stable pressure sensor HAOBANG HI-TECH HBP1101D201GPS6-2 with digital output and compact SOP6 package design
Product Overview
The HBP1101D-2 series is a highly integrated, stable, and reliable pressure sensor module from Haobang Gaoke. It combines a MEMS pressure sensor chip with high-performance conditioning circuitry. Stored calibration coefficients in OTP enable product calibration, with pressure calibration and temperature compensation automatically performed by the test system. Calibrated pressure and temperature are outputted via digital I2C. The HBP1101D-2 features a standard SOP6 single-port package, offering a compact and user-friendly design for high-performance, stable, and reliable pressure measurements. It is suitable for non-corrosive gas differential pressure detection and has broad application prospects in healthcare, smart home appliances, and industrial control.
Product Attributes
- Brand: Haobang Gaoke ()
- Origin: Wuxi, China ()
- Material: MEMS silicon piezoresistive technology
- Packaging: SOP6
- Certifications: Not specified in the text
Technical Specifications
| Parameter | Condition | Min | Typical | Max | Unit | Notes |
|---|---|---|---|---|---|---|
| Absolute Maximum Ratings | ||||||
| Supply Voltage | -0.3 | 6.5 | V | |||
| Digital Pin Voltage | 25C | -0.3 | Vdd | +0.3 | V | |
| Overload Pressure | 2 x Rated Pressure | |||||
| Burst Pressure | 3 x Rated Pressure | |||||
| ESD (HBM) | 2 | kV | ||||
| Storage Temperature | -40 | 125 | C | |||
| Medium | Non-corrosive gas or liquid | |||||
| Basic Performance Indicators | ||||||
| Supply Voltage | 1.8 | 5 | 5.5 | V | Optional supply voltage | |
| Measurement Range | Range selectable | -100 | 2000 | kPa | ||
| Accuracy | Accuracy selectable | 0.5 | %FS | |||
| Zero Temperature Drift | 0.035 | %FS/C | ||||
| Full Scale Temperature Drift | 0.035 | %FS/C | ||||
| Compensation Temperature | Temperature selectable | 0 | 0-60 | 85 | C | |
| Operating Temperature | Temperature selectable | -20 | 0-60 | 85 | C | |
| Long-term Stability | 1 Year | 0.5 | %FS | |||
| I2C Communication Timing | ||||||
| SCL Clock Frequency | 400 | kHz | ||||
| SCL Low Pulse Time | 1.3 | s | ||||
| SCL High Pulse Time | 0.6 | s | ||||
| SDA Setup Time | 0.1 | s | ||||
| SDA Hold Time | 0 | s | ||||
| Repeated Start Setup Time | 0.6 | s | ||||
| Start Hold Time | 0.6 | s | ||||
| Stop Setup Time | 0.6 | s | ||||
| Bus Idle Time | 1.3 | s | Before new transmission | |||
| Reflow Soldering Parameters (Lead-free) | ||||||
| Average Heating Rate (TSMAX to TP) | Max | 3 | C/sec | |||
| Preheat Zone Min Temp (TSMIN) | 150 | C | ||||
| Preheat Zone Max Temp (TSMAX) | 200 | C | ||||
| Preheat Time (tS) (TSMIN to TSMAX) | 60 | 180 | sec | |||
| Reflow Zone Temp (TL) | 217 | C | ||||
| Reflow Zone Time (tL) | 60 | 150 | sec | |||
| Peak Temp (TP) | 260 | C | ||||
| Peak Temp Holding Time (tP) | TP 5C | 20 | 40 | sec | ||
| Ramp-down Rate (TP to TSMAX) | Max | 6 | C/sec | |||
| Time from 25C to Peak Temp | Max | 8 | min | |||
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