power inductor Samsung Electro-Mechanics CIGT201610LMR68MNE with compact 2016 package and low resistance
Product Overview
The CIGT201610LMR68MNE is a high-efficiency power inductor (HEPI) designed for mobile phones, tablets, LCD & AMOLED displays, and storage applications. It features a monolithic structure for high reliability, low DC resistance, and a magnetically shielded structure. This inductor is free of all RoHS-regulated substances and is available in a 2016 size (2.0mm x 1.6mm) with a thickness of 1.0mm.
Product Attributes
- Type: High Current Type, Monolithic structure, Magnetically shielded structure
- Certifications: Free of all RoHS-regulated substances
- Product Identification Breakdown: CIG (Brand/Type), T (Power Inductor), 2016 (Dimension), 10 (Thickness), LM (Remark), R68 (Inductance), M (Tolerance), N (Internal Code), E (Packaging - embossed tape)
Technical Specifications
| Model | Size [inch/mm] | Thickness [mm] (max) | Inductance [uH] | Inductance tolerance (%) | DC Resistance [m] (Typ.) | Rated DC Current (Isat) [A] (Max.) | Rated DC Current (Irms) [A] (Max.) | Absolute Maximum Voltage (DC) | Operating Temperature Range (C) |
|---|---|---|---|---|---|---|---|---|---|
| CIGT201610LMR68MNE | 0806/2016 | 1.0 | 0.68 | 20 | 46 | 3.8 | 2.9 | 20V | -40 to +125C (Including self-temperature rise) |
| CIGT201610LMR68MNE | 2.0 x 1.6 | 1.0 | 0.68 | 20 | 53 (Max.) | 3.2 (Max.) | 2.7 (Max.) | N/A | N/A |
Recommended Land Pattern (Unit: mm)
| A | B | C |
|---|---|---|
| 0.8 | 0.8 | 1.8 |
Packaging
| Packaging Style | Quantity(pcs/reel) |
|---|---|
| Embossed Taping | 3000 |
Recommended Soldering Conditions
Reflow Soldering: T130, 3sec max. Preheating Temperature 150min. Peak 2605, 3 times.
Flow Soldering: Temperature Differential 130, Soldering Time 3sec max.
Iron Soldering: Wattage 50W max., Temperature of Soldering Iron Tip 280max.
Reliability Test Summary
Inductance change to be within 20% to the initial for all listed tests, unless otherwise specified. No mechanical damage is expected.
- Drop Test: Random Free Fall test on concrete plate. 1 meter, 10 drops.
- Terminal Adhesion Test: 0.5 kgf, 101 sec.
- Vibration Test: 10~55Hz, 1.5mm amplitude for 2 hours in each of three (X,Y,Z) axis (total 6 hours).
- Bending Test: Bending Limit: 2mm. Test Speed: 1.0mm/sec. Keep at limit point for 5 sec. (PCB thickness: 1.6mm)
- High Temperature Loading Test: 852, Rated Current for 50012 hours.
- Reflow Test: Peak 2605, 3 times.
- High Temperature Test: Exposure at 1252 for 50012 hours.
- High Temp. Humidity Resistance Loading Test: 852, 85%RH, Rated Current for 50012 hours.
- High Temp. Humidity Resistance Test: 852, 85%RH, for 50012 hours.
- Low Temperature Test: Exposure at -552 for 50012 hours.
- Resistance to Soldering: Dipped in flux (41 sec), preheated (150180 for 23 min), immersed in solder (2605 for 10 0.5 sec). Remaining terminal Electrode: 75% min.
- Solderability: Dipped in flux (41 sec), preheated (150180 for 23 min), immersed in solder (2455 for 41 sec). More than 90% of terminal electrode should be soldered newly.
- Thermal Shock (Temperature Cycle test): Repeat 100 cycles: -403 for 30 min 853 for 30 min.
- Ipeak (AC+DC Load Life): 852, 85%RH, Load(Ipeak) for 120 hours. (Frequency: 1MHz, Load(Ipeak): 1.5hr on / 0.5hr off). Load(Ipeak) = Irms(max)1.4.
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