pressure sensor HAOBANG HI-TECH HBP411G201D6 featuring standard DIP6 packaging and linear voltage output
Product Overview
The HBP411 series is a piezoresistive MEMS pressure sensor utilizing a Wheatstone bridge structure. Four resistors are diffused onto a circular silicon diaphragm. When force is applied, the silicon crystal deforms, altering carrier mobility and thus resistivity, resulting in a linear voltage output. This product offers good linearity, repeatability, stability, and high sensitivity. Customers can utilize standard amplification circuits like instrumentation amplifiers for signal adjustment and compensation, achieving high-precision, stable, and reliable pressure measurements. The sensor is available in a standard DIP6 package for ease of use and is suitable for non-corrosive gas pressure detection in medical healthcare, smart home appliances, and industrial control applications.
Product Attributes
- Brand: (Haobang Gaoke)
- Origin: (Wuxi)
- Technology: MEMS (Piezoresistive MEMS)
- Packaging: DIP6 (Standard DIP6)
Technical Specifications
| Feature | Value | Notes |
|---|---|---|
| Sensing Technology | Piezoresistive MEMS | |
| Sensitivity | High | |
| Stability | High | |
| Measurement Range | -100kPa ~ +1000kPa selectable | Gauge pressure |
| Applicable Media | Non-corrosive gases or liquids | |
| Operating Temperature | 252C | Standard test condition |
| Humidity | 50%10% RH | Standard test condition |
| Drive Method | Constant current or constant voltage | Customer selectable |
| Reflow Soldering Peak Temperature (TP) | 260C | +/-5C tolerance |
| Reflow Soldering Time at Peak Temp (tP) | 20~40 seconds | |
| Reflow Soldering Max Heating Rate (TSMAX to TP) | 3C/sec | |
| Reflow Soldering Max Cooling Rate (TP to TSMAX) | 6C/sec | |
| Max Reflow Soldering Cycles | 3 | Recommended |
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.