Product Overview
This document specifies the Approval Specification for Metal Current Sensing Chip Resistors, Type: HI XD 25 N R001 F. These resistors are designed for high-power applications up to 3W, featuring low TCR down to 50ppm/. They are suitable for reflow and wave soldering, constructed with Halogen-Free Epoxy and Lead-Free Plating, offering superior mechanical strength and frequency characteristics. The resistors comply with RoHS standards.
Product Attributes
- Brand: (Changzhou Pengke Electronics)
- Origin: China
- Material: Metal Alloy
- Certifications: RoHS compliant, Halogen Free
Technical Specifications
| Series | Type Designation | Size | Rated Power | Resistance Range | TCR (ppm/) | Tolerance (%) | Operating Temperature Range () | Max. Operating Voltage (V) |
| 2512 | HI XD 25 N R001 F | 2512 | 2W/3W | 0m R 1m | 350 | 1, 2, 5 | -55 ~ +170 | (P*R) |
| | | | 1m | 100 | 1, 2, 5 |
| | | | 2m | 50 | 1, 2, 5 |
| 1206 | RC | 1206 | 1W | 0m R 2m | 350 | 1, 2, 5 | -55 ~ +170 | (P*R) |
| | | | 2m | 50 | 1, 2, 5 |
| 0805 | RE | 0805 | 0.5W | 5m R 15m | 50 | 0.5, 1, 2, 3, 5 | -55 ~ +170 | (P*R) |
Construction and Dimension (mm)
| Series | L | W | T | A (Electrode) |
| 2512 (DD) | 6.40.20 | 3.20.20 | 0.80.20 | 2.00.20 (R4 m) |
| 2512 (XD) | 6.40.20 | 3.20.20 | 0.80.20 | 1.00.20 (R0.5 m) |
| 1206 (RC) | 3.20.20 | 1.60.20 | 0.70.20 (0m R | 0.60.20 |
| | | 0.450.20 (10m | |
| 0805 (RE) | 2.00.10 | 1.250.10 | 0.50.20 | 0.350.20 |
Land Pattern Dimensions (mm)
| Series | a | b | L |
| 0805 RE | 1.5 | 1 | 1 |
| 1206 RC | 1.8 | 1.7 | 1.6 |
| 2512 XD | 4 | 2.1 | 4.1 |
| 2512 DD | 4 | 3.1 | 1.3 |
Reliability Tests
| Project | Test Method | Specifications and Requirements |
| Short Time Overload | 5 times rated power, maintain 5s | R 1%+0.05m |
| Insulation resistance | Apply 100V15V DC voltage between electrode and substrate, hold for 60 seconds, then measure insulation resistance | > 100 M |
| Withstand voltage | An alternating current with an effective value of the maximum overload voltage is applied between the electrode and the substrate at a rate of approximately 100V/S, maintaining 605s | No breakdown or arc |
| Solderability | 2455 tin tank, hold 2s0.5s | At least 95% of surface area of electrode shall be covered with new solder |
| Resistance to Soldering Heat | 2605 tin tank, hold for 10s1s | R (0.5%+0.05m ), no visible damage |
| Bending test | Bending distance 2mm, hold time 60s5s | R0.5%+0.05m , no mechanical damage |
| Solvent resistance | Isopropanol (IPA) at 235 for 10 hours | No obvious damage to appearance |
| High Temperature Exposure | 1702, 1000H | R (1.0%+0.05m ) |
| Low Temperature Exposure | -552, 1000H | R (0.5%+0.05m ) |
| Rapid change of Temperature | -55 30 minutes ~ normal temperature 5 minutes ~155 30 minutes, 1000 cycles | R (0.5%+0.05m ) |
| Load Life | 702, 1000 hours, rated power1.5 hours on / 0.5 hours off | R (1.0%+0.05m ) |
| Moisture with Load | 852, 85%3%RH, 1000 hours, rated power, 1.5 hours on / 0.5 hours off | R (1.0%+0.05m) |
Recommended Reflow Soldering Profile
| Parameter | Value |
| Solder | Sn96.5 / Ag3 / Cu0.5 |
| Peak Temperature | 240~260, 10 sec |
| Pre-heating Zone | 150 to 200 , 9030 sec |
| Soldering Zone | 230 or higher, 3010 sec |
Care Note for Storage
Store in a controlled environment (temperature 535, relative humidity 4575% RH). Avoid direct sunlight. Do not store in humid, dusty, or environments with harmful gases that degrade solderability (e.g., Hydrogen chloride, sulfurous acid gas, Hydrogen sulfide). Storage life: 1 year.
Care Note for Operating and Handling
Avoid exceeding rated power, as it may negatively impact performance and reliability. Handle with care using tweezers to prevent damage to the protective layer or resistance body. Do not touch the product with a soldering tip during manual installation.
