NTC thermistor chip RESI TCTR0805F47K0F3960T featuring glass insulation and high temperature accuracy for industrial control
NTC Thermistor Chip - TCTR Series
The TCTR series NTC chip thermistor, manufactured using the 3rd generation thick-film sintering process, offers high reliability and high temperature detection accuracy. Designed to meet AEC-Q200 automotive standards, these thermistors are suitable for demanding applications.
Product Advantages
- 3rd generation thick-film sintering process for high reliability.
- High temperature detection accuracy, meeting AEC-Q200 automotive standards.
- Glass insulation protective layer.
- High purity alumina substrate.
- Special end electrode structure to release mechanical stress from thermal shock and PCB bending.
- Fast thermal response time (as low as 2s).
- Minimal thermal shock from soldering.
Applications
- Automotive Electronics
- Medical Devices
- Industrial Control Equipment
- Smart Home Appliances
Product Attributes
- Brand: CBE ()
- Origin: Shenzhen, China
- Certifications: AEC-Q200, some models comply with UL2459
Technical Specifications
| Series | Size | Resistance Range (25) | B Value Range (25/85) | Resistance Tolerance | B Value Tolerance | Operating Temperature Range | Max. Operating Power | Dissipation Factor () | Thermal Time Constant () |
|---|---|---|---|---|---|---|---|---|---|
| TCTR0805 | 0805 | 1K ~ 1M | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40 ~ +125 | 120mW | ~1.1mW/ | ~1.5sec |
| TCTR0603 | 0603 | 1K ~ 1M | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40 ~ +125 | 110mW | ~1.2mW/ | ~2.0sec |
| TCTR0402 | 0402 | 1K ~ 1M | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40 ~ +125 | 5mW | ~1.5mW/ | ~5.0sec |
Part Numbering Scheme Example: TCTR0805J1K00H3200T
TCTR (Series) | 0805 (Size) | J (Resistance Tolerance 5%) | 1K00 (Resistance 1000) | H (B Value Tolerance 3%) | 3200 (B Value 3200K) | T (Standard Product)
Performance Indicators
| Test Item | Test Method | Standard | Requirement |
|---|---|---|---|
| High Temperature Storage | +125, 1000 hours | IEC 60068-2-2 | R4% |
| High Temp/High Humidity Storage | +85, 85%RH, 1000 hours | IEC 60068-2-3 | R4% |
| Vibration | 10-66Hz, Amplitude 1.6mm peak-peak | IEC 60068-2-6 | R4% |
| Solder Heat Resistance | +260, 10 sec. | IEC 60068-2-21 | R3% |
| Solderability | Min. solderable area 95% | IEC 60068-2-20 | R4% |
| Temperature Cycling | -55 to +125, 1000 cycles | IEC 60068-2-14 | R4% |
| PCB Bending Test | 6mm, 20s | IEC 60068-2-21 | R4% |
| Low Temperature Storage | -55, 1000 hours | IEC 60068-2-1 | R4% |
Soldering Temperature Curve
Reflow Soldering Curve (Sn-Ag-Cu): Preheat: +150 to +200, 60-180sec. Peak Temp: +265, 10 sec. Max Temp: +275 within 30 sec. (Max 3 cycles)
Wave Soldering Curve (Sn-Ag-Cu): Preheat: +150 to +200, 60-180sec. Peak Temp: +265, 10 sec. Max Temp: +275 within 30 sec. (Max 4 cycles)
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