SPI interface digital temperature sensor MICROCHIP TC77-5.0MCTTR designed for and high accuracy cases

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Product Description

Product Overview

The TC77 is a serially accessible digital temperature sensor designed for low-cost, small-form-factor applications. It outputs temperature as a 13-bit digital word via a SPI and MICROWIRE compatible interface. Key advantages include high accuracy over a wide temperature range, low power consumption in both continuous conversion and shutdown modes, and ease of use, making it an ideal solution for thermal management in various systems.

Product Attributes

Brand: Microchip Technology Inc.
Origin: Not specified
Material: Not specified
Color: Not specified
Certifications: Not specified

Technical Specifications

Parameter	Symbol	Min	Typ	Max	Units	Conditions
Absolute Maximum Ratings
VDD				6.0	V
All inputs and outputs w.r.t. VSS		-0.3		VDD + 0.3	V
Storage temperature		-65		+150	C
Ambient temp. with power applied		-55		+125	C
Junction Temperature				150	C
ESD protection (HBM)		>4			kV
ESD protection (MM)		>200			V
DC Characteristics
Operating Voltage Range	VDD	2.7		5.5	V	Note 1
Operating Current (Continuous Conversion)	IDD		250	400	A
Power-On Reset Threshold	VPOR	1.2	1.6	2.2	V	VDD falling or rising edge
Standby Supply Current (Shutdown Mode)	IDD- STANDBY		0.1	1.0	A
Converter Resolution			13		Bits	LSb = 0.0625C/bit
Temperature Conversion Time	tCT		300	400	ms
Temperature Accuracy	TERR	-1.0		+1.0	C	+25C < TA < +65C
		-2.0		+2.0		-40C < TA < +85C
		-3.0		+3.0		-55C < TA < +125C
Digital Input/Output
High Level Input Voltage	VIH	0.7 VDD		VDD + 0.3	V
Low Level Input Voltage	VIL	-0.3		0.3 VDD	V
High Level Output Voltage	VOH	2.4			V	IOH = -400 A
Low Level Output Voltage	VOL			0.4	V	IOL = +2 mA
Input Current	IIN(0), IIN(1)	-1.0		+1.0	A	VIN = GND or VDD
Input Hysteresis		0.35	0.8		V
Pin Capacitance	CIN, COUT		20		pF
Tri-state Output Leakage Current	IO_LEAK	-1.0		+1.0	A	VO = GND or VDD
Serial Port AC Timing
Clock Frequency	fCLK			7.0	MHz
CS Fall to First Rising SCK Edge	tCS-SCK	100			ns
CS Low to Data Out Delay	tCS-SI/O			70	ns
SCK Fall to Data Out Delay	tDO			100	ns
CS High to Data Out Tri-state	tDIS			200	ns
SCK High to Data In Hold Time	tHD	50			ns
Data In Set-up Time	tSU	30			ns
Thermal Package Resistance
Thermal Resistance (SOT23-5)	JA		230		C/W
Thermal Resistance (8L-SOIC)	JA		163		C/W