Thick Film Array Chip Resistors RALEC RTA03-4D220JTP RoHS Compliant Lead Free Electronic Components
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
RTA Series Thick Film Array Chip Resistors
The RTA series resistors are lead-free, halogen-free, and RoHS compliant thick film array chip resistors designed for general electronic applications. They offer reliable performance and are manufactured to meet stringent quality standards.
Product Attributes
- Brand: RALEC
- Certifications: RoHS compliant, Lead-free, Halogen-free
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range | Number of Terminals | Number of Resistors | JUMPER (0) Rated Current | JUMPER (0) Resistance Max. |
|---|---|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1 W | 25V | 50V | 300 | 1R | 4 | 2 | 1A | 25m MAX. |
| RTA02-4D (0402) | 1 W | 25V | 50V | 300 | 1R | 8 | 4 | 1A | 25m MAX. |
| RTA02-8D (0402) | 1 W | 25V | 50V | 250 | 10R10M | 16 | 8 | 1A | 50m MAX. |
| RTA03-2D (0603) | 1 W | 50V | 100V | 200 | 10R10M | 4 | 2 | 1A | 50m MAX. |
| RTA03-4D (0603) | 1 W | 50V | 100V | 200 | 1R10M | 8 | 4 | 1A | 25m MAX |
| RTA02-2C (0402) | 1 W | 25V | 50V | 650 | 3R10 | 4 | 2 | 1A | 50m MAX. |
| RTA02-4C (0402) | 1 W | 25V | 50V | 400 | 1R | 8 | 4 | 1A | 50m MAX. |
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1.000.10 | 1.000.10 | 0.300.05 | 0.150.10 | 0.250.10 | (0.67) | 0.330.10 |
| RTA02-4D (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.200.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-8D (0402) | 4.000.20 | 1.600.10 | 0.400.10 | 0.300.15 | 0.300.10 | (0.50) | 0.250.10 |
| RTA03-2D (0603) | 1.600.15 | 1.600.15 | 0.450.10 | 0.300.15 | 0.300.15 | (0.80) | 0.600.10 |
| RTA03-4D (0603) | 3.200.20 | 1.600.15 | 0.500.10 | 0.300.15 | 0.300.15 | (0.80) | 0.500.10 |
| RTA02-2C (0402) | 1.000.10 | 1.000.10 | 0.300.10 | 0.180.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-4C (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.150.10 | 0.250.10 | (0.50) | 0.300.10 |
Structure Diagram
D(Convex) Type: 1. Ceramic substrate, 2. 2nd Protective coating, 3. Bottom inner electrode, 4. Top inner electrode, 5. Resistive layer, 6. 1st Protective coating, 7. Terminal inner electrode, 8. Marking, 9. Ni plating, 10. Sn plating
C(Concave) Type: 1. Ceramic substrate, 2. 2nd Protective coating, 3. Bottom inner electrode, 4. Top inner electrode, 5. Resistive layer, 6. 1st Protective coating, 7. Terminal inner electrode, 8. Marking, 9. Ni plating, 10. Sn plating
Reliability Test Items
Electrical Performance Test
| Item | Conditions | Specifications |
|---|---|---|
| Temperature Coefficient of Resistance | According to JIS-C5201-1 4.8 | Refer to 3. Specification Table |
| Short Time Overload | According to JIS-C5201-1 4.13 | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Insulation Resistance | According to JIS-C5201-1 4.6 | 109 |
| Dielectric Withstand Voltage | According to JIS-C5201-1 4.7 | No short circuit or burn |
| Intermittent Overload | According to JIS-C5201-1 4.13 | R=5.0% |
Mechanical Performance Test
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Solvent | According to JIS-C5201-1 4.29 | R=0.5% |
| Solderability | According to JIS-C5201-1 4.17 | Conductor tinning area > 95% |
| Resistance to Soldering Heat | According to JIS-C5201-1 4.18 | Test Item 1: R%=1.0%; Test Item 2: Conductor tinning area > 95%, no underlying material visible at electrode edge. |
| Joint Strength of Solder | According to JIS-C5201-1 4.33 | R%=1.0% |
Environmental Test
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Dry Heat | According to JIS-C5201-1 4.25 | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Thermal Shock | According to MIL-STD 202 Method 107 | R=1.0% |
| Loading Life in Moisture | According to JIS-C5201-1 4.24 | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
| Load Life | According to JIS-C5201-1 4.25 | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
Plating Thickness
- Nickel Layer (Ni): 2m
- Pure Tin Layer (Tin): 3m (Matte tin)
Technical Application Notes
- Recommended Soldering Conditions: Lead Free IR-Reflow Soldering Profile (J-STD-020 compliant), highest component temperature 260+5/-0 for 10 seconds. Soldering iron method: 35010 within 3 seconds.
- Recommended Land Pattern Design (For Reflow Soldering): Design considerations for resistance value changes due to soldering area and amount.
- Usage Environment Precautions: For general electronic use. RALEC is not responsible for damages in special environments. Confirmation required for applications in high temperature/humidity, corrosive environments (Cl2, H2S, NH3, SO2, NO2), unverified liquids, unverified sealing/coating materials, or post-soldering cleaning with water-soluble detergents.
- Transient Overload Precautions: Avoid transient overloads that may cause functional loss.
- Operation and Handling Precautions: Protect resistor edges and protective coating from mechanical stress. Avoid bending of PCB during assembly. Operate within rated power range. Consider pulse load impacts and implement fail-safe design.
Storage and Handling Conditions
- Storage: 255, 6015% RH for two years.
- Avoid: Sea breeze, corrosive gases (Cl2, H2S, NH3, SO2, NO2), direct sunlight, condensation.
- Handling: Maintain correct box orientation, avoid dropping or squeezing to prevent damage.
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina