Miniaturized Metallized Polyester Film Capacitors WEIDY W222A561KD5L00A00A for Electronic Performance

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Product Description

Product Specification Approval for Metallized Polyester Film Capacitors (Miniaturized)

This document outlines the specifications for the W22 series of miniaturized metallized polyester film capacitors, designed for various electronic applications. These capacitors offer reliable performance and a compact form factor.

Product Attributes

Brand: WDI ()
Product Type: Metallized Polyester Film Capacitors (Miniaturized)
Material: Metallized Polyester Film
Outer Encapsulation: Flame-retardant epoxy resin (UL94V-0)
Certifications: Implied compliance with GB/T 2693, GB/T 7332, IEC 60384-1, IEC 60384-2 standards.
Supplier: Shenzhen Weidy Industrial Development Co., Ltd.

Technical Specifications

Part Number	Model	Capacitance (uF)	Rated Voltage (V)	Capacitance Tolerance	Pitch (mm)	Lead Diameter (mm)	Max Height (mm)	Max Width (mm)	Max Thickness (mm)	Lead Spacing (mm)
W222A561KD5L00A00A	WDQV-561K-P5	0.00056	100	±10% (K)	5.0	0.5	7.5	7.5	4.5	5.0 ±0.5

General Technical Parameters

Parameter	Specification
Product Name	Metallized Polyester Film Capacitor (Miniaturized)
Applicable Standards	GB/T 2693 (IEC 60384-1), GB/T 7332 (IEC 60384-2)
Product Structure	1. Metallized Polyester Film, 2. Metal Spray Layer, 3. Leads, 4. Internal Epoxy Resin Encapsulation, 5. External Flame-retardant Epoxy Resin Encapsulation (UL94V-0)
Climatic Category	55/105/21
Rated Temperature	85℃
Operating Temperature Range	-55℃ to +105℃
Rated Voltage	63V, 100V, 250V, 400V
Capacitance Range	0.0001μF to 1.0μF
Capacitance Tolerance	±5% (J); ±10% (K)
Withstand Voltage	1.4UR (5s)
Dissipation Factor (tan δ)	≤1.0% (20℃, 1KHz)
Insulation Resistance	UR≤100V: ≥15000MΩ; CR≤0.33μF: ≥5000S; CR>0.33μF (20℃, 10V, 1min) UR>100V: ≥15000MΩ; CR≤0.33μF: ≥5000S; CR>0.33μF (20℃, 100V, 1min)
Lead Strength (Tensile)	0.3<d≤0.5: 5N; 0.5<d≤0.8: 10N; 0.8<d≤1.25: 20N (duration: 10±1s)
Lead Strength (Bending)	0.3<d≤0.5: 2.5N; 0.5<d≤0.8: 5N; 0.8<d≤1.25: 10N (two bends in each direction)
Solderability	235℃±5℃, 2.0s±0.5s (good tinning on lead surface)
Resistance to Soldering Heat	260℃±5℃, 10s±1s (Capacity change: ≤±2%; Dissipation factor change: ≤0.3% at 1 KHz)
Rapid Change of Temperature	-55℃ to +105℃, 5 cycles (Capacity change: ≤±5%; Dissipation factor change: ≤0.3% at 1 KHz; Insulation Resistance: ≥50% of initial)
Vibration	10-500Hz, 0.75mm amplitude or 98m/s² acceleration (6 hours total)
Impact	4000 cycles, 390m/s² acceleration, 6ms pulse duration
Damp Heat (Steady State)	40℃±2℃, 93+2/-3% RH, 21 days (Capacity change: ≤±5%; Dissipation factor change: ≤0.5% at 1 KHz; Insulation Resistance: ≥50% of initial)
Dry Heat	+105℃, 16 hours (Capacity change: ≤±5%; Dissipation factor change: ≤0.3% at 1 KHz; Insulation Resistance: ≥50% of initial)
Cold	-55℃, 2 hours
Low Pressure	15-35℃, 8.5KPa, 1 hour (Rated voltage applied during the last minute of the test cycle)
Cyclic Damp Heat	IEC 68-2-30, Test Db, severity b