Standard SOP6 packaged HAOBANG HI-TECH HBP401G040S6N silicon MEMS pressure sensor for smart home and industrial automation
Product Overview
The HBP401 series is a silicon piezoresistive pressure sensor utilizing a MEMS pressure chip with a Wheatstone bridge structure. Four resistors are diffused onto a circular silicon diaphragm. When force is applied, the crystal lattice deforms, altering carrier mobility and resistivity, resulting in a linear voltage output. This sensor offers good linearity, repeatability, stability, and high sensitivity. Customers can integrate standard amplification circuits for output and temperature drift compensation to achieve high-precision, stable, and reliable pressure measurements. The product uses a standard SOP6 package for ease of use and has broad application prospects in healthcare, smart home appliances, and industrial control.
Product Attributes
- Brand: (Haobang)
- Origin: (Wuxi)
- Material: Silicon piezoresistive MEMS
Technical Specifications
| Feature | Specification | Notes |
|---|---|---|
| Technology | Silicon Piezoresistive MEMS | |
| Sensitivity & Stability | High | |
| Measurement Range | -100kPa ~ +1000kPa (gauge pressure) | Selectable ranges |
| Package | Standard SOP6 | Easy to use, high integration |
| Application Areas | Smart Home Appliances, Medical Machinery, Automotive, Industrial Pressure Control | e.g., Coffee machines, blood pressure monitors, tire gauges, pneumatic systems |
| Pressure Sensor Type | MEMS Pressure Chip with Wheatstone Bridge | |
| Output Signal | Linear voltage output | Requires amplification and compensation for high precision |
| Operating Conditions (for Table 1 data) | Measuring medium: Air; Atmospheric pressure: (101325500)Pa; Temperature: (252)C; Vibration: <0.1g (1m/s); Humidity: (50%10%) RH; Constant current test: DC (10.001)mA; Constant voltage test: DC (50.005)V | |
| Reflow Soldering Curve | Refer to Figure 4 | Max heating rate: 3C/s; Preheating temp: 150-200C; Reflow temp: 217C; Peak temp: 260C |
| Reflow Soldering Parameters | Preheating time (ts): 60-180s; Reflow time (tL): 60-150s; Peak temp hold time (tP): 20-40s; Cooling rate: Max 6C/s; Total time from 25C to peak: Max 8 mins | Lead-free |
| Recommended Reflow Cycles | Max 3 times | |
| Pressure Conversion | 10kPa = 100hPa = 100mBar 75mmHg 100mmH2O 1.45PSI |
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