Low Resistance Metal Alloy Resistor TT Electronics LRMAP2512-R005FT4 with High Power Rating at 70C
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Product Description
Low Resistance Metal Alloy Resistor LRMA Series
The LRMA Series Low Resistance Metal Alloy Resistors are designed for high-performance current sensing applications in power electronics. They offer a wide resistance range from 0.5m to 500m, high temperature operation up to 170C, and are available in standard, power, and low thermal EMF versions. These resistors are RoHS compliant, halogen-free, and AEC-Q200 qualified, ensuring reliability and suitability for demanding automotive and industrial environments. Their construction with a low TCR resistance alloy plate and copper electrode with nickel then tin plating contributes to excellent stability and performance.
Product Attributes
- Brand: TT Electronics (BI Technologies, IRC, Welwyn)
- Material: Metal Alloy (Cu-Ni / Mn-Cu)
- Certifications: RoHS compliant & halogen free, AEC-Q200 qualified
- Color: Not specified
- Origin: Not specified
Technical Specifications
| Version | Size | Resistance Range (m) | Power Rating @70C (W) | Overload Rating (5s) (W) | Resistance Tolerance (%) | TCR (25 to 125C) (ppm/C) | Element Alloy |
| T (Standard) | 2512 | 1 to 100 | R01: 2, >R01: 1 | R01: 10, >R01: 5 | 0.51, 1, 5 | R01: 75 | Cu-Ni / Mn-Cu |
| T (Standard) | 2010 | 0.5 to 500 | R10: 3, >R10: 2 | R10: 15, >R10: 10 | 0.51, 1, 5 | >R001 & <R01: 100, R 001: 275 | Cu-Ni |
| P (Power) | 2512 | 1 to 100 | R01: 2, >R01: 1 | R01: 10, >R01: 5 | 0.51, 1, 5 | R01: 75, 100 | Mn-Cu |
| M (Low thermal EMF) | 1206 | 0.5 to 50 | 1 | 5 | 0.51, 1, 5 | >R001 & <R01: 100, R 001: 275 | Mn-Cu |
| M (Low thermal EMF) | 0805 | 0.5 to 50 | 0.5 | 3 | 0.51, 1, 5 | <R001: 200, R001: 50 | Mn-Cu / Cu-Ni |
| M (Low thermal EMF) | 2512 | 1 to 50 | 2.5 | 15 | 0.51, 1, 5 | 50 | Mn-Cu / Cu-Ni |
| M (Low thermal EMF) | 1225 | 3 to 30 | 2 | 10 | 0.51, 1, 5 | 50 | Mn-Cu / Cu-Ni |
| M (Low thermal EMF) | 0612 | 2 to 40 | 1 | 5 | 0.51, 1, 5 | 50 | Mn-Cu / Cu-Ni |
| N (Inverse) | 0815 | 1 to 10 | 1 | 5 | 0.51, 1, 5 | R01: 75, 100 | Cu-Ni / Mn-Cu |
Performance Data
| Parameter | Condition | Max (%) | Typical (%) |
| Load at rated power (1000 hours at 70C) | R | 0805: 1.5 Others: 1 | 0805: 1 Others: 0.5 |
| Short term overload (5 x rated power for 5s) | R | 0805: 1.5 Others: 0.5 | 0805: 1 Others: 0.15 |
| Humidity (1000 hours, 85C, 85%RH) | R | 0.15 | 0.15 |
| Temperature cycle (-40 to +125C, 1000 cycles) | R | 0.15 | 0.15 |
| Resistance to solder heat (260C for 20s) | R | 0.5 | 0.3 |
| Dry heat (1000 hours at 170C) | R | 0.3 | 0.3 |
| Low temperature storage (1000 hours at -55C) | R | 0.5 | 0.15 |
| Substrate bending | R | 0.3 | 0.3 |
| Insulation resistance | 1 minute @ 100Vdc | >100M | N/A |
| Solderability (245C for 2s) | >95% coverage | N/A | N/A |
Physical Data
| Size | L (mm) | C (mm) | t (mm) | Wt (mg) |
| 0805 | 2.0 0.1 | 1.70.2 | 0.4 0.2 | 5.0 |
| 1206 | 3.2 0.2 | 2.1 0.25 | 0.6 0.2 | 18.3 |
| 0612 | 1.25 0.1 | 0.5 0.3 | 0.5 0.2 | 12.9 |
| 0815 | 2.6 0.2 | 0.40.2 | 0.6 0.3 | 14.1 |
| 2010 | 3.2 0.2 | 0.5 0.2 | 0.7 0.2 | 35.6 |
| 2512 | 5.0 0.2 | 0.6 0.2 | 0.6 0.2 | 57 to 63 |
| 1225 | 3.2 0.3 | 0.5 0.2 | 0.65 0.25 | 70 |
Packaging
| Size | Tape Type | A (mm) | B (mm) | W (mm) | F (mm) | E (mm) | P1 (mm) | P2 (mm) | P0 (mm) | D0 (mm) | t (mm) | A (mm) | B (mm) | C (mm) | Wr (mm) | Tr (mm) |
| 0612, 1206 | Paper | 1.6 0.15 | 2.8 0.2 | 5.3 0.2 | 12 0.05 | 5.5 0.05 | 1.75 0.1 | 4.0 0.1 | 2.0 0.05 | 4.0 0.05 | 0.85 0.15 | 2.4 0.2 | 8.0 0.2 | 3.5 0.05 | 1.75 0.1 | 4.0 0.1 |
| 0805 | Paper | 2.0 0.1 | 2.8 0.2 | 5.3 0.2 | 12 0.05 | 5.5 0.05 | 1.75 0.1 | 4.0 0.1 | 2.0 0.05 | 4.0 0.05 | 0.84 0.1 | 2.4 0.2 | 8.0 0.2 | 3.5 0.05 | 1.75 0.1 | 4.0 0.1 |
| 2010 | Paper | 2.0 0.1 | 2.8 0.2 | 5.3 0.2 | 12 0.05 | 5.5 0.05 | 1.75 0.1 | 4.0 0.1 | 2.0 0.05 | 4.0 0.05 | 0.84 0.1 | 2.4 0.2 | 8.0 0.2 | 3.5 0.05 | 1.75 0.1 | 4.0 0.1 |
| 0815 | Emboss | 2.6 0.2 | 4.5 0.2 | 12 0.2 | 5.5 0.1 | 1.75 0.1 | 4.0 +-0.1 | 2.0 0.2 | 4.0 0.1 | 1.55 0.05 | 1.1 0.1 | N/A | N/A | N/A | N/A | N/A |
| 2512 | Emboss | 3.6 0.2 | 6.9 0.2 | 12 0.2 | 5.5 0.05 | 1.75 0.1 | 4.0 0.1 | 2.0 0.05 | 4.0 0.05 | 1.5 +0.1/-0 | 0.85 0.15 | N/A | N/A | N/A | N/A | N/A |
| 1225 | Emboss | 3.6 0.2 | 6.9 0.2 | 12 0.2 | 5.5 0.05 | 1.75 0.1 | 4.0 0.1 | 2.0 0.05 | 4.0 0.05 | 1.5 +0.1/-0 | 0.85 0.15 | N/A | N/A | N/A | N/A | N/A |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina