Samsung Electro Mechanics CIGT201610LM1R0MNE monolithic power inductor for mobile and power converter
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The CIGT201610LM1R0MNE is a monolithic, small power inductor designed for mobile devices and power converter modules. It features a low DCR structure for high efficiency in power circuits and is built with a monolithic structure for high reliability. This inductor is free of RoHS-regulated substances and is halogen-free. Its applications include smart phones, tablet PCs, wearable devices, and power converter modules.
Product Attributes
- Brand: CIG (implied by product identification)
- Type: Metal Composite Thin Film Type
- Certifications: RoHS-regulated substances free, Halogen free
Technical Specifications
| Model | Type | Dimension [mm] (L x W) | Thickness [mm] (T) | Inductance [uH] (Typ.) | Inductance Tolerance (%) | DC Resistance [m] (Max.) | Rated DC Current (Isat) [A] (Typ.) | Rated DC Current (Irms) [A] (Typ.) | Absolute Maximum Voltage [V] | Operating Temperature Range [C] |
|---|---|---|---|---|---|---|---|---|---|---|
| CIGT201610LM1R0MNE | 0806/2016 | 2.0 x 1.6 | 1.0 | 1.0 | 20 | 72 | 0.8 | 0.8 | DC 20 | -40 to +125 |
Measurement Conditions:
- Inductance: Measured with a LCR meter 4991A (Agilent) or equivalent (Test Freq. 1MHz, Level 0.1V).
- DC Resistance: Measured with a Resistance HI-TESTER 3541 (HIOKI) or equivalent.
- Maximum allowable DC current (Isat): Defined when DC current flows and the initial value of inductance has decreased by 30% (Reference: ambient temperature is 2510).
- Allowable current of temperature rise (Irms): Specified when temperature of the inductor is raised 40 by DC current (Reference: ambient temperature is 2510).
Recommended Land Pattern (Unit: mm):
| A | B | C |
|---|---|---|
| 0.8 | 0.8 | 1.8 |
Recommended Soldering Condition:
- Reflow Soldering: Preheating Temperature 150 min., Temperature Differential T130, Soldering Time 3sec max., Peak 2605.
- Flow Soldering: Soldering Time 3sec max.
- Iron Soldering: Temperature of Soldering Iron Tip 280 max., 50W max.
Packaging:
- Embossed Taping Packaging Style
- Quantity: 3000 pcs/reel
Reliability Test Item:
| Test Item | Specified Value | Test Condition |
|---|---|---|
| Solderability | More than 90% of terminal electrode should be soldered newly. | After being dipped in flux for 41 seconds, and preheated at 150180 for 23 min, the specimen shall be immersed in solder at 2455 for 41 seconds. |
| Resistance to Soldering | No mechanical damage. Remaining terminal Electrode: 75% min. Inductance change to be within 20% to the initial. | After being dipped in flux for 41 seconds, and preheated at 150180 for 23 min, the specimen shall be immersed in solder at 2605 for 10 0.5 seconds. |
| Thermal Shock (Temperature Cycle test) | No mechanical damage Inductance change to be within 20% to the initial. | Repeat 100 cycles under the following conditions: -403 for 30 min 853 for 30 min |
| High Temp. Humidity Resistance Test | No mechanical damage Inductance change to be within 20% to the initial. | 852, 85%RH, for 50012 hours. Measure after 24 hours at normal temperature and humidity. |
| Low Temperature Test | No mechanical damage Inductance change to be within 20% to the initial. | Solder the sample on PCB. Exposure at -552 for 50012 hours. Measure after 24 hours at normal temperature and humidity. |
| High Temperature Test | No mechanical damage Inductance change to be within 20% to the initial. | Solder the sample on PCB. Exposure at 1252 for 50012 hours. Measure after 24 hours at normal temperature and humidity. |
| High Temp. Humidity Resistance Loading Test | No mechanical damage Inductance change to be within 20% to the initial. | 852, 85%RH, Rated Current for 50012 hours. Measure after 24 hours at normal temperature and humidity. |
| High Temperature Loading Test | No mechanical damage Inductance change to be within 20% to the initial. | 852, Rated Current for 50012 hours. Measure after 24 hours at normal temperature and humidity. |
| Reflow Test | No mechanical damage Inductance change to be within 20% to the initial. | Peak 2605, 3 times. |
| Vibration Test | No mechanical damage Inductance change to be within 20% to the initial. | Solder the sample on PCB. Vibrate as apply 10~55Hz, 1.5mm amplitude for 2 hours in each of three (X,Y,Z) axis (total 6 hours). |
| Bending Test | No mechanical damage | Bending Limit; 2mm. Test Speed; 1.0mm/sec. Keep the test board at the limit point in 5 sec. PCB thickness : 1.6mm |
| Drop Test | No mechanical damage Inductance change to be within 20% to the initial. | Random Free Fall test on concrete plate. 1 meter, 10 drops. |
| Terminal Adhesion Test | No indication of peeling shall occur on the terminal electrode. | W(kgf): 0.5, TIME(sec): 101 |
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina