Precision Metal Foil Resistor Walter Elec STE1206M1W0R004FS Suitable for Current Measurement Systems

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Product Description

Product Overview

The STE series Metal Foil Current Sensing Resistors are designed for accurate current measurement applications. These resistors offer high precision, stability, and reliability, making them suitable for various industrial and electronic systems where precise current monitoring is critical.

Product Attributes

Brand: STE Series
Material: Metal Foil (MnCu alloy, Alloy, Special)
Substrate: Alumina Ceramic
Protective Coating: Flame-retardant epoxy, meets UL-94-V0 requirements (Green)
Marking Coating: Flame-retardant epoxy, meets UL-94-V0 requirements (Black)

Technical Specifications

Part Number Series	Size (L x W x T)	Resistance Value (m)	Power Rating (Watt)	Resistance Tolerance (%)	TCR (ppm)
STE0603*W50-series	1.700.20 x 0.900.20 x 0.650.20 mm	5~60	0.50	0.5%(D), 1%(F)	50, 100
STE0805*W75-series	2.100.20 x 1.350.20 x 0.650.20 mm	3~200	0.75	0.5%(D), 1%(F)	50, 100
STE1206*1W0-series	3.300.20 x 1.700.20 x 0.650.20 mm	3~400	1.0	0.5%(D), 1%(F)	50, 100
STE2010*1W5-series	5.100.20 x 2.600.20 x 0.650.20 mm	2~400	1.5	0.5%(D), 1%(F)	50, 100
STE2512*2W0-series	6.400.30 x 3.200.30 x 0.650.20 mm	2~400	2.0	0.5%(D), 1%(F)	50, 100
STE3921*3W0-series	11.100.30 x 5.100.30 x 0.650.20 mm	2~100	3.0	0.5%(D), 1%(F)	50, 100
STE4527*4W0-series	11.601.0 x 7.101.0 x 0.650.30 mm	2~100	4.0	0.5%(D), 1%(F)	50, 100

Test Parameter	Conditions	Requirements	Reference Standard
Short Time Over Load	P=2.5Pr; T=252C, t=5sec.	(1.0%+0.5m)	IEC60115-1 4.13
High Temp. Exposure	T=+1702C, t=1000h	(1.0%+0.5m)	IEC60115-1 4.25
Low Temp. Storage	T=-552C, t=1000h	(1.0%+0.5m)	IEC60115-1 4.25
Moisture Load Life	(60, 95%RH), Vtest=Vmax; T=602C; RH=95%; t=90min ON, 30min OFF, 1000h	(2.0%+0.5m)	IEC60115-1 4.25
Thermal Shock	[-55C 30min. R.T. 3min. +155C 30min. R.T. 3min], 100 Cycles	(1.0%+0.5m)	IEC60115-1 4.19
Load Life at 70C	Vtest=Vmax; T=702C; t=90min ON, 30min OFF, 1000h	(2%+0.5m)	IEC60115-1 4.25
Solderability	Dip into solder at T=2455C, t=30.5sec.	The covered area >95%	IEC60115-1 4.17
Resistance to Solder Heat	Through Reflow T=2755C, t=201sec.	(1.0%+0.5m)	IEC60115-1 4.18
Mechanical Shock	a=100G, t=11ms, 5 times shock	(1.0%+0.5m)	IEC60115-1 4.21
Substrate Bending	Span: 90mm; Bend Width: 2mm; Test board: Glass-Epoxy Board; Thickness=1.6mm	(1.0%+0.5m)	IEC60115-1 4.33