YJYCOIN YLCM7060F 301T Wire Wound Common Mode Choke for EMI Noise Reduction in Sensitive Electronics

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Product Description

Wire Wound Common Mode Choke - YLCM7060F Series

The YLCM7060F Series Wire Wound Common Mode Choke is designed for effective EMI noise suppression. Featuring a compact SMD construction with a low profile, it offers high impedance and excellent frequency characteristics. Its self-electromagnetic shielding and low magnetic flux leakage make it suitable for sensitive electronic applications. The series operates within a wide temperature range of -40 to +125.

Product Attributes

Brand: YLC ()
Origin: Shenzhen, China
Construction: SMD
Shielding: Self Electromagnetic Shielding
Material: Ferrite Core, LCP Cover, P180 Grd1 Wire, Epoxy Resin Adhesive, Lead-Free Solder, White Ink

Technical Specifications

Type	Impedance ( @100MHz) Min.	Impedance ( @100MHz) Typ.	DCR (m) Max.	Rated Current (A) max.	Rated Volt. (V)max.	IR (M) min.
YLCM7060F-400T	40	70	5.0	15.0	125	10
YLCM7060F-101T	100	140	10.0	9.0	125	10
YLCM7060F-301T	225	300	10.0	5.0	125	10
YLCM7060F-501T	275	450	10.0	5.0	125	10
YLCM7060F-601T	500	700	15.0	4.0	125	10
YLCM7060F-701T	500	700	15.0	4.0	125	10
YLCM7060F-102T	800	1020	17.0	3.0	125	10
YLCM7060F-132T	910	1300	21.0	2.5	125	10
YLCM7060F-222T	1400	2200	63.0	1.2	125	10
YLCM7060F-272T	2000	2700	63.0	1.0	125	10
YLCM7060F-302T	2500	3000	75.0	0.9	125	10
YLCM7060F-402T	3300	4000	100	0.8	125	10

Dimensions (Unit: mm)

TYPE	A	A1	B	C Max	D Typ.	E Typ.	F Typ.	K Typ.	H Typ.	I Typ.	J Typ.
YLCM7060F	7.00.5	7.50.5	6.00.5	3.8	3.5	1.5	1.7	5.0	1.5	8.0	3.0

Taping Dimensions (Unit: mm)

TYPE	W	A	B	D	P	K	T	MPQ
YLCM7060F	16.00.3	6.90.1	8.40.1	7.50.1	12.00.1	4.20.1	0.400.05	1500

Reel Dimensions (Unit: mm)

TYPE	W	W1	A	B	C	D
YLCM7060F	3302.0	16.42.0	13.00.50	21.00.80	2.00.50	100Min

Applications

LED Lighting
TV Games
Monitors
General EMI Common-Mode Noise Suppression

Reliability Testing

Operating Temperature: -40 to +125 (Contain Heating coil)
Appearance Inspection: No external defects by visual inspection.
Terminal Strength: Withstands 10N (1.02kg) push in X, Y directions for 102 sec after soldering without peeling.
Heat endurance of reflow soldering: Refer to figure.
Insulating resistance: Over 10 M at 80V D.C. between wire and core.
Dielectric Strength: Apply at 0.5KV 1mA for 3S between wire and core.
Temperature characteristics: Inductance coefficient (0~2,000) 10/ (-40 ~ +125 ).
Humidity characteristics: Inductance deviation within 10% after 96 hours in 90~95% relative humidity at 40 2 and 1 hour drying under normal condition.