Ferrite Chip EMI Suppressors ZE ZECB321609A000-6A000 SMD Magnetic Beads for Electronic Noise Control

Name: Ferrite Chip EMI Suppressors ZE ZECB321609A000-6A000 SMD Magnetic Beads for Electronic Noise Control
Brand: Beijing Silk Road Enterprise Management Services Co., Ltd.

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Ferrite Chip EMI Suppressors BCMS-3216 Series

This specification applies to the BCMS-3216 series Ferrite Chip EMI suppressors, designed for noise suppression applications.

Product Attributes

Brand: (Zengyi)
Origin: Taichung, Taiwan
Material: Ferrite
Type: (SMD Magnetic Beads)

Technical Specifications

Part Number	Impedance () at 100 MHz, 500mV	DC Resistance () Max	Rated Current (mA) Max	Operating Temp. Range	Storage Temp. Range	Dimensions (L x W x T) mm
BCMS321609A000	0 25%	0.015	6000	-55 ~ +125	-10 ~ +40	3.20.2 x 1.60.2 x 0.90.2
BCMS321611A000	N/A	N/A	N/A	N/A	N/A	N/A

Soldering Conditions

Type	Conditions
Reflow Soldering	Pre-heating: Temperature difference between solder and ferrite surface 150 max. Cooling into solvent 100 max. Temperature Profile: Slope of temp. rise (A, C): 1 to 5 /sec; Heat time (B): 50 to 150 sec; Heat temperature: 120 to 180 ; Time over 230 (D): 90~120 sec; Peak temperature (E): 255~260 ; Peak hold time: 10 max. sec. Number of mounting: 3 times.
Reworking with Soldering Iron	Preheating: 150, 1 minute. Tip temperature: 280 max. Soldering time: 3 seconds max. Soldering iron output: 30w max. End of soldering iron: 3mm max. Reworking limited to one time.

Mechanical Characteristics

Item	Specification	Test Conditions
Terminal Strength	Without deformation cases, impedance shall be satisfied 30% for 10 sec	Solder chip on PCB and applied 10N (1.02Kgf)
Substrate Bending	Without deformation cases, impedance shall be satisfied 30%	After soldering a chip to a test substrate, bend the substrate by 3mm hold for 10s and then return.
Resistance to Solder Heat	No visible damage, Electrical characteristics and mechanical characteristics shall be satisfied.	Solder Temp.: 2653; Immersion time: 61 sec; Preheating: 100 to 150, 1 minute. Measurement after 242 hrs at room temp.
Solderability	95% min. coverage of all metabolised area	Solder temp.: 2405; Immersion time: 31 sec. Solder: Sn-3Ag-0.5Cu.

Reliability and Test Conditions

Test	Performance Specification	Test Condition
High Temperature Resistance	Appearance: no mechanical damage. Impedance: 30% of initial value. DC resistance: satisfied.	Temperature: 1252. Applied current: Rated current. Testing time: 100812hrs. Measurement after 24 hours minimum at room ambient temperature.
Humidity Resistance	Appearance: no mechanical damage. Impedance: 30% of initial value. DC resistance: satisfied.	Humidity: 90 to 95% RH. Temperature: 602. Applied current: Rated current. Testing time: 100812hours. Measurement after 24 hours minimum at room ambient temperature.
Temperature Cycle	Appearance: no mechanical damage. Impedance: 30% of initial value. DC resistance: satisfied.	-55,+125 stabilized for 30 minutes each. 100 cycles. Measurement after 24 hours minimum at room ambient temperature. Steps: -55 (303 min), Standard atmospheric (5s), +125 (303 min), Standard atmospheric (5s).
Low Temperature Storage Life Test	Appearance: no mechanical damage. Impedance: 30% of initial value. DC resistance: satisfied.	Temperature: -552. Testing time: 100812hours. Measurement after 24 hours minimum at room ambient temperature.
Thermal Shock	Appearance: no mechanical damage. Impedance: 30% of initial value.	-55,+125 stabilized for 30 minutes each. 100 cycles. Measurement after 24 hours minimum at room ambient temperature.
Vibration Test	Appearance: no mechanical damage. Impedance: 30% of initial value.	Waveform: Sine wave. Frequency: 10~55~10 Hz. Sweep time: 1min. Amplitude: 1.5mm(peak-peak). Direction: X,Y,Z (3 axes). Duration: 2 hrs./axis, total 6 hrs.

Embossed Carrier Tape Packaging

Dimension	A0	B0	W	F	E	P1	P2	P0	D0	D1	K	T	T2
Value (mm)	1.88 0.1	3.5 0.1	8.0 0.2	3.5 0.05	1.75 0.1	4.0 0.1	2.00 0.05	4.0 0.1	1.55 0.05	1.0 0.1	1.27 0.1	0.23 0.1	1.27 0.1

Reel Packing Qty: 3,000 PCS/REEL
Cover Tape Peeling Strength: 10g~100g (Peel angle: 165~180, Peel speed: 300mm/min)

Packaging

Tape & Reel packaging in composite specification 6/8
Reel and a bag of desiccant packed in Nylon or plastic bag
Maximum of 5 bags in an inner box
Maximum of 6 inner boxes in an outer box
Reel Label: Must indicate (1) Pb Free (2) RoHS Compliant

Storage

Store at 40 or less and 70% RH or less to prevent solderability deterioration.
Avoid storage in dusty or harmful gas environments.
Protect from heat and direct sunlight to prevent packaging deformation.
Minimum packages should not be opened until just before use. Use opened reels as soon as possible.
Solderability is guaranteed for 6 months from the date of delivery under specified storage conditions. Parts exceeding 6 months should be checked for solderability before use.