Lead Free Thick Film Chip Resistor VO 2512 ±5% 43Ω RoHS Compliant Suitable for Various Applications
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Product Description
Product Overview
The SCR series of thick film chip resistors are lead-free and halogen-free, designed for general-purpose applications. They are manufactured by Anhui Xiang Sheng Technology Co., Ltd. and comply with RoHS requirements for lead-free termination electrodes, with lead in the resistive layer glass material being exempt.
Product Attributes
- Brand: Vicovo (implied by website and service hotline)
- Origin: Anhui, China
- Material: Thick Film
- Certifications: RoHS compliant
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range (F/D 1%/0.5%) | Resistance Range (J 5%) | JUMPER (0) Resistance | Operating Temperature Range |
| 0201 | 1/16W | 25V | 50V | ±400 | 1≤R<9.1 | 1≤R<9.1 | 50mΩ MAX. | -55~ +125 |
| 0402 | 1/8W | 50V | 100V | ±100 | 10Ω≤R<1MΩ | --- | 50mΩ MAX. | -55~ +155 |
| ±400 | 1Ω≤R<9.1Ω | 1Ω≤R<9.1Ω | ||||||
| ±200 | 1MΩ≤R≤10MΩ | 10Ω≤R≤10MΩ | ||||||
| 0603 | 1/10W | 75V | 150V | ±100 | 10Ω≤R<1MΩ | --- | 50mΩ MAX. | -55~ +155 |
| ±400 | 1Ω≤R<9.1Ω | 1Ω≤R<9.1Ω | ||||||
| ±200 | 1MΩ≤R≤10MΩ | 10Ω≤R≤10MΩ | ||||||
| 0805 | 1/8W | 150V | 300V | ±100 | 10Ω≤R<1MΩ | --- | 50mΩ MAX. | -55~ +155 |
| ±400 | 1Ω≤R<9.1Ω | 1Ω≤R<9.1Ω | ||||||
| ±200 | 1MΩ≤R≤10MΩ | 10Ω≤R≤10MΩ | ||||||
| 1206 | 1/4W | 200V | 400V | ±100 | 10Ω≤R<1MΩ | --- | 50mΩ MAX. | -55~ +155 |
| ±400 | 1Ω≤R<9.1Ω | 1Ω≤R<9.1Ω | ||||||
| ±200 | 1MΩ≤R≤10MΩ | 10Ω≤R≤10MΩ | ||||||
| 1210 | 1/2W | 200V | 400V | ±100 | 10Ω≤R<1MΩ | --- | 50mΩ MAX. | -55~ +155 |
| ±400 | 1Ω≤R<9.1Ω | 1Ω≤R<9.1Ω | ||||||
| ±200 | 1MΩ≤R≤10MΩ | 10Ω≤R≤10MΩ | ||||||
| 2010 | 3/4W | 200V | 400V | ±100 | 10Ω≤R<1MΩ | --- | 50mΩ MAX. | -55~ +155 |
| ±400 | 1Ω≤R<9.1Ω | 1Ω≤R<9.1Ω | ||||||
| ±200 | 1MΩ≤R≤10MΩ | 10Ω≤R≤10MΩ | ||||||
| 2512 | 1W | 200V | 400V | ±100 | 10Ω≤R<1MΩ | --- | 50mΩ MAX. | -55~ +155 |
| ±400 | 1Ω≤R<9.1Ω | 1Ω≤R<9.1Ω | ||||||
| ±200 | 1MΩ≤R≤10MΩ | 10Ω≤R≤10MΩ |
| Type | L (mm) | W (mm) | H (mm) | L1 (mm) | L2 (mm) |
| 0201 | 0.60±0.03 | 0.3±0.03 | 0.23±0.03 | 0.10±0.05 | 0.15±0.05 |
| 0402 | 1.00±0.10 | 0.50±0.05 | 0.30±0.05 | 0.20±0.10 | 0.25±0.10 |
| 0603 | 1.60±0.10 | 0.80±0.10 | 0.45±0.10 | 0.30±0.15 | 0.25±0.15 |
| 0805 | 2.00±0.10 | 1.25±0.10 | 0.50±0.10 | 0.35±0.20 | 0.35±0.20 |
| 1206 | 3.05±0.10 | 1.55±0.10 | 0.50±0.10 | 0.45±0.20 | 0.40±0.20 |
| 1210 | 3.05±0.10 | 2.60±0.15 | 0.55±0.10 | 0.45±0.20 | 0.50±0.20 |
| 2010 | 5.00±0.10 | 2.50±0.15 | 0.55±0.10 | 0.45±0.20 | 0.50±0.20 |
| 2512 | 6.35±0.10 | 3.10±0.15 | 0.55±0.10 | 0.60±0.20 | 0.50±0.20 |
| Item | Conditions | Specifications |
| Temperature Coefficient of Resistance | TCR (ppm / ℃) = (R2R1) / R1(T2T1)106 R1: Resistance at room temp (℉) R2: Resistance at -55 or +125 (℉) T1: Room temp (℃) T2: -55 or +125 (℃) | According to JIS-C5201-1 4.8 |
| Short Time Overload | Apply 2.5 times rated voltage for 5 sec, rest 30 min, then measure resistance change. | Resistors: ≥1Ω: 0.5%/1%: ±(1.0%+0.05℉>) 5%: ±(2.0%+0.10℉>) Jumper: No damage, no short or burn. |
| Intermittent Overload | In oven, apply 2.5 times rated voltage, 1 sec ON, 25 sec OFF, 10000+400/-0 cycles, rest 60 min, then measure resistance change. | Resistors: ≥1Ω: ±(5.0%+0.10℉>) <1Ω: ±(5.0%+0.001℉>) No damage, no short or burn. |
| Terminal Strength | Test 1: Solder resistor on PCB, apply 5N force on back for 10 sec, check side conductor. Test 2: Solder resistor on PCB, gradually apply force on back, test max peel strength. | Test 1: No damage, no side conductor detachment, no body fracture. Test 2: Pull force ≥5N |
| Resistance to Solvent | Immerse in 20~25 Isopropyl alcohol for 5±0.5 min, rest 48 hr, then measure resistance change. | All Types: ΔR% ±(1.0%+0.05℉>) No damage, no leaching of protective coating or tin layer. |
| Solderability | Pre-treatment: 4 hrs aging at 105, 100% RH, 1.22x105 pa. Rest 2 hrs at room temp. Method: Immerse in 235±5 furnace for 2 sec. | Solder coverage area should be >95%. |
| Resistance to Soldering Heat | Test 1 (Soldering Pot): Immerse in 260+5/-0 tin pot for 10 sec+1/-0, rest 60 min, measure resistance change. Test 2 (Soldering Pot): Immerse in 260+5/-0 tin pot for 30 sec+1/-0, clean, observe solder area. Test 3 (Soldering Iron): Heat temp: 350±10, time: 3 sec+1/-0. Heat electrodes, rest 60 min, measure resistance change. | Test 1: Resistance change: ≥1Ω: ΔR%=±(1.0%+0.05℉>); No electrode damage. Test 2: Solder coverage area >95%; No lower layer material visible at electrode edge. Test 3: Resistance change: ≥1Ω: ΔR%=±(1.0%+0.05℉>); No electrode damage. |
| Bending Test | Solder resistor on bending test board, apply downward force at center. Depression depth (D): 0201,0402=5mm; 0603,0805=3mm; 1206+=2mm. | Resistance change: ≥1Ω: ΔR%=±(1.0%+0.05℉>); No damage, no detachment, no fracture. |
| Resistance to Dry Heat | In oven at 155±5 for 1000+48/-0 hrs, rest 1 hr, measure resistance change. (RTT01 at 125±3) | ≥1Ω: 0.1%,0.5%,1%: ±(1.0%+0.05℉>); 2%,5%: ±(2.0%+0.10℉>) No damage, no short or burn. |
| Thermal Shock | In thermal shock chamber: -55 for 15 min, +125 for 15 min, 300 cycles. Rest 60 min, measure resistance change. | ≥1Ω: 0.1%,0.5%,1%: ±(1.0%+0.05℉>); 2%,5%: ±(2.0%+0.05℉>) No damage, no short or burn. |
| Moisture Load Life | In chamber at 40±2, 90~95% RH. 90 min ON, 30 min OFF, 1000 hrs. Rest 60 min, measure resistance change. | All Types: 1%: ±(1.0%+0.05℉>); 5%: ±(2.0%+0.10℉>) No damage, no short or burn. |
| Load Life | In oven at 70±2. 90 min ON, 30 min OFF, 1000 hrs. Rest 60 min, measure resistance change. | All Types: 1%: ±(1.0%+0.05℉>); 5%: ±(2.0%+0.10℉>) No damage, no short or burn. |
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