High Reliability Aluminum Electrolytic Capacitors VISHAY MAL215097101E3 for Telecom and Industrial
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Product Description
Vishay BC Components 150 CRZ Aluminum Electrolytic Capacitors
The Vishay BC Components 150 CRZ series offers polarized aluminum electrolytic capacitors with a non-solid electrolyte and self-healing properties. Designed for SMD technology with a base plate, these capacitors are lead (Pb)-free reflow solderable and are suitable for advanced high-temperature reflow soldering according to JEDEC J-STD-020. They feature very low impedance, high ripple current capability, and are charge and discharge proof with no peak current limitation. The series is also vibration proof in 4-pin and 6-pin versions and AEC-Q200 qualified, offering high reliability and low ESR.
Product Attributes
- Brand: Vishay BC components
- Product Type: Aluminum Electrolytic Capacitors
- Technology: SMD (Chip), Very Low Z
- Certifications: AEC-Q200 qualified
- Material Compliance: Refer to www.vishay.com/doc?99912 for material categorization
- Marking: Rated capacitance (F), Rated voltage (V), Date code (IEC 60062), Cathode indicator (black mark or - sign), Group number code (Z)
Applications
- SMD technology for high temperature reflow soldering
- Industrial and professional applications
- Automotive, general industrial, telecom
- Smoothing, filtering, buffering
Technical Specifications
| Series | Nominal Case Sizes (L x W x H in mm) | Rated Capacitance Range (CR) | Tolerance on CR | Rated Voltage Range (UR) | Category Temperature Range | Endurance Test at 105 C | Useful Life at 105 C |
| 150 CRZ | 8 x 8 x 10 to 18 x 18 x 21 | 4.7 F to 10 000 F | 20 % | 6.3 V to 100 V | 6.3 V to 63 V: -55 C to +105 C 80 V to 100 V: -40 C to +105 C | 2000 h to 8000 h | 2500 h to 10 000 h |
Dimensions and Mass
| Nominal Case Size (L x W x H) | Case Code | LMAX. (mm) | WMAX. (mm) | HMAX. (mm) | D (mm) | BMAX. (mm) | S (mm) | L1MAX. (mm) | Mass (g) |
| 8 x 8 x 10 | 0810 | 8.5 | 8.5 | 10.5 | 8.0 | 1.0 | 2.2 | 10.2 | 1.0 |
| 10 x 10 x 10 | 1010 | 10.5 | 10.5 | 10.5 | 10.0 | 1.0 | 3.5 | 12.1 | 1.3 |
| 10 x 10 x 12 | 1012 | 10.5 | 10.5 | 12.5 | 10.0 | 1.0 | 3.5 | 12.1 | 1.5 |
| 10 x 10 x 14 | 1014 | 10.5 | 10.5 | 14.3 | 10.0 | 1.0 | 3.5 | 12.1 | 1.5 |
| 12.5 x 12.5 x 13 | 1213 | 12.9 | 12.9 | 14.0 | 12.5 | 1.3 | 3.6 | 14.9 | 2.6 |
| 12.5 x 12.5 x 16 | 1216 | 12.9 | 12.9 | 16.5 | 12.5 | 1.3 | 3.6 | 14.9 | 2.8 |
| 16 x 16 x 16 | 1616 | 16.6 | 16.6 | 17.5 | 16.0 | 1.3 | 6.5 | 18.6 | 5.5 |
| 16 x 16 x 21 | 1621 | 16.6 | 16.6 | 22.0 | 16.0 | 1.3 | 6.5 | 18.6 | 6.0 |
| 18 x 18 x 16 | 1816 | 19.0 | 19.0 | 17.5 | 18.0 | 1.3 | 6.5 | 21.0 | 8.0 |
| 18 x 18 x 21 | 1821 | 19.0 | 19.0 | 22.0 | 18.0 | 1.3 | 6.5 | 21.0 | 8.3 |
Packaging Quantities
| Nominal Case Size (L x W x H) | Case Code | Pitch P1 (mm) | Tape Width W (mm) | Tape Thickness T2 (mm) | Reel Diameter (mm) | Packaging Quantity Per Reel |
| 8 x 8 x 10 | 0810 | 16 | 24 | 11.6 | 380 | 500 |
| 10 x 10 x 10 | 1010 | 16 | 24 | 11.6 | 380 | 500 |
| 10 x 10 x 12 | 1012 | 16 | 24 | 12.8 | 330 | 250 |
| 10 x 10 x 14 | 1014 | 16 | 24 | 15.4 | 330 | 250 |
| 12.5 x 12.5 x 13 | 1213 | 20 | 24 | 16.2 | 380 | 250 |
| 12.5 x 12.5 x 16 | 1216 | 24 | 32 | 18.5 | 380 | 200 |
| 16 x 16 x 16 | 1616 | 28 | 44 | 18.9 | 380 | 150 |
| 16 x 16 x 21 | 1621 | 28 | 44 | 23.4 | 380 | 100 |
| 18 x 18 x 16 | 1816 | 32 | 44 | 18.9 | 380 | 125 |
| 18 x 18 x 21 | 1821 | 32 | 44 | 23.4 | 380 | 100 |
Recommended Soldering Pad Dimensions
| Case Code | a (mm) | b (mm) | c (mm) | d (mm) | e (mm) | f (mm) |
| 0810 | 4.4 | 2.5 | 3.0 | - | - | - |
| 1010 | 4.4 | 2.5 | 4.0 | - | - | - |
| 1012 | 4.4 | 2.5 | 4.0 | - | - | - |
| 1014 | 4.4 | 2.5 | 4.0 | - | - | - |
| 1213 | 6.3 | 2.5 | 4.0 | 4.2 | 5.0 | 5.6 |
| 1216 | 6.3 | 2.5 | 4.0 | 4.2 | 5.0 | 5.6 |
| 1616 | 7.8 | 9.6 | 4.7 | - | - | - |
| 1621 | 7.8 | 9.6 | 4.7 | - | - | - |
| 1816 | 8.8 | 9.6 | 4.7 | - | - | - |
| 1821 | 8.8 | 9.6 | 4.7 | - | - | - |
Reflow Soldering Conditions (Standard Profile)
| Profile Features | Case Code 0810 to 1014 | Case Code 1213 to 1216 |
| Max. time from 25 C to Tpeak | 240 s | 200 s |
| Max. ramp-up rate to 150 C | 3 K/s | 3 K/s |
| Max. time from 150 C to 200 C (t1) | 150 s | 120 s |
| Ramp up rate from 200 C to Tpeak | 0.5 K/s to 3 K/s | 0.5 K/s to 3 K/s |
| Max. time from 200 C to 217 C (t2) | 60 s | 60 s |
| Max. time above TLiquidus (217 C) (t3) | 90 s | 60 s |
| Max. time above 230 C (t4) | 40 s | 30 s |
| Peak temperature Tpeak | 250 C | 240 C |
| Max. time above Tpeak minus 5 C | 5 s | 10 s |
| Max. ramp-down rate from TLiquidus | 3 K/s to 6 K/s | 3 K/s to 6 K/s |
Reflow Soldering Conditions (Advanced Profile - JEDEC J-STD-020)
| Profile Features | Case Code 1010 to 1012 | Case Code 1213 to 1216 | Case Code 1616 to 1821 |
| Max. time from 25 C to TPeak | 300 s | 300 s | 300 s |
| Max. ramp-up rate to 150 C | 3 K/s | 3 K/s | 3 K/s |
| Max. time from 150 C to 200 C (t1) | 150 s | 150 s | 150 s |
| Max. time from 190 C to 200 C (t2) | 110 s | 110 s | 110 s |
| Ramp up rate from 200 C to TPeak | 0.5 K/s to 3 K/s | 0.5 K/s to 3 K/s | 0.5 K/s to 3 K/s |
| Max. time above TLiquidus (217 C) | (Data truncated in source) | (Data truncated in source) | (Data truncated in source) |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina