Silicon MEMS pressure sensor HAOBANG HI-TECH HBP401G101S6N with stable voltage output and SOP6 package
Product Overview
The HBP401 series is a silicon piezoresistive pressure sensor utilizing a MEMS pressure chip with a Wheatstone bridge structure. Four resistors are diffused on a circular silicon diaphragm. When force is applied, the crystal lattice deforms, altering carrier mobility and resistivity, resulting in a linear voltage output. This product offers good linearity, repeatability, stability, and high sensitivity. Customers can select standard amplification circuits like instrumentation amplifiers for output and temperature drift adjustment and compensation, achieving high-precision, stable, and reliable pressure measurements. The sensor is available in a standard SOP6 package for ease of use and has broad application prospects in healthcare, smart home appliances, and industrial control.
Product Attributes
- Brand: (Haobang)
- Origin: (Wuxi)
- Material: MEMS (Silicon Piezoresistive MEMS)
- Packaging: SOP6 (Standard SOP6)
Technical Specifications
| Feature | Specification | Notes |
|---|---|---|
| Technology | Silicon Piezoresistive MEMS | |
| Sensitivity | High | |
| Stability | High | |
| Pressure Range | -100kPa ~ +1000kPa (Gauge Pressure) | Optional ranges available |
| Operating Conditions (for Table 1 data) | Measurement Medium: Air; Atmospheric Pressure: (101325500)Pa; Temperature: (252)C; Vibration: <0.1g(1m/s); Humidity: (50%10%) RH; Constant Current Test: DC (10.001)mA; Constant Voltage Test: DC (50.005)V | Unless otherwise specified |
| SMT Reflow Soldering Temperature Curve | See Figure 4 | |
| SMT Reflow Soldering Parameters (Lead-free) | Max Heating Rate (TSMAX to TP): 3C/sec; Preheat Min Temp (TSMIN): 150C; Preheat Max Temp (TSMAX): 200C; Preheat Time (ts): 60-180 sec; Reflow Temp (TL): 217C; Reflow Time (tL): 60-150 sec; Peak Temp (TP): 260C; Peak Temp +/-5C Hold Time (tP): 20-40 sec; Cooling Rate (TP to TSMAX): Max 6C/sec; Time from 25C to Peak Temp: Max 8 min | See Table 3 |
| SMT Reflow Soldering Recommendations | Minimize external heat; Use non-corrosive rosin flux; Avoid flux intrusion; Max 3 reflow cycles recommended | |
| Cleaning Precautions | Avoid cleaning agent intrusion; Do not expose to ultrasonic treatment | To prevent damage and performance degradation |
| Pin Definitions (Example - refer to Figure 2 and Table 2 for full details) | Pin 1: GND, Pin 2: Vout-, Pin 3: NC, Pin 4: VDD, Pin 5: Vout+, Pin 6: GND | Definitions may vary (see Table 2 for alternative definitions) |
| Reference Amplification Circuit | Constant current or constant voltage drive | Refer to Figure 3 for circuit diagram |
| Customization Services | Available for different ranges, package sizes, and application areas | Contact info@haobang-smt.com for details |
| Version History | 1.0: Initial Release (June 2022); 1.1: Updated Pin Definitions (September 2023) |
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