High Density Electronic Packaging Components YJYCOIN YI201209U800-3R0T Multilayer Ferrite Chip Beads
Product Overview
Multilayer Ferrite Chip Beads designed for high-density packaging and effective EMI suppression. These components offer excellent physical properties, are suitable for flow and reflow soldering, and cover wide frequency ranges with high impedance. The YI series is particularly suited for high current circuits due to its low DC resistance. Operating temperature range is -40 to +125.
Product Attributes
- Brand: YI ()
- Origin: Shenzhen, China
Technical Specifications
| Type | Dimensions (mm) L x W x H | Impedance () 25% @ 100 MHz | DCR MAX. () | Rating Current MAX (A) | Taping Material | CHIPS/REEL |
| YI201209 | 2.0 x 1.2 x 0.9 | 80 | 0.10 | 3.0 | Polystyrene | 4000 |
| 160808 | 1.6 x 0.8 x 0.8 | N/A | N/A | N/A | Paper | 4000 |
| 160808 | 1.6 x 0.8 x 0.8 | N/A | N/A | N/A | Polystyrene | 4000 |
| 201209 | 2.0 x 1.2 x 0.9 | N/A | N/A | N/A | Paper | 4000 |
| 201209 | 2.0 x 1.2 x 0.9 | N/A | N/A | N/A | Polystyrene | 4000 |
| 201212 | 2.0 x 1.2 x 1.2 | N/A | N/A | N/A | Polystyrene | 3000 |
| 321611 | 3.2 x 1.6 x 1.1 | N/A | N/A | N/A | Polystyrene | 3000 |
| 322513 | 3.2 x 2.5 x 1.3 | N/A | N/A | N/A | Polystyrene | 2000 |
| 451616 | 4.5 x 1.6 x 1.6 | N/A | N/A | N/A | Polystyrene | 2000 |
| 453215 | 4.5 x 3.2 x 1.5 | N/A | N/A | N/A | Polystyrene | 1000 |
| YA3216M4 | 3.2 x 1.6 x 1.1 | N/A | N/A | N/A | Polystyrene | 3000 |
Applications: Computers and peripheral devices, personal computers, VCR and cameras. Noise suppression in digital equipment, car stereo, car engine controllers and OA electronic instruments. Communication equipment.
Test Instruments: HP 4338A MILLIOHMMETER, HP 4291B RF IMPEDANCE/MATERIAL ANALYZER.
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