RUILON RL0805N104J3950H

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Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

This document outlines the reliability tests, packaging, storage, transportation, and recommended soldering technologies for Chip NTC Thermistors. These components are designed for applications requiring precise temperature sensing and stability under various environmental conditions.

Brand

RUILZ:N ELECTRONICS

Product Type

Chip NTC Thermistor

Item	Requirements	Test Methods and Remarks
Terminal Strength	No removal or split of the termination or other defects shall occur.	Solder the chip to the testing jig (glass epoxy board shown in Fig. 5.4.1-1) using eutectic solder. Then apply a force in the direction of the arrow. 2N force for 0603 series, 5N force for 1005 and 1608 series, 10N force for 2012 series. Keep time: 10+1s.
Resistance to Flexure	No visible mechanical damage.	Solder the chip to the test jig (glass epoxy board shown in Fig. 5.4.2-1) using a eutectic solder. Then apply a force in the direction shown in Fig. 5.4.2-2. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec.
Vibration	No visible mechanical damage.	Solder the chip to the testing jig (glass epoxy board shown in Fig. 5.4.3-1) using eutectic solder. The chip shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz. The frequency ranging from 10 to 55 Hz and returning to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours).
Dropping	No visible mechanical damage.	Drop chip inductor 10 times on a concrete floor from a height of 100.
Solderability	No visible mechanical damage. Wetting shall exceed 80% coverage.	Solder temperature: 240+2C. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight.
Resistance to Soldering Heat	No visible mechanical damage. R25 change: within +5%. B Constant change: within +2%.	Solder temperature: 260+3C. Duration: 5 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight. The chip shall be stabilized at normal condition for 1~2 hours before measuring.
Thermal Shock	No visible mechanical damage. R25 change: within +5%. B Constant change: within +2%.	Temperature: -55C 30 min. -> Ambient -> 125C 30 min. Transforming interval: 20sec. (max.). Tested cycle: 100 cycles. The chip shall be stabilized at normal condition for 1~2 hours before measuring.
Low Temperature	No visible mechanical damage. Resistance to R25 change: within +5%. Low B Constant change: within +2%.	Temperature: -55+2C. Duration: 1000* hours. The chip shall be stabilized at normal condition for 1~2 hours before measuring.
Resistance to High Temperature	No visible mechanical damage. R25 change: within +5%. B Constant change: within +2%.	Temperature: 125+2C. Duration: 1000* hours. The chip shall be stabilized at normal condition for 1~2 hours before measuring.
Damp Heat (Steady States)	No visible mechanical damage. R25 change: within +5%. B Constant change: within +2%.	Temperature: 60+2C. Humidity: 90% to 95% RH. Duration: 1000** hours. The chip shall be stabilized at normal condition for 1~2 hours before measuring.
Loading at High Temperature (Life Test)	No visible mechanical damage. R25 change: Within +5%. B constant change: Within +2%.	Temperature: 85+2C. Duration: 1000 hours. Applied current: Max. Permissive Operating Current. The chip shall be stabilized at normal condition for 1~2 hours before measuring.

Packaging Code	Type	T (mm)	Quantity
T	0603[0201]	0.30.05	15K
T	1005[0402]	0.50.15	10K
T	1608[0603]	0.80.15	4K
T	2012[0805]	0.850.2	4K

Type	A (mm)	B (mm)	P (mm)	Tmax (mm)
0603[0201]	0.400.1	0.700.1	2.00.05	0.55
1005[0402]	0.650.1	1.150.1	2.00.05	0.8
1608[0603]	1.00.2	1.80.2	4.00.1	1.1
2012[0805]	1.50.2	2.30.2	4.00.1	1.1

Storage Condition	Details
Humidity	Store at 40C or less and 70% RH or less.
Atmosphere	Avoid storage in environments exposed to dust or harmful gases (e.g., HCl, sulfurous gas of H2S).
Sunlight	Prevent exposure to direct sunlight to avoid deformation of packaging material.
Shelf Life	Solderability guaranteed for 3 months from the date of delivery under specified storage conditions. Parts exceeding 3 months should have solderability checked before use.

Parameter	Profile
Preheat Condition	150 ~200C/60~120sec.
Peak Temperature	260C max
Allowed Time Above 217C	60~90sec.
Max Time at Max Temp	10sec.
Solder Paste	Sn/3.0Ag/0.5Cu
Max Ramp Down Rate	6C/sec
Allowed Reflow Time	2x max 200C
Max Ramp Up Rate	3C/sec.