Compact 10 bit magnetic rotary position sensor AMS AS5050A BQFM with SPI interface and interrupt pin
Product Overview
The AS5050A is a low-power, 10-bit magnetic rotary position sensor designed for precise and reliable absolute angle measurement. It integrates a Hall element array, a high-resolution ADC, and a smart power management controller. The sensor communicates angle position, alarm bits, and magnetic field information via a 3-wire or 4-wire SPI interface. Available in a compact QFN 16-pin 4x4x0.85 mm package, it operates within a temperature range of -40C to 85C. Key benefits include very low power consumption (3A in low power mode), immunity to external magnetic stray fields, and an interrupt pin for new data availability, making it ideal for small and compact designs.
Product Attributes
- Brand: ams OSRAM
- Product Name: AS5050A
- Product Type: Low Power 10-Bit Magnetic Position Sensor
Technical Specifications
| Parameter | Conditions | Min | Typ | Max | Units | Description |
|---|---|---|---|---|---|---|
| DC Supply Voltage (VDD) | Operating | 3.0 | 3.6 | V | Analog and digital power supply | |
| Peripheral Supply Voltage (VDDp) | Operating | 1.8 | VDD | V | Peripheral power supply | |
| Input Pin Voltage (VIN) | Operating | -0.3 | VDDp + 0.3 | V | ||
| Ambient Operating Temperature | Operating | -40 | 85 | C | ||
| Current Consumption (Low Power Mode) | Activated POR | 33 | A | |||
| Current Consumption (Low Power Mode) | Deactivated POR | 3 | A | |||
| Current Consumption (Normal Mode) | 8.5 | mA | ||||
| Power Up Time | Minimum time after power up | 580 | s | Before sensor is operational | ||
| Readout Rate | Time between READ ANGLE command and INTERRUPT | 500 | s | |||
| Lateral Displacement Range (Rd) | Misalignment of magnet center to die center | 0.5 | mm | |||
| Magnetic Input Field (BZ) | 30 | 90 | mT | |||
| Integral Non Linearity (INL) | Using Bomatec 6x2.5 mm NdFeB magnet | -1.41 | 1.41 | deg | With max x/y-displacement radius of 250 m from package center | |
| High Level Input Voltage (VIH) | VDDp > 2.7V | 0.7 * VDDp | V | |||
| Low Level Input Voltage (VIL) | VDDp > 2.7V | 0.3 * VDDp | V | |||
| Low Level Input Voltage (VIL) | VDDp | 0.25 * VDDp | V | |||
| High Level Output Voltage (VOH) | VDDp - 0.5 | V | ||||
| Low Level Output Voltage (VOL) | VSS + 0.4 | V | ||||
| Capacitive Load (CL) | Digital pads | 35 | pF | |||
| Storage Temperature (Tstrg) | -55 | 125 | C | |||
| Package Body Temperature (TBODY) | Reflow peak soldering temperature | 260 | C | According to IPC/JEDEC J-STD-020 | ||
| Moisture Sensitive Level (MSL) | 3 | Represents max floor life time of 168h |
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