Lead free RALEC RTA02-2D100JTH thick film array chip resistor with 0.5 percent tolerance resistance
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Product Description
RTA Series Thick Film Array Chip Resistors
The RTA series thick film array chip resistors are lead-free, halogen-free, and RoHS compliant, designed for general electronic applications. They offer reliable performance in a compact form factor.
Product Attributes
- Brand: RALEC
- Certifications: RoHS compliant
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range | Number of Terminals | Number of Resistors | Rated Current (Jumper 0) | Max. Resistance (Jumper 0) |
|---|---|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1 W | 25V | 50V | 300 | 1R | 4 | 2 | 1A | 25m MAX. |
| RTA02-4D (0402) | 1 W | 25V | 50V | 300 | 1R | 8 | 4 | 1A | 25m MAX. |
| RTA02-8D (0402) | 1 W | 25V | 50V | 250 | 10R10M (D:0.5%) | 16 | 8 | 1A | 50m MAX. |
| RTA03-2D (0603) | 1 W | 50V | 100V | 200 | 10R10M (D:0.5%) | 4 | 2 | 1A | 50m MAX. |
| RTA03-4D (0603) | 1 W | 50V | 100V | 200 | 22R470K (F:1%), 1R10M (D:0.5%), 1R10M (J:5%) | 8 | 4 | 1A | 25m MAX. |
| RTA02-2C (0402) | 1 W | 25V | 50V | 650 | 3R10 (D:0.5%), 10R | 4 | 2 | 1A | 50m MAX. |
| RTA02-4C (0402) | 1 W | 25V | 50V | 400 | 1R | 8 | 4 | 1A | 50m MAX. |
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1.000.10 | 1.000.10 | 0.300.05 | 0.150.10 | 0.250.10 | (0.67) | 0.330.10 |
| RTA02-4D (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.200.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-8D (0402) | 4.000.20 | 1.600.10 | 0.400.10 | 0.300.15 | 0.300.10 | (0.50) | 0.250.10 |
| RTA03-2D (0603) | 1.600.15 | 1.600.15 | 0.450.10 | 0.300.15 | 0.300.15 | (0.80) | 0.600.10 |
| RTA03-4D (0603) | 3.200.20 | 1.600.15 | 0.500.10 | 0.300.15 | 0.300.15 | (0.80) | 0.500.10 |
| RTA02-2C (0402) | 1.000.10 | 1.000.10 | 0.300.10 | 0.180.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-4C (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.150.10 | 0.250.10 | (0.50) | 0.300.10 |
Reliability Test (Electrical Performance)
| Item | Conditions | Specifications |
|---|---|---|
| Temperature Coefficient of Resistance | (R2-R1) / R1(T2-T1) 10 R1: Room temp. R2: -55 or +125 T1: Room temp. T2: -55 or +125 (Ref. JIS-C5201-1 4.8) | NA |
| Short Time Overload | Apply 2.5x rated voltage for 5 sec, rest 30 min. (Ref. Spec. Table 3) (Ref. JIS-C5201-1 4.13) | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Insulation Resistance | Apply 100 VDC for 1 min. (Ref. JIS-C5201-1 4.6) | 10 |
| Dielectric Withstand Voltage | Apply 300 VAC for 1 min. (Ref. JIS-C5201-1 4.7) | No short or burn |
| Intermittent Overload | 2.5x rated voltage, 1 sec ON, 25 sec OFF, 10,000 cycles. (Ref. JIS-C5201-1 4.13) | R=5.0% |
Reliability Test (Mechanical Performance)
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Solvent | Immerse in Isopropyl alcohol (20~25) for 50.5 min, rest 48 hrs. (Ref. JIS-C5201-1 4.29) | R=0.5% |
| Solderability | Pre-treatment: 4 hrs aging at 105, 100% RH, 1.2210 pa. Test: Immerse in 2355 solder for 20.5 sec. (Ref. JIS-C5201-1 4.17) | Soldered area > 95% |
| Resistance to Soldering Heat | Test 1: Immerse in 260+5/-0 solder for 10 sec+1/-0, rest 60 min. Test 2: Immerse in 260+5/-0 solder for 30 sec+1/-0, then clean. (Ref. JIS-C5201-1 4.18) | Test 1: R%=1.0%. Test 2: Soldered area > 95%, no underlayer visible at electrode edge. |
| Joint Strength of Solder | Bending test: Apply 5mm downward force at center of test board. (Ref. JIS-C5201-1 4.33) | R%=1.0% |
Reliability Test (Environmental)
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Dry Heat | 1555 oven for 10004 hr. (Ref. JIS-C5201-1 4.25) | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Thermal Shock | -55 (15 min) to +125 (15 min), 300 cycles. (Ref. MIL-STD 202 Method 107) | R=1.0% |
| Moisture Load | 402, 90~95% RH, 90 min ON, 30 min OFF, 1,000 hr. (Ref. JIS-C5201-1 4.24) | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
| Load Life | 702 oven, 90 min ON, 30 min OFF, 1,000 hrs. (Ref. JIS-C5201-1 4.25) | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
Plating Thickness
- Nickel Layer (Ni): 2m
- Pure Tin Layer (Sn): 3m (Matte Tin)
Technical Application Notes
- Recommended Soldering Conditions: Lead Free IR-Reflow Soldering Profile (J-STD-020 compliant), Max temp. 260+5/-0 for 10 sec. Soldering Iron: 35010 within 3 sec.
- Recommended Land Pattern Design for Reflow Soldering is provided for various types.
- Environmental Precautions: Not intended for special environments without confirmation. Avoid high temp/humidity, corrosive gases (Cl2, H2S, NH3, SO2, NO2), unverified liquids, unverified sealing/coating materials. Cleaning after soldering is recommended.
- Transient Overload: Be mindful of transient overloads that may cause functional loss.
- Handling and Operation: Avoid mechanical stress on resistor edges and protective layers. Be careful of PCB bending causing stress. Operate within rated power. Consider pulse load impacts. Evaluate and confirm in actual application for fail-safe design.
Storage and Handling Conditions
- Storage: 255, 6015% RH for two years.
- Avoid adverse environments: sea breeze, corrosive gases (Cl2, H2S, NH3, SO2, NO2), direct sunlight, condensation.
- Handle with care: maintain correct box orientation, avoid dropping or squeezing to prevent damage to electrodes or body.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina