Low DCR power inductor Samsung Electro-Mechanics CIGT201610LM2R2MNE for power management in mobile electronics
Price:
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The CIGT201610LM2R2MNE is a compact, monolithic metal composite power inductor designed for mobile devices and power converter modules. It features a low DCR structure for high efficiency and is manufactured with a thin-film, monolithic structure for enhanced reliability. This inductor is free of RoHS-regulated substances and is halogen-free, making it suitable for a wide range of electronic applications including smartphones, tablets, and wearable devices.
Product Attributes
- Certifications: RoHS-regulated substance-free, Halogen-free
Technical Specifications
| Model | Type | Dimensions (L x W x T) [mm] | Inductance [uH] | Inductance Tolerance (%) | DC Resistance (Typ.) [m] | Rated DC Current (Isat) [A] | Rated DC Current (Irms) [A] | Absolute Maximum Voltage [V] | Operating Temperature Range [C] |
|---|---|---|---|---|---|---|---|---|---|
| CIGT201610LM2R2MNE | 2016 / 0806 (Metal Composite Thin Film) | 2.0 x 1.6 x 1.0 | 2.2 | 20 | 154 (Max) / 128 (Typ.) | 1.0 (Typ.) | 1.6 (Typ.) | 20 | -40 to +125 |
Recommended Land Pattern (Unit: mm)
| A | B | C |
|---|---|---|
| 0.8 | 0.8 | 1.8 |
Packaging Information
| Type | Quantity (pcs/reel) | Dimensions (L x W x T) [mm] |
|---|---|---|
| Embossed Taping | 3000 | 2.0 0.2 x 1.6 0.2 x 1.0 max |
Reliability Test Results
| Reliability Test Item | Specified Value | Test Condition |
|---|---|---|
| Solderability | More than 90% of terminal electrode should be soldered newly. | Dipped in flux for 41 sec, preheated at 150180 for 23 min, immersed in solder at 2455 for 41 sec. |
| Resistance to Soldering | No mechanical damage. Remaining terminal Electrode: 75% min. Inductance change to be within 20% to the initial. | Dipped in flux for 41 sec, preheated at 150180 for 23 min, immersed in solder at 2605 for 10 0.5 sec. |
| Thermal Shock (Temperature Cycle test) | No mechanical damage. Inductance change to be within 20% to the initial. | Repeat 100 cycles: -403 for 30 min 853 for 30 min. |
| High Temp. Humidity Resistance Test | No mechanical damage. Inductance change to be within 20% to the initial. | 852, 85%RH, for 50012 hours. Measure after 24 hours at normal temp/humidity. |
| Low Temperature Test | No mechanical damage. Inductance change to be within 20% to the initial. | Solder on PCB. Exposure at -552 for 50012 hours. Measure after 24 hours at normal temp/humidity. |
| High Temperature Test | No mechanical damage. Inductance change to be within 20% to the initial. | Solder on PCB. Exposure at 1252 for 50012 hours. Measure after 24 hours at normal temp/humidity. |
| High Temp. Humidity Resistance Loading Test | No mechanical damage. Inductance change to be within 20% to the initial. | 852, 85%RH, Rated Current for 50012 hours. Measure after 24 hours at normal temp/humidity. |
| High Temperature Loading Test | No mechanical damage. Inductance change to be within 20% to the initial. | 852, Rated Current for 50012 hours. Measure after 24 hours at normal temp/humidity. |
| Reflow Test | No mechanical damage. Inductance change to be within 20% to the initial. | Peak 2605, 3 times. |
| Vibration Test | No mechanical damage. Inductance change to be within 20% to the initial. | Solder on PCB. Vibrate 10~55Hz, 1.5mm amplitude for 2 hours each in X, Y, Z axes (total 6 hours). |
| Bending Test | No mechanical damage. | Bending Limit: 2mm. Test Speed: 1.0mm/sec. Keep at limit point for 5 sec. PCB thickness: 1.6mm. |
| Drop Test | No mechanical damage. Inductance change to be within 20% to the initial. | Random Free Fall test on concrete plate. 1 meter, 10 drops. |
| Terminal Adhesion Test | No indication of peeling shall occur on the terminal electrode. | 0.5 kgf for 101 sec. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina