Low impedance integrated molding inductor ZE ZEMS0420-100M with composite structure and EMI shielding
Product Specification: ZEMS0420 Integrated Molding Inductor
This document outlines the specifications for the ZEMS0420 integrated molding inductor. It features a thin design with low DC resistance and ultra-high current capabilities, magnetic shielding for strong anti-electromagnetic interference, and high reliability with excellent vibration resistance due to its integral construction. The composite structure ensures ultra-low buzz noise, and it utilizes low-loss alloy powder for low impedance and small parasitic capacitance, leading to high efficiency and reduced core eddy-current loss. It is suitable for high-density installation and operates at frequencies up to 3MHz with an absolute maximum voltage of 30VDC. This product complies with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: (ZEMS)
- Origin: Dongguan, China
- Material: Low-loss alloy powder
- Certifications: RoHS, Halogen Free, REACH
Technical Specifications
| Part No. | Inductance (H) | Tolerance | DCR (m) Typical | Saturation Current (A) Typical | Temperature Rise Current (A) Typical | Dimensions (LWH) (mm) |
| ZEMS0420-R10M | 0.10 | 20% | 3.50 | 4.00 | 25.00 | 4.4x4.2x1.8 |
| ZEMS0420-R22M | 0.22 | 20% | 6.00 | 6.60 | 13.00 | 4.4x4.2x1.8 |
| ZEMS0420-R33M | 0.33 | 20% | 8.00 | 11.00 | 12.00 | 4.4x4.2x1.8 |
| ZEMS0420-R47M | 0.47 | 20% | 12.00 | 14.00 | 9.50 | 4.4x4.2x1.8 |
| ZEMS0420-R56M | 0.56 | 20% | 14.00 | 16.00 | 9.00 | 4.4x4.2x1.8 |
| ZEMS0420-R68M | 0.68 | 20% | 18.00 | 21.00 | 9.00 | 4.4x4.2x1.8 |
| ZEMS0420-1R0M | 1.00 | 20% | 24.00 | 27.00 | 7.00 | 4.4x4.2x1.8 |
| ZEMS0420-1R2M | 1.20 | 20% | 25.00 | 27.00 | 6.50 | 4.4x4.2x1.8 |
| ZEMS0420-1R5M | 1.50 | 20% | 40.00 | 46.00 | 6.00 | 4.4x4.2x1.8 |
| ZEMS0420-2R2M | 2.20 | 20% | 52.00 | 58.00 | 5.00 | 4.4x4.2x1.8 |
| ZEMS0420-3R3M | 3.30 | 20% | 70.00 | 87.00 | 4.00 | 4.4x4.2x1.8 |
| ZEMS0420-4R7M | 4.70 | 20% | 105.00 | 126.00 | 3.00 | 4.4x4.2x1.8 |
| ZEMS0420-6R8M | 6.80 | 20% | 120.00 | 175.00 | 2.40 | 4.4x4.2x1.8 |
| ZEMS0420-100M | 10.00 | 20% | 220.00 | 282.00 | 1.60 | 4.4x4.2x1.8 |
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Environmental Data
- Operating Temperature: -55 to +125 (Including coils self-temperature rise)
Test Equipment
- Inductance: WK3260B LCR meter or equivalent
- Saturation & Temperature Rise Current: WK3260B+WK3265B or equivalent
- DCR: Chroma 16502 or equivalent
Reliability Data
| Item | Requirements | Test Methods and Remarks |
| Operating Temperature Range | -55+125 (Including self-heating temperature rise) | |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2455 for (51) seconds. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for (101) seconds. |
| Low temperature storage | No visible mechanical damage. Inductance change: Within 10%. | Store temperature -552 for total 1000hr. |
| High temperature storage | No visible mechanical damage. Inductance change: Within 10%. | Store temperature 1252 for total 1000hr. |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10%. | Inductors shall be subjected to (933)%RH at 402 for 96 h2 h. Inductors are to be tested after having air dried for 2 hours. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10%. | (-403) for (303) min (852) for (303) min, conversion time (2~3) min, cycle 5 times. Tested after 2 hours air drying at room temperature. |
| Mechanical Shock | No evidence of terminal peel off and wire broken. | Soldering on 1.0mm thick PCB, fixed in a 15cm cube (1.4Kg weight), natural fall from 0.5m height (X,Y,Z three axes). |
| Adhesion of terminal electrode | Strong bond between the pad and the core, without come off. | Soldering on base with 0.3mm solder paste at 2605 for 20s5s. Apply 10N pressure vertically to electrode for 101s. |
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