Industrial Grade Ceramic Chip Antenna with Lead Free Reflow Soldering Profile YAGEO BPF1608LM10R5000A
Price:
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MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This document outlines the specifications for Ceramic Chip Antennas from Yageo, focusing on packing, reliability, and reflow soldering profiles for lead-free processes.
Product Attributes
- Brand: Yageo
- Origin: Not specified
- Material: Ceramic
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Index | Spec (mm) | Tape Width (W) | Sprocket Hole (D) | Distance Sprocket Hole to Sprocket Hole (Po) | Distance Pocket to Pocket (P) | Distance Sprocket Hole to Pocket (Po) | Distance Sprocket Hole to Outside (E) | Distance Sprocket Hole to Pocket (F) | Internal Diameter of Reel (C) | External Diameter of Reel (A) |
| 1 | 7 | 8 | 1.5 +0.1/-0 | 40 0.2 | 4 0.1 | 2 0.1 | 2 0.1 | 0.5 0.1 | 60 1.0 | 175 1.0 |
Reliability Test
Details on reliability testing are not provided in the extract.
Reflow Profile
Soldering Profile for Lead-free Process
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina