Compact Mini Molding Power Inductor with Metal Dust Core and RoHS2 Compliance XRTC322512S100MBCA

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Price: Negotiable

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Delivery Time: Negotiable

Product Description

Product Overview

The XRTC322512S100MBCA is a Mini Molding Power Inductor designed for high current and low loss applications. It features a metal dust core for high performance (Isat), low Rdc for reduced losses, and a closed magnetic circuit to minimize leakage flux. The product offers enhanced surface compactness due to its vinyl thermal spray coating and complies with environmental regulations including RoHS2.0 and Halogen standards.

Product Attributes

Brand: Dongguan Xiangru Electronics Co., Ltd.
Origin: China
Material: Metal dust core, Vinyl thermal spray coating
Color: Black
Certifications: RoHS2.0, Halogen, Reach, QESP-44

Technical Specifications

P/N	L0(H) @ 1MHz	Rdc(mTypical	Rdc(mMax	Irms(A) Typical	Irms(A) Max	Isat(A) Typical	Isat(A) Max
XRTC322512S100MBCA	10.0	2.2	2.3	1.8	1.9	2.1	2.3

Dimensions

Series	L(mm)	W(mm)	H(mm)	Tolerance
XRTC322512S	3.20.2	2.50.2	1.20Max.	S=0.2mm

Reliability

Item	Requirements	Test Methods and Remarks
Insulation Resistance	100M	100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds.
Solderability	90% or more of electrode area shall be coated by new solder.	Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s.
Resistance to Soldering Heat	No visible mechanical damage. Inductance change: Within 10%.	Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec.
Adhesion of teral electrode	Strong bond between the pad and the core, without come off PCB.	Inductors shall be subjected to (2605)for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 12 N for (101) seconds.
High temperature	No case deformation or change in appearance. Inductance change: Within 10%	Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion.
Low temperature	No visible mechanical damage. Inductance change: Within 10%	Temperature: -552. Time : 1000 hours. Measurement at 244 hours after test conclusion.
Thermal shock	No visible mechanical damage. Inductance change: Within 10%	The test sample shall be placed at (-553)and (1253)for (303) , different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing.
Temperature characteristic	Inductance change Pc-b,Pc-d: Within 10%	a+20 30~45 b: -40 30~45 c: +20 30~45 d: +125 30~45 e: +20 30~45 Pc-b LbLc 100% Pc-dLdLc 100% Lc Lc
Static Humidity	No visible mechanical damage. Inductance change: Within 10%	Inductors shall be subjected to (953)%RH . at(602)for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing.
Life	No visible mechanical damage. Inductance change: Within 10%	Inductors shall be store at (852)for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing

Application Scenarios

DC/DC converters.
Pad, Smart phone.
Portable gaming devices, Smart wear, Wi-Fi module.
Notebooks, VR, AR.
LCD displays, HDDs, DVCs, DSCs, etc.
Baseband power supply, Amplifier, Power management, Module power supply, Camera power management.