 1 min between electrodes and protective layer/substrate. Ref: JIS-C5201-1 4.6 109
Dielectric Withstand Voltage Apply 300 VAC for 1 min. Ref: JIS-C5201-1 4.7 No short circuit or burnout
Intermittent Overload 1 sec ON, 25 sec OFF at 2.5x rated voltage for 10,000 cycles. Ref: JIS-C5201-1 4.13 R=5.0%
Mechanical Performance Test Resistance to Solvent Immerse in Isopropanol at 20~25 for 50.5 min. Ref: JIS-C5201-1 4.29 R=0.5%
Solderability Pre-treatment: 4 hrs at 105, 100% RH, 1.22105 pa. Test: Dip in 2355 solder for 20.5 sec. Ref: JIS-C5201-1 4.17 Soldered area >95%
Resistance to Soldering Heat Test 1: Dip in 260+5/-0 solder for 10 sec. Ref: JIS-C5201-1 4.18 Test 1: R%=1.0%; Test 2: Soldered area >95%, no underlayer visible at electrode edge.
Joint Strength of Solder Bending test: Apply 5mm downward force. Ref: JIS-C5201-1 4.33 R%=1.0%
Environmental Test Resistance to Dry Heat 10004 hr at 1555. Ref: JIS-C5201-1 4.25 0.5%, 1%: R=1.0%; 5%: R=2.0%
Thermal Shock 300 cycles of -55 (15 min) to +125 (15 min). Ref: MIL-STD 202 Method 107 R=1.0%
Moisture Load 1000 hr at 402, 90~95% RH, 90 min ON / 30 min OFF. Ref: JIS-C5201-1 4.24 0.5%, 1%: R=2.0%; 5%: R=3.0%
Load Life 1000 hr at 702, 90 min ON / 30 min OFF. Ref: JIS-C5201-1 4.25 0.5%, 1%: R=2.0%; 5%: R=3.0%

Plating Thickness:

  • Nickel Layer (Ni): 2m
  • Pure Tin Layer (Sn): 3m (Matte Tin)

Technical Application Notes:

  • Recommended Soldering Conditions:
    • Lead Free IR-Reflow Soldering Profile (J-STD-020 compliant): Max component temp 260+5/-0, 10 sec.
    • Soldering Iron Method: 35010 within 3 seconds.
  • Recommended Land Pattern Design (For Reflow Soldering): Refer to original document for diagrams and dimensions (A, B, P, Q1, Q2) for different types.
  • Environmental Precautions: Not recommended for special environments (high temp/humidity, corrosive gases, unverified liquids, unverified sealing/coating materials). Cleaning after soldering is recommended, even with no-clean flux.
  • Transient Overload Precautions: Avoid transient currents exceeding product specifications.
  • Handling and Operation Precautions: Protect edges and protective layers from mechanical stress. Avoid bending PCB during assembly. Operate within rated power. Consider pulse load impacts. Evaluate and confirm in actual application, ensure fail-safe design.

Storage and Handling Conditions:

  • Storage: 2 years under 255, 6015% RH.
  • Avoid: Direct sunlight, condensation, corrosive environments (sea breeze, Cl2, H2S, NH3, SO2, NO2).
  • Handling: Ensure correct box orientation, avoid dropping or squeezing.

Labeling for China Mainland Export: Includes Electronic Information Product Pollution Control Mark and Packaging Recycling Mark.


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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
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