Compact 8 pin DIP Sensata 66L070-0516 thermostat designed for printed circuit boards and auto insertion
Product Overview
The Airpax 6600 series is a RoHS compliant, positive snap action, single pole/single throw, sub-miniature bimetallic thermostat designed for accurate and reliable sensing and switching. Conforming to the 8-pin DIP international product package standard, it is ideal for printed circuit boards, conserving space and enabling auto-insertion. The device is sealed for wave soldering and board washing, offering fast, positive response with excellent repeatability. It features a switch capability up to 1 amp for 48 VDC or 120 VAC, and low-level switching down to 0.020 A at 5 VDC for 100,000 cycles. Temperature is factory pre-set and non-adjustable. Applications include computers, computer peripherals, aircraft, automotive, and test equipment, with typical uses such as indicator lights, audible alarms, or system shutdown.
Product Attributes
- Brand: Airpax
- Certifications: cus recognized E36687, VDE approval 40028966
- Compliance: RoHS compliant per EU directive 2002/95/EC
- Package Standard: 8-pin DIP (N8A Dual Inline Package)
- Seal: High temperature epoxy sealed, moisture proof
- Base Material: PPS (Polyphenylene Sulfide), 94 VO rated
- Terminal Material: 65% Copper, 18% Nickel
- Contact Material: Gold-plated or overlay, silver crossbar
- Chemical Resistance: Resistant to water, salt, alcohol, ammonia, trichlorethane and most other organic solvents
Technical Specifications
| Specification | Details |
| Contact Resistance | 50 milliohms max (before and after rated life) |
| Contact Ratings | Cycles: 25,000 (48 VDC, 1.0A), 30,000 (120 VAC, 1.0A), 100,000 (5 VDC, 0.02A) |
| Contact Operations | Either close on rise (make) or open on rise (break) |
| Operating Temperature | 40C to 120C (104F to 248F) |
| Temperature Tolerance | Standard of 5C (9F) |
| Short Term Exposure Limit | 260C (500F), 10 seconds |
| Long Term Exposure Limit | -55C to 160C (-67F to 320F) |
| Dielectric Strength | 1480 VAC 60Hz, 1 second (terminals to case) |
| Insulation Resistance | 100 Mohms at 500 VDC |
| Contact Bounce | 3 milliseconds max (make) |
| Vibration | Per Mil-Std-202, method 204D, test condition D (10 to 2,000 Hz) |
| Shock | Per Mil-Std-202, method 213, test condition C (100 Gs for 6 ms) |
| Soldering Heat Resistance | Per Mil-Std-202F, method 210A, test condition E |
| Weight | Approximately 0.45 grams |
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