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Durable Metal Foil Resistor Walter Elec STE1206A1W0R100F with Alumina Ceramic Substrate and Epoxy Adhesion Layer

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Product Description

Product Overview

The STE series is a range of Metal Foil Current Sensing Resistors designed for accurate current measurement. These resistors are available in various sizes and materials, offering high performance and reliability for demanding applications.

Product Attributes

  • Brand: STE Series
  • Material: MnCu alloy, Alloy, Special
  • Substrate: Alumina Ceramic
  • Adhesion Layer: Epoxy
  • Resistive Element: Cu alloy
  • Terminal Electrode: SnNiCu
  • Protective Coating: Flame-retardant epoxy (Green, UL-94-V0 compliant)
  • Marking Coating: Flame-retardant epoxy (Black, UL-94-V0 compliant)

Technical Specifications

Part Number SeriesSize (W x L x T)Resistance Value (m)Power Rating (Watt)Resistance Tolerance (%)TCR (ppm)
STE06030.900.20 x 1.700.20 x 0.650.20 mmR005~R600.500.5%(D), 1%(F)50, 100
STE08051.350.20 x 2.100.20 x 0.650.20 mmR003~R2000.750.5%(D), 1%(F)50, 100
STE12061.700.20 x 3.300.20 x 0.650.20 mmR003~R4001.00.5%(D), 1%(F)50, 100
STE20102.600.20 x 5.100.20 x 0.650.20 mmR002~R4001.50.5%(D), 1%(F)50, 100
STE25123.200.30 x 6.400.30 x 0.650.20 mmR002~R4002.00.5%(D), 1%(F)50, 100
STE39215.100.30 x 11.100.30 x 0.650.20 mmR002~R1003.00.5%(D), 1%(F)50, 100
STE45277.101.0 x 11.601.0 x 0.650.30 mmR002~R1004.00.5%(D), 1%(F)50, 100

Reliability Test Standards

ParameterConditionsRequirementsReference
Short Time Over LoadP= 2.5Pr ; T=252C , t = 5sec.(1.0%+0.5m)IEC60115-1 4.13
High Temp. ExposureT = +1702C ; t = 1000h(1.0%+0.5m)IEC60115-1 4.25
Low Temp. StorageT = -552C ; t = 1000h(1.0%+0.5m)IEC60115-1 4.25
Moisture Load Life(6095RH) Vtest = Vmax ; T=602C ; RH=95% ; t= 90min ON , 30min OFF , 1000h(2.0%+0.5m)IEC60115-1 4.25
Thermal Shock[-55C 30min. R.T. 3min. +155C 30min. R.T. 3min ], 100 Cycles(1.0%+0.5m)IEC60115-1 4.19
Load Life at 70CVtest = Vmax ; T=702C ;t= 90min ON , 30min OFF,1000h(2%+0.5m)IEC60115-1 4.25
SolderabilityDip into solder at T = 2455C , t = 30.5sec.The covered area >95%IEC60115-1 4.17
Resistance to Solder HeatThrough Reflow T= 2755C , t =201sec.(1.0%+0.5m)IEC60115-1 4.18
Mechanical Shocka =100G , t =11ms, 5 times shock(1.0%+0.5m)IEC60115-1 4.21
Substrate BendingSpan:90mm ; Bend Width:2mm ; Test board: Glass-Epoxy Board ; Thickness =1.6mm(1.0%+0.5m)IEC60115-1 4.33

Environmental Characteristics

  • Operating Temperature: -55155
  • Storage Conditions:
    • 2 years under airtight conditions at +1040, 75% RH.
    • 30 days maximum without dew at +1060, 95% RH.

Recommended Solder Pad Dimensions

Part Number SeriesP (mm)W (mm)D (mm)Loading (Watt)
STE06030.600.921.300.50
STE08050.801.441.400.75
STE12061.201.841.801.0
STE20102.702.882.651.5
STE25123.103.573.102.0
STE39215.005.754.503.0
STE45275.208.054.654.0

Recommended Soldering Parameters

Wave Solder Temperature Profile

Preheating: 100~130, max. 100 sec. Soldering: 250~265 max. 10 sec. Maximum temperature: 2605, max. 10sec.

Solder Reflow Temperature Profile

Preheating: 145 15, max. 120 sec. Soldering: min. 220, max. 60 sec. Maximum temperature: 2605, max. 10sec.


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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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