Low Loss Miniaturized Inductor XR XRIM404030S4R7MGCA with High Current Heat Rating and Vinyl Spray
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This Miniaturized Integrated Inductor (XRIM404030S4R7MGCA) is designed for high current and low loss applications, utilizing a metal dust core for high performance and low Rdc. Its closed magnetic circuit design minimizes leakage flux, and it features a vinyl thermal spray for enhanced surface compactness. The product is 100% lead-free, compliant with RoHS2.0, Halogen, Reach, and other regulatory requirements.
Product Attributes
- Brand: Dongguan xiangru electronics co., ltd
- Origin: China
- Material: Metal dust core, Vinyl thermal spray
- Color: Gray (G)
- Certifications: RoHS2.0, Halogen, Reach
Technical Specifications
| P/N | L0 (H) @ 1MHz (0A) | Rdc (m) Typical | Rdc (m) Max | Heat rating current Irms (A) Typical | Heat rating current Irms (A) Max | Saturation current Isat (A) Typical | Saturation current Isat (A) Max | Inductance Tolerance | Dimensions (LWH) | Coating Color | Product Type |
| XRIM404030S4R7MGCA | 4.7 | 41 | 46 | 4.3 | 4.0 | 7.0 | 6.0 | 20% (M) | 4.0*4.0*3.0 mm | Gray (G) | Common (C) |
Applications
- DC/DC converters
- Pad, Smart phone
- Portable gaming devices, Smart wear, Wi-Fi module
- Notebooks, VR, AR
- LCD displays, HDDs, DVCs, DSCs, etc.
- Baseband power supply, Amplifier, Power management, Module power supply, Camera power management
Dimensions
| Series | L (mm) | W (mm) | E (mm) | T (mm) | A (mm) | B (mm) | C (mm) |
| XRIM404030S | 4.10.2 | 4.10.2 | 1.400.2 | 3.00Max. | 4.10 | 1.10 | 4.10 |
Reliability
| Item | Requirements | Test Methods and Remarks |
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of teral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605) for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 12 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10% | Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10% | Temperature: -552. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10% | The test sample shall be placed at (-553)and (1253)for (303) min, different temperature conversion time is 2~3 min. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing. |
| Temperature characteristic | Inductance change Pc-b,Pc-d: Within 10% | a+20 30~45 b: -40 30~45 c: +20 30~45 d: +125 30~45 e: +20 30~45 Pc-b LbLc 100% Pc-dLdLc 100% Lc Lc |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be subjected to (953)%RH . at(602)for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing. |
| Life | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be store at (852)for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing |
Soldering Condition (Recommendation)
Recommend Reflow Soldering Profile: (solder : Sn96.5 / Ag3 / Cu0.5)
- Preheat: Temperature Min(Tsmin) 150, Temperature Max (Tsmax) 200, Time (ts) 60 -120 seconds
- Average ramp-up rate: 3/ second
- Time maintained above: Temperature (TL) 217, Time (tL) 60-150 seconds
- Peak Temperature (Tp): 260
- Time within 0 of actual peak Temperature (tp): 10 seconds
- Ramp-down Rate: 6/second
- Time 25 to Peak Temperature: 8 minutes
- Allowed Re-flow times: 2 times
- Remark: To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace.
Packing
Dimension of plastic taping (Unit: mm)
| Series | W (mm) | A0 (mm) | B0 (mm) | D0 (mm) | D1 (mm) | E tolerance | F (mm) | K0 (mm) | P0 (mm) | P2 (mm) | P1 (mm) | T (mm) | package quantity | ||
| 404030 | 12.00.30 | 4.400.10 | 4.400.10 | 1.5 | 1.5 | +0.1/-0 | 0.20 | 4.400.10 | 1.5 | 1.75 | 3.100.10 | 4.0 | 8.0 | 0.35 | 10.2 |
Dimension of Reel (Unit: mm)
| Series | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | G (mm) | H (mm) | J (mm) | K (mm) | L (mm) | M (mm) |
| 404030 | 178 | 60 | 13 | 10 | 1.5 | 5.5 | 3.100.10 | 4.0 | 2.0 | 8.0 | 0.35 | 10.2 |
Notes
- Recommend products store in warehouse with temperature between 15 to 35 under humidity between 25 to 75%RH. Solderability may degrade if stored over 1 year.
- Cartons must be placed in the correct direction as indicated.
- Inappropriate storage conditions include: high electrostatic environment, direct sunshine, rain, snow, condensation, sea wind, or corrosive gases (Cl2, H2S, NH3, SO2, NO2, etc.).
- If using circuit boards thinner than 1.6mm, please confirm with the company for a more suitable product recommendation.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina