Durable RALEC RTA03-4D242JTP thick film array chip resistors with 4 terminals and circuit performance

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Product Description

RTA Series Thick Film Array Chip Resistors

The RTA series resistors are lead-free, halogen-free, and RoHS compliant thick film array chip resistors designed for general electronic applications. They offer reliable performance and are available in various configurations to meet diverse circuit needs.

Product Attributes

Brand: RALEC
Compliance: RoHS, Lead-free, Halogen-free

Technical Specifications

Type	Rated Power	Max. Rated Voltage	Max. Overload Voltage	T.C.R (ppm/)	Resistance Range	Terminals	Resistors	JUMPER (0) Rated Current	JUMPER (0) Resistance
RTA02-2D (0402)	1 W	25V	50V	300	1R	4	2	1A	25m MAX.
RTA02-4D (0402)	1 W	25V	50V	300	1R	8	4	1A	25m MAX.
RTA02-8D (0402)	1 W	25V	50V	250	10R10M	16	8	1A	--
RTA03-2D (0603)	1 W	50V	100V	200	10R10M	4	2	1A	--
RTA03-4D (0603)	1 W	50V	100V	200	1R10M	8	4	1A	25m MAX
RTA02-2C (0402)	1 W	25V	50V	650	3R10	4	2	1A	--
RTA02-4C (0402)	1 W	25V	50V	400	1R	8	4	1A	--

Dimensions (mm)

Type	L	W	H	L1	L2	P	Q
RTA02-2D (0402)	1.000.10	1.000.10	0.300.05	0.150.10	0.250.10	(0.67)	0.330.10
RTA02-4D (0402)	2.000.10	1.000.10	0.400.10	0.200.10	0.250.10	(0.50)	0.300.10
RTA02-8D (0402)	4.000.20	1.600.10	0.400.10	0.300.15	0.300.10	(0.50)	0.250.10
RTA03-2D (0603)	1.600.15	1.600.15	0.450.10	0.300.15	0.300.15	(0.80)	0.600.10
RTA03-4D (0603)	3.200.20	1.600.15	0.500.10	0.300.15	0.300.15	(0.80)	0.500.10
RTA02-2C (0402)	1.000.10	1.000.10	0.300.10	0.180.10	0.250.10	(0.50)	0.300.10
RTA02-4C (0402)	2.000.10	1.000.10	0.400.10	0.150.10	0.250.10	(0.50)	0.300.10

Reliability Test Items

Item	Conditions	Specifications
Electrical Performance Test
Temperature Coefficient of Resistance	(R2-R1)/R1(T2-T1) 10	Refer to Spec Table
Short Time Overload	Apply 2.5x rated voltage for 5 sec.	0.5%, 1%: R=1.0%; 5%: R=2.0%
Insulation Resistance	Apply 100 VDC for 1 min.	10
Dielectric Withstand Voltage	Apply 300 VAC for 1 min.	No short circuit or burnout
Intermittent Overload	2.5x rated voltage, 1 sec ON, 25 sec OFF, 10,000 cycles	R=5.0%
Mechanical Performance Test
Resistance to Solvent	Immerse in Isopropyl alcohol for 50.5 min.	R=0.5%
Solderability	Immerse in 2355 solder bath for 20.5 sec.	Soldered area >95%
Resistance to Soldering Heat	Test 1: Immerse in 260+5/-0 solder bath for 10 sec. Test 2: Immerse in 260+5/-0 solder bath for 30 sec.	Test 1: R%=1.0%. Test 2: Soldered area >95%, no lower material visible.
Joint Strength of Solder	Bending test: 5mm deflection	R%=1.0%
Environmental Test
Resistance to Dry Heat	1555 for 10004 hr.	0.5%, 1%: R=1.0%; 5%: R=2.0%
Thermal Shock	-55 for 15 min, +125 for 15 min, 300 cycles	R=1.0%
Loading Life in Moisture	402, 90-95% RH, rated voltage, 90 min ON, 30 min OFF, 1,000 hr	0.5%, 1%: R=2.0%; 5%: R=3.0%
Load Life	702, rated voltage, 90 min ON, 30 min OFF, 1,000 hrs	0.5%, 1%: R=2.0%; 5%: R=3.0%

Plating Thickness

Nickel Layer (Ni): 2m
Pure Tin Layer (Tin): 3m (Matte Tin)

Application Notes

Recommended Soldering Conditions: Lead Free IR-Reflow Soldering Profile (J-STD-020 compliant), maximum component temperature 260+5/-0 for 10 seconds. Soldering Iron: 35010 within 3 seconds.
Land Pattern Design for Reflow Soldering is provided.
Environmental considerations: Not recommended for use in high temperature/humidity, corrosive environments (sea breeze, Cl2, H2S, NH3, SO2, NO2), unverified liquids, or with unverified sealing/coating materials. Cleaning after soldering with water-soluble detergents is recommended.
Transient Overload: Avoid transient currents exceeding product specifications.
Handling and Operation: Protect edges and protective layers from mechanical stress. Avoid bending the PCB. Operate within rated power limits. Consider pulse load impacts. Evaluate and confirm in actual application for fail-safe design.

Storage and Handling Conditions

Storage: 255, 6015% RH for two years. Avoid corrosive environments, direct sunlight, and condensation.
Handling: Ensure correct box orientation. Do not drop or crush boxes to prevent damage to electrodes or body.