Current Sensing Chip Resistors RVR HIRC12AR180F Type 2512 1206 0805 Series with 1W to 3W Power Rating
Product Overview
This document outlines the specifications for Metal Current Sensing Chip Resistors, Type 2512/1206/0805 series. These resistors offer high power capabilities up to 3W, low TCR as 50ppm/, and are suitable for reflow and wave soldering. They feature Halogen-Free Epoxy, Lead-Free Plating, superior mechanical strength, excellent high-frequency characteristics, and are RoHS compliant. Applications include current sensing in various electronic devices.
Product Attributes
- Brand: (Changzhou Pengke Electronics)
- Origin: China
- Material: Metal Alloy
- Certifications: RoHS compliant, Halogen Free
Technical Specifications
| Series | Type Designation | Dimensions (L x W x T) | Rated Power | Resistance Range | TCR (Typical) | Tolerance | Operating Temp. Range | Max. Operating Voltage | Insulation Resistance | |
| 2512 | HI XD 25 N Rxxx F/G/J | 6.40.20 x 3.20.20 x 0.80.20 mm | 2W/3W | 0m R 1m | 350ppm/ | 1%, 2%, 5% | -55 ~ +170 | (P*R) | Over 100M | |
| 1206 | HI RC 12 M Rxxx F/G/J | 3.20.20 x 1.60.20 x 0.70.20 mm | 1W | 0m R 2m | 350ppm/ | 1%, 2%, 5% | ||||
| 0805 | HI RE 08 B Rxxx F/G/J | 2.00.10 x 1.250.10 x 0.50.20 mm | 0.5W | 5m R 15m | 50ppm/ | 1%, 2%, 5% | ||||
| Note: Specific resistance values (Rxxx) and their corresponding TCRs vary. Refer to Type Designation section for details. For resistance values > 0.5m, XD type is used for 2512. For resistance values > 1m, DD type is used for 2512. | ||||||||||
Reliability Tests
| Project | Test Method | Specifications and Requirements |
| Temperature coefficient (TCR) | Measured at 25(T1, R1) and 125(T2, R2) | Refer to TCR specifications |
| Short Time Overload | 5 times rated power, maintain 5s | R 1%+0.05m |
| Insulation resistance | Apply 100V15V DC between electrode and substrate for 60s | > 100 M |
| Withstand voltage | Apply AC voltage of max overload voltage between electrode and substrate at approx. 100V/S, hold for 605s | No breakdown or arc |
| Solderability | 2455 tin tank, hold 2s0.5s | At least 95% of electrode surface area covered with new solder |
| Resistance to Soldering Heat | 2605 tin tank, hold for 10s1s | R (0.5%+0.05m ), no visible damage |
| Bending test | Bending distance 2mm, hold time 60s5s | R0.5%+0.05m , no mechanical damage |
| Solvent resistance | Isopropanol (IPA) at 235 for 10 hours | No obvious damage to appearance |
| High Temperature Exposure | 1702, 1000H | R (1.0%+0.05m ) |
| Low Temperature Exposure | -552, 1000H | R (0.5%+0.05m ) |
| Rapid change of Temperature | -55 30 min ~ normal temp 5 min ~155 30 min, 1000 cycles | R (0.5%+0.05m ) |
| Load Life | 702, 1000 hours, rated power, 1.5 hours on / 0.5 hours off | R (1.0%+0.05m ) |
| Moisture with Load | 852, 85%3%RH, 1000 hours, rated power, 1.5 hours on / 0.5 hours off | R (1.0%+0.05m) |
Recommended Reflow Soldering Profile
| Parameter | Specification |
| Solder | Sn96.5 / Ag3 / Cu0.5 |
| Peak Temperature | 240~260, 10 sec |
| Pre-heating Zone | 150 to 200 , 9030 sec |
| Soldering Zone | 230 or higher, 3010 sec |
Care Notes
Storage: Store in controlled temperature (535) and humidity (4575% RH). Avoid direct sunlight, moisture, dust, and harmful gases. Storage life: 1 year.
Handling: Avoid exceeding rated power. Handle with care using tweezers to prevent damage. Do not touch the product with a soldering tip during manual installation.
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