Monolithic Multilayer Ceramic Capacitor SAMWHA CS1608X7R105K160NRB Thin Layer Type for Communication Equipment

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Product Description

SAMWHA MONOLITHIC MULTILAYER CERAMIC CAPACITOR

This document details the specifications for the SAMWHA Monolithic Multilayer Ceramic Capacitor, Thin Layer Large-Capacitance Type. Designed for high reliability, these capacitors are primarily used in computer equipment, communication equipment, industrial equipment, and high reliability LED equipment. They offer advanced thin-layer technology for large capacitance in a compact form factor.

Product Attributes

Brand: SAMWHA CAPACITOR CO., LTD.
Origin: KOREA
Model Number: M171222
Part Number: CS1608X7R105K250NRB
Type: Thin Layer Large-Capacitance Monolithic Multilayer Ceramic Capacitor (Leadless Type)
Date: 2017. 12. 22.
Standard: SW - M - 04B

Technical Specifications

SAMWHA Part No.	Type	Capacitance	Capacitance Tolerance	Dissipation Factor	Insulation Resistance	Chip Size (L x W x T)	Operating Temperature Range	Rated Voltage
CS1608X7R105K250NRB	Thin Layer Large-Capacitance	1	10 %	Max. 12.5 %	More than 50	1.60 0.15 x 0.80 0.10 x 0.80 0.10 mm	X7R: -55 to +125	250V DC

Detailed Specifications

Item	Specification	Test Methods and Conditions
Capacitance	1	Frequency: 1 0.1kHz, Testing Voltage: 1 0.2Vrms
Capacitance Tolerance	10 %
Dissipation Factor	Max. 12.5 %
Insulation Resistance	More than 50	Applied the rated voltage for 2 minutes of charging.
Chip Size	L: 1.60 0.15 mm, W: 0.80 0.10 mm, T: 0.80 0.10 mm
Operating Temperature Range	X7R: -55 to +125
Dielectric Strength	No defects or abnormalities	Rated voltage 250% - Applied between terminations for 1 to 5 seconds. Charge/discharge current
Capacitance Measurement	Within specified tolerance	Measured at 25. Capacitance: C 10 @ 1 0.1kHz, 0.5~1.0Vrms; C > 10 @ 120 24Hz, 0.50.1Vrms. Initial measurement per Note1 for Class II. Measurement after 242 hours at 25.
Dissipation Factor (X7R, X5R)	12.5%max
Solderability of Termination	Termination covered with >75% new solder	*Pb-Free type: Solder 96.5Sn-3Ag-0.5Cu, Temp: 2455, Immersion: 30.1sec. Pre-Heating: 80~120 for 10~30sec.
Resistance to Soldering Heat	Appearance: No marking defects	Preheat: 120~150 for 1 min. Immerse in solder: 2605 for 100.5 sec. Measurement after 242 hours at room temp.