Molding Power Inductors XR XRFWHP0660A-1R5M Featuring 6.2m DC Resistance and 5.1 MHz Operating Frequency Range
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Product Description
Product Overview
This document outlines the specifications for the XRFWHP0660A Molding Power Inductors. It details the product's electrical characteristics, dimensions, material composition, testing procedures, and packaging information. Designed for demanding applications, these inductors offer reliable performance and durability.
Product Attributes
- Brand: Dongguan xiangru electronics co., ltd
- Origin: China
- Product Name: Molding Power Inductors
- Our Part No.: XRFWHP0660A-1R5M
- Customer Part No.: XRFWHP0660A
Technical Specifications
| Item | Specification | Test Conditions / Methods |
| Inductance (L) | 1.5H 20% | 100KHz / 1.0V |
| DC Resistance (DCR) | 6.2m Max. (4.9 Typ.) | @25 |
| Saturation Current (Isat) | 15.0A Typ. | L drops to approx. 70% of initial value at 15A / 40% max |
| Rated Current (Irms) | 15A Typ. | (T) 40 |
| Operating Frequency Range | 5.1 MHz (REF) | |
| Operating Temperature Range | -55 ~ +125 | |
| Dimensions (A) | 6.40.3 mm | |
| Dimensions (B) | 6.60.3 mm | |
| Dimensions (C) | 5.80.3 mm | |
| Dimensions (D) | 5.10.5 mm | |
| Dimensions (E) | 1.40.3 mm | |
| Dimensions (F) | 2.60.3 mm | |
| PCB Pattern (G) | 2.50 m/m (REF) | |
| PCB Pattern (H) | 5.60 m/m (REF) | |
| PCB Pattern (I) | 1.60 m/m (REF) | |
| Rated Current Test | Inductance change | Applied rated DC current for 4 hours. Temperature measured by digital surface thermometer. |
| Overload Test | No evidence of electrical damage | Applied 1.5 times rated DC current for 5 minutes. |
| Solder Heat Resistance | No electrical/mechanical damage; Inductance change | Preheat: 150 100s; Solder Temp: 2555; Dip Time: 10s Max. |
| Vibration Test (Low Frequency) | Amplitude: 1.5 mm; Frequency: 10-55-10Hz/1min; Direction: X, Y, Z; Duration: 2 Hrs/Axis. | |
| Shock Test | Dropped 10 times from 1m height onto 3cm wooden board. | |
| Solderability Test | >90% of terminal electrode covered with solder | Preheat: 150 120s; Solder Bath: 2555; Dip Time: 10s Max. |
| Component Adhesion (Push Test) | Min 1.5Kg | Reflow soldered (2555 for 10s) to copper substrate. Force applied to side. |
| Component Adhesion (Pull Test) | Min 1.5Kg | 10cm wire inserted into eyelet, bent upwards. Terminal not remarkably damaged. |
| Flexure Strength | Forces should not damage dielectric | Solder to substrate, bend substrate by 2mm and return. |
| Resistance to Solvent Test | No case deformation, appearance change, or marking alteration | Withstand 6 minutes of alcohol. |
| Temperature Characteristic | Appearance: No damage; Inductance: Within 10% of initial value | -55 ~ +125 |
| Humidity Test | 602 / 962 Hours, RH: 90-95%RH | |
| Low Temperature Storage | -552 for 962 Hours | |
| Thermal Shock Test | -555 for 30 min, +1255 for 30 min. Total: 10 Cycles. | |
| High Temperature Storage | 1202 | |
| Life Test (High Temp Load) | No evidence of short or open circuit | Temp: 1252; Time: 50012 Hours; Load: Allowed DC Current. |
| Life Test (Humidity Load) | Temp: 602; RH: 90-95%; Time: 50012 Hours; Load: Allowed DC Current. | |
| Iron Soldering Profile | Max 1 time for iron soldering | Power: Max.30W; Pre-heating: 150/60sec; Soldering time: 3sec.Max.; Solder paste: Sn/3.0Ag/0.5Cu |
| Reel Dimensions | 800 PCS/Reel | Style: 6060; Reel Dimensions (m/m): 330 (A), 21 (B0.8), 13 (C0.5), 16.5 (G), 100 (N), 21 (T) |
| Tape Dimension | Refer to IEC 60286-3:2013. Peel Force: 0.1N to 1.0N (8mm tape); 0.1N to 1.3N (12mm-56mm tape) at 300mm/min peel speed. | |
| Packaging Quantity | Inner Box: 1600 PCS (2 Reels); Carton: 3200 PCS (2 Boxes) | Inner Box Dimension: 34*34*6.5cm; Carton Dimension: 36.5*35.5*14.5cm |
| Storage Conditions | ||
| Transportation | Handle with care. Use tweezers/vacuum pickup. Minimize abrasion/shock. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina