MEMS Pressure Sensor HAOBANG HI-TECH HBP411G101D6R with Standard DIP6 Package and Stable Linear Voltage Output
Product Overview
The HBP411 series is a piezoresistive MEMS pressure sensor utilizing a Wheatstone bridge structure. Four resistors are diffused onto a circular silicon diaphragm. When force is applied, the silicon crystal deforms, altering carrier mobility and thus resistivity, resulting in a linear voltage output. This product offers good linearity, repeatability, stability, and high sensitivity. Customers can use standard amplifier circuits for signal amplification and compensation to achieve high-precision, stable, and reliable pressure measurements. Available in a standard DIP6 package, it is suitable for non-corrosive gas and liquid pressure detection in medical, smart home, and industrial control applications.
Product Attributes
- Brand: (Haobang)
- Origin: (Wuxi)
- Technology: MEMS (Silicon Piezoresistive MEMS)
- Packaging: DIP6 (Standard DIP6)
Technical Specifications
| Feature | Specification |
|---|---|
| Technology | Silicon Piezoresistive MEMS |
| Sensitivity | High |
| Stability | High |
| Measurement Range | -100kPa ~ +1000kPa (Gauge Pressure, selectable) |
| Package | Standard DIP6 |
| Applicable Media | Non-corrosive gases or liquids |
| Application Areas | Smart home appliances (coffee machines, beer dispensers, vacuum cleaners), Medical devices (blood pressure monitors, ventilators, oxygen concentrators), Healthcare equipment (air mattresses, massage chairs), Industrial control (pressure instruments, pneumatic systems) |
| Output Type | Linear voltage output |
| Sensor Structure | Wheatstone bridge on circular silicon diaphragm |
| Amplification | Requires external amplifier circuit (e.g., instrumentation amplifier) for signal conditioning and compensation |
| Operating Conditions (for basic performance data) | Medium: Air; Atmospheric Pressure: (101325500)Pa; Temperature: (252)C; Vibration: <0.1g (1m/s); Humidity: (50%10%) RH; Constant Current Test: (10.001)mA DC; Constant Voltage Test: (50.005)VDC |
| Reflow Soldering Curve Parameters | Max heating rate: 3C/sec; Preheat min temp: 150C; Preheat max temp: 200C; Preheat time (tS): 60-180 sec; Reflow temp (TL): 217C; Reflow time (tL): 60-150 sec; Peak temp (TP): 260C; Peak temp holding time (tP): 20-40 sec; Max cooling rate: 6C/sec; Time from 25C to peak temp: Max 8 min |
| Reflow Soldering Recommendations | Max 3 reflow cycles; Use non-corrosive rosin flux; Avoid flux ingress; Avoid ultrasonic cleaning or exposure to cleaning agents that may damage the product. |
| Pressure Conversion | 10kPa=100hPa=100mBar75mmHg100mmH2O1.45PSI |
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