SMD Ferrite Bead Ferrite Chip EMI Suppressors ZE ZECB201209A800-0A800 RoHS Compliant Pb Free Device

Name: SMD Ferrite Bead Ferrite Chip EMI Suppressors ZE ZECB201209A800-0A800 RoHS Compliant Pb Free Device
Brand: Beijing Silk Road Enterprise Management Services Co., Ltd.

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

This specification applies to the EBMS-2012 series Ferrite Chip EMI suppressors, designed for suppressing electromagnetic interference.

Product Attributes

Brand: (Zengyi)
Origin: China
Material: Ferrite
Type: (SMD Ferrite Bead)
Certifications: RoHS Compliant, Pb Free

Technical Specifications

PART NO	SPECIFICATION	IMPEDANCE () AT 100 MHz 500mV	DC RESISTANCE Max ()	RATED CURRENT Max (mA)	OPERATING TEMP. RANGE	STORAGE TEMP. RANGE	DIMENSION L x W x T (mm)
EBMS201209A800	Ferrite Chip EMI Suppressors	8025%	0.15	800	-55 ~ +125	-10 ~ +40	2.00.2 x 1.250.2 x 0.9+0.15/-0.2

ITEM	TEST CONDITIONS	SPECIFICATION
Reflow soldering conditions	Preheating: temperature difference between solder and ferrite surface 150 max. Cooling into solvent 100 max.	-
Reflow soldering Temperature Profile	A: Slope of temp. rise 1 to 5 /sec B: Heat time 50 to 150 sec C: Heat temperature 120 to 180 D: Time over 230 90~120 sec E: Peak temperature 255~260 Peak hold time 10 max. sec No. of mounting 3 times	-
Reworking with soldering iron	Preheating 150, 1 minute Tip temperature 280 max Soldering time 3seconds max. Soldering iron output 30w max. End of soldering iron 3mm max.	Reworking limited to one time.
Solder Volume Upper Limit	-	-
EQUIPMENT - IMPEDANCE	HP4286A impedance analyzer or equivalent system	-
EQUIPMENT - DC RESISTANCE	HP 4338 digital miliohm meter with 4 terminal method	-
MECHANICAL CHARACTERISTICS - TERMINAL STRENGTH	Solder chip on PCB and applied 10N (1.02Kgf) for 10 sec	Without deformation cases, impedance shall be satisfied 30%, DC resistance shall be satisfied.
MECHANICAL CHARACTERISTICS - Substrate BENDING	Bend the substrate by 3mm hold for 10s and then return. Soldering in accordance with recommended PC board pattern and reflow soldering.	Without deformation cases, impedance shall be satisfied 30%, DC resistance shall be satisfied.
MECHANICAL CHARACTERISTICS - RESISTANCE TO SOLDER HEAT	Solder Temp. : 2653, Immersion time : 61 sec, Preheating : 100 to 150, 1 minute. Measurement after 242 hrs at room temp. Solder : Sn-3Ag-0.5Cu	No visible damage. Electrical characteristics and mechanical characteristics shall be satisfied.
MECHANICAL CHARACTERISTICS - SOLDERABILITY	Solder temp. : 2405, Immersion time : 31 sec. Solder : Sn-3Ag-0.5Cu	95% min. coverage of all metabolised area. Consult standard J-STD-002.
RELIABILITY AND TEST CONDITIONS - HIGH TEMPERATURE RESISTANCE	Temperature: 1252, Applied current: Rated current, Testing time: 100812hrs. Measurement: After 24 hours at room ambient.	Appearance: no mechanical damage. Impedance: 30% of initial. DC resistance: satisfied.
RELIABILITY AND TEST CONDITIONS - HUMIDITY RESISTANCE	Humidity: 90 to 95% RH, Temperature: 602, Applied current: Rated current, Testing time: 100812hours. Measurement: After 24 hours at room ambient.	Appearance: no mechanical damage. Impedance: 30% of initial. DC resistance: satisfied.
RELIABILITY AND TEST CONDITIONS - TEMPERATURE CYCLE	-55,+125 stabilized for 30 minutes each, 100 cycles. Measurement: After 24 hours at room ambient. Step1: -55 temp3 303 minutes. Step2: Standard atmospheric conditions 5s. Step3: +125 temp2 303 minutes. Step4: Standard atmospheric conditions 5s.	Appearance: no mechanical damage. Impedance: 30% of initial. DC resistance: satisfied.
RELIABILITY AND TEST CONDITIONS - LOW TEMPERATURE STORAGE LIFE TEST	Temperature: -552, Testing time: 100812hours. Measurement: After 24 hours at room ambient.	Appearance: no mechanical damage. Impedance: 30% of initial. DC resistance: satisfied.
RELIABILITY AND TEST CONDITIONS - THERMAL SHOCK	-55,+125 stabilized for 30 minutes each, 100 cycles. Measurement: After 24 hours at room ambient.	Appearance: no mechanical damage. Impedance: 30% of initial.
RELIABILITY AND TEST CONDITIONS - VIBRATION TEST	Waveform: Sine wave, Frequency: 10~55~10 Hz, Sweep time: 1min, Amplitude: 1.5mm(peak-peak), Direction: X,Y,Z (3 axes), Duration: 2 hrs./axis, total 6 hrs.	Appearance: no mechanical damage. Impedance: 30% of initial.
PAPER CARRIER TAPE PACKAGING - Dimensions	-	A: 1.450.05, B: 2.250.05, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.05, H: 4.000.10, J: 1.550.05, T: 0.950.05
PAPER CARRIER TAPE PACKAGING - LEADER AND TRAILER TAPE	-	-
PAPER CARRIER TAPE PACKAGING - DIRECTION	Seen from the top of cover tape	-
REELS PACKING	-	QTY. 4,000 PCS/REEL
PEELING STRENGTH OF COVER TAPE	Peel angle: 165~180 vs carrier tape, Peel speed: 300mm/min	Cover tape (10g~100g)
PACKAGING	Tape & Reel packaging in composite specification 6/8	Reel and desiccant in Nylon/plastic bag. Max 5 bags per inner box. Max 6 inner boxes per outer box.
Reel Label	-	Indicate (1) Pb Free (2) RoHS Compliant
STORAGE	Store at 40 or less and 70% RH or less. Avoid dust, harmful gas, heat, and direct sunlight.	To prevent deterioration of solderability and packaging material deformation. Minimum packages opened just before use. Solderability specified for 6 months from delivery if stored as specified.