Product Overview
This document is an acknowledgement for the Common Mode Choke, model SRCM.4532.510NT00, manufactured by Shenzhen Sorvida Electronics Co., Ltd. It details the product's specifications, dimensions, materials, electrical characteristics, and reliability testing.
Product Attributes
- Brand: SRD
- Origin: Shenzhen, China
- Product Type: Common Mode Choke
Technical Specifications
| Part Number | Impedance ()[10MHz] 25% | Inductance(uH) [100KHz/0.1V] +50%/-30% | DCR Max.() | Rated Voltage V (max.) | Rated Current (mA)(max.) |
| SRCM.4532.510NT00 | 2800 | 51 | 1.0 | 50 | 200 |
Dimensions (mm)
| Parameter | Value (mm) | Value (inch) |
| A | 4.50.2 | Ref |
| B | 3.20.2 | Ref |
| C | 2.80.2 | Ref |
| D1 | 1.00.1 | Ref |
| D2 | 1.20.1 | Ref |
| L | 4.8 | Ref |
| H | 3.8 | Ref |
| G1 | 2.5 | Ref |
| G2 | 0.7 | Ref |
Materials
| No. | Item | Material |
| 1 | Core | Ni-Zn Ferrite |
| 2 | Solder | Sn-0.7Cu |
| 3 | Wire | Copper Wire P180-G1 |
Product Name Composition
SRCM 4532 510 N T 00
- a: Series name
- b: Product dimensions (A x B x C)
- c: Inductance Value
- d: Inductance Tolerance
- e: Package (T: Tape/Reel, B: Bulk)
- f: Numbering (standard)
Testing Conditions
Standard: Temperature: 5 to 35, Humidity: 25 to 85% RH, Atmospheric pressure: 86 to 106 kPa
Doubtful Measurement: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric pressure: 86 to 106 kPa
Packaging
Tape Dimensions (mm)
| Series | W | P | P0 | P1 |
| SRCM.4532 | 12.00.1 | 8.00.1 | 4.00.1 | 2.00.1 |
Reel Dimensions (mm)
| A | B | C | D | E |
| 1782 | 602 | 13.50.5 | 21.00.8 | 2.00.5 |
Carrier Tape Dimensions (mm)
Cover Tape Peel Strength
- Test Condition: 1) Peel Angle: 165~180 vs. carrier tape. 2) Peel Speed: 300 mm/min10%
- Strength: 0.3~0.7N (30gf~70gf)
Packaging Quantity
| Item | Quantity (PCS) | Dimensions (mm) |
| Reel | 500 | 7 |
| Inner Box | 2000 | 185mm*185mm*120mm |
| Outer Box | 20000 | 395mm*385mm*205mm |
Reliability Testing
1. Solder-Ability
| Specifications | Test Methods |
| More than 90% of termination should be covered with new solder. | Solder: Sn, Temperature: 255+5/-0, Flux: rosin, Duration: 3.50.5s |
2. Leaching Resistance
| Specifications | Test Methods |
| More than 75% of termination Should be covered with new solder. | Solder: Sn, Temperature:270+2/-0, Flux: rosin, Duration: 100.5s |
3. Drop
| Specifications | Test Methods |
| No mechanical damage shall be noticed Impedance shall be within 20% of the initial value | Drop 10 times on a concrete floor from a height of 1m. |
4. Vibration
| Specifications | Test Methods |
| - | Frequency: 10 to 55Hz, Amplitude: 1.52mm, Direction and time: X, Y and Z directions for 2 hours each. |
5. Humidity Resistance
| Specifications | Test Methods |
| a. Test condition: Temp. 405, Humidity: 90%~95%, Test time: 50012hr. b. Measurement method: The component should be stabilized at normal condition for 24 hours before test. | - |
6. High Temperature Resistance
| Specifications | Test Methods |
| a. Test condition: Applied rated current, Temp. 855, Test time: 50012hr. b. Measurement method: The component should be stabilized at normal condition for 24 hours before test. | - |
7. Low Temperature Resistance
| Specifications | Test Methods |
| No mechanical damage shall be noticed Impedance shall be within 20% of the initial value | a. Test condition: Temp. -405, Test time: 50012hr. b. Measurement method: The component should be stabilized at normal condition for 24 hours before test. |
8. Thermal Shock
| Specifications | Test Methods |
| a. Test condition: 1) Temp. -40, time: 303min 2) Temp. +85, time: 303min, 100 cycles b. Measurement method: The component should be stabilized at normal condition for 24 hours before test. | - |
